CN107002226B - 制备具有改善的耐磨性的双层涂布的切割工具的方法 - Google Patents

制备具有改善的耐磨性的双层涂布的切割工具的方法 Download PDF

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CN107002226B
CN107002226B CN201580051021.9A CN201580051021A CN107002226B CN 107002226 B CN107002226 B CN 107002226B CN 201580051021 A CN201580051021 A CN 201580051021A CN 107002226 B CN107002226 B CN 107002226B
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coating
magnetron sputtering
sputtering process
negative bias
tialn
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CN107002226A (zh
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D·库拉波夫
T·萨萨基
S·科塞基
K·莫里斯塔
S·B·阿布苏里克
K·伊诺伊
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Oerlikon Surface Solutions AG Pfaeffikon
Moldino Tool Engineering Ltd
Proterial Ltd
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Mitsubishi Hitachi Tool Engineering Ltd
Hitachi Metals Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3435—Applying energy to the substrate during sputtering
    • C23C14/345—Applying energy to the substrate during sputtering using substrate bias
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3485—Sputtering using pulsed power to the target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3492—Variation of parameters during sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

一种制备涂布有硬涂层的工具的方法，所述方法包括以下步骤：采用第一磁控溅射工艺将TiAlN涂层施加到基体上和采用第二磁控溅射工艺将TixSi1‑xN涂层施加到所述TiAlN层上，其中x小于或等于0.85，优选在0.80至0.70之间，包括0.80和0.70；而所述第二磁控溅射工艺采用大于100W/cm2的功率密度来实施且本身为一种HIPIMS工艺。

Description

制备具有改善的耐磨性的双层涂布的切割工具的方法
本发明涉及具有改善的耐磨性的双层涂布的切割工具，所述切割工具用于切割金属材料。
现有技术
对于更高效的切割，特别对切割速率和工具使用寿命方面具有不断提高的需求。之前，诸如TiN和/或TiCN的硬涂层材料已经被TiAlN所代替，以改善例如铣削刀具(endmills)和镶嵌件(inserts)的耐磨性。
为了进一步提高这些涂层的性能(efficiency)，日本专利2,793,773建议向TiAlN中加入Si。
然而，仅仅含有Si的涂层膜较脆，并且由于压应力的增加，在涂层膜形成之后，其可能立即便从切割工具中剥落。
EP 1174528A2描述并解决了这个问题，其公开了含Si膜需要与另一种对基体具有优异粘合性的硬涂层膜结合使用。此外，所述含Si膜为成分分离(composition-segregated)的多晶膜，包含具有较高Si浓度的相和具有较低Si浓度的相。
尽管EP 1174528A2中所描述的方案展现了优异的结果，但非常遗憾的是，到目前为止，已知这种相分离也仅通过电弧放电离子电镀实现。已知反应性电弧放电涂布方法存在液滴(droplets)的问题。它们使得涂层较为粗糙。这对于常规尺寸工具来说是个较小问题。但是，对于小的工具，例如具有2微米以下直径的铣削刀具，表面粗糙度可能导致工具在使用过程中被损坏。另一个缺陷是，与送料靶中的Si含量(Si contend in the materialdelivering target)比较，在采用电弧放电离子电镀法制得的层中Si含量较低。由于非常难以制备具有高Si含量的稳定靶，在层内的Si的可能浓度低于15at％。
因此，需要得到至少与EP 1174528A2的相分离膜一样的良好改善，但又不产生液滴的问题，从而可能产生光滑的涂层的涂布方法。
发明目的
因此，本发明的目的是公开一种涂布方法，所述方法得到至少与EP1174528A2的相分离膜一样的良好改善，但又不产生液滴的问题，从而可能产生光滑的涂层的涂布方法。
本发明的技术方案
大致地描述磁控溅射的原理会有助于更好地理解本发明的技术方案。
在溅射过程中，离子轰击靶(阴极)，结果是将材料从靶上移除。离子从等离子体朝向靶表面方向的加速借助于电场中得以实现。在磁控溅射过程中，在靶表面上形成磁场。在这种方式中，等离子体中的电子被强制进入螺旋形轨道，并围绕在靶表面上循环。由于其轨道增加，与原子发生碰撞的电子的数量急剧增加，这导致在靶表面上的此区域中更高的离子化。这又导致靶上增加的溅射去除，由此导致提高的溅射速率。常规的溅射以DC模式且在通常为20W/cm2的功率密度下实施。这种常规溅射的缺陷是从靶移除的材料仅离子化至非常低的程度。这意味着施加到基体上的负偏压不会直接加速朝向基体的溅射材料。因此，相比于采用电弧放电离子电镀可实现的涂布密度，采用常规溅射可达到的涂布密度要低得多。
HIPIMS(高功率脉冲磁控溅射)是发展自常规溅射的工艺，该工艺使用类似于脉冲的放电效果，脉冲持续时间为微秒到毫秒，功率密度大于100W/cm2。已经表明，取决于材料，HIPIMS技术可获得高达100％溅射颗粒的离子化，由此消除了常规溅射的极大不利因素。
本发明的方法涉及HIPIMS溅射，包括以下步骤：
-采用第一磁控溅射工艺将TiAlN涂层施加到基体上；
-采用第二磁控溅射工艺将TixSi1-xN涂层施加到所述TiAlN层上，其中x小于或等于0.85，优选在0.80至0.70之间，包括0.80和0.70；
其特征在于，所述第二磁控溅射工艺采用大于100W/cm2的功率密度来实施，本身为一种HIPIMS方法。
相应地所得到的层不会显示任何相分离。令人惊讶的是，相对于采用电弧放电离子电镀法涂布并产生如EP 1174528A2中所述的相分离的相同工具来说，根据上述方法涂布的工具显示出相当的性能或有时甚至更好的性能。
采用不同的涂布参数进行大量双层涂层的涂布。为了进行TiAlN层的溅射，例如选择Ti∶Al浓度比为40at％∶60at％的靶。
在TiSiN层内，一个变化的重要参数是用于溅射所述TiSiN层的溅射靶内的Si含量。实验显示在该层内的高Si含量是优选的。涂布TixSi1-xN层(x＝0.75)显示最佳的结果。
另一个重要的参数是涂布过程中的基体的偏压。通常来说，只要实施HIPIMS工艺，在这种工艺过程中施加的高偏压是有利的。然而，对于TixSi1-x来说，应该仔细选择偏压使得其弱于-150V，原因是对于这些偏压值，所述工具显示出相当的耐磨性。
因此，根据本发明一个优选的实施方案，在向基体施加负偏压时实施所述第二磁控溅射工艺，其中所述负偏压的值为-60V至-100V，包括-60V和-100V，特别优选所述负偏压的值为-70V至-80V，包括-70V和-80V。
根据本发明的另一个优选的实施方案，所述第一磁控溅射工艺也为HIPIMS工艺。在这种情况下，特别优选的是在向基体施加负偏压时实施所述第一磁控溅射工艺，其中所述负偏压的值为-40V至-70V，包括-40V和-70V。

Claims (8)

1.一种制备涂布有硬涂层的工具的方法，所述方法包括以下步骤：
-采用第一磁控溅射工艺将TiAlN涂层施加到基体上；
-采用第二磁控溅射工艺将TixSi1-xN涂层施加到所述TiAlN涂层上，其中x在0.80至0.70之间，包括0.80和0.70；
其中所述第二磁控溅射工艺采用大于100W/cm2的功率密度来实施且本身为一种HIPIMS工艺，所述方法的特征在于，所述涂布的工具被制成具有仅一个双层涂层，其由设置在所述TiAlN涂层上的所述TixSi1-xN涂层形成。
2.根据权利要求1的方法，其特征在于，所述TixSi1-xN涂层和TiAlN涂层不显示任何相分离。
3.根据权利要求1或2的方法，其特征在于，选择Ti∶Al浓度比为40at％∶60at％的靶进行TiAlN涂层的溅射。
4.根据权利要求1或2的方法，其特征在于，x＝0.75。
5.根据权利要求1或2的方法，其特征在于，在向基体施加负偏压时实施所述第二磁控溅射工艺，其中所述负偏压的值为-60V至-100V，包括-60V和-100V。
6.根据权利要求5的方法，其特征在于，所述施加的负偏压的值为-70V至-80V，包括-70V和-80V。
7.根据权利要求1或2的方法，其特征在于，所述第一磁控溅射工艺也为HIPIMS工艺。
8.根据权利要求7的方法，其特征在于，在向基体施加负偏压时实施所述第一磁控溅射工艺，其中所述负偏压的值为-40V至-70V，包括-40V和-70V。
CN201580051021.9A 2014-09-17 2015-09-17 制备具有改善的耐磨性的双层涂布的切割工具的方法 Active CN107002226B (zh)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101517122A (zh) * 2006-09-29 2009-08-26 弗兰霍菲尔运输应用研究公司 用于沉积氧化物层到太阳能电池的吸收体上的方法、太阳能电池和该方法的用途

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3625848A (en) * 1968-12-26 1971-12-07 Alvin A Snaper Arc deposition process and apparatus
DE4017111C2 (de) * 1990-05-28 1998-01-29 Hauzer Holding Lichtbogen-Magnetron-Vorrichtung
JP2793773B2 (ja) 1994-05-13 1998-09-03 神鋼コベルコツール株式会社 耐摩耗性に優れた硬質皮膜、硬質皮膜被覆工具及び硬質皮膜被覆部材
JP3417907B2 (ja) 2000-07-13 2003-06-16 日立ツール株式会社 多層皮膜被覆工具
JP2007084899A (ja) * 2005-09-26 2007-04-05 Hitachi Tool Engineering Ltd 被覆部材、被覆部材の被覆方法
US8304098B2 (en) * 2007-10-12 2012-11-06 Hitachi Tool Engineering, Ltd. Hard-coated member, and its production method
DE102011117994A1 (de) * 2011-11-09 2013-05-16 Oerlikon Trading Ag, Trübbach HIPIMS-Schichten
CN103382548B (zh) 2013-06-27 2016-05-11 中国科学院宁波材料技术与工程研究所 一种基体表面纳米复合Me-Si-N超硬涂层的制备方法
NO2785538T3 (zh) * 2014-05-07 2018-08-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101517122A (zh) * 2006-09-29 2009-08-26 弗兰霍菲尔运输应用研究公司 用于沉积氧化物层到太阳能电池的吸收体上的方法、太阳能电池和该方法的用途

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"Hard turning using HiPIMS-coated carbide tools: Wear behavior under dry and minimum quantity lubrication(MQL)";Satish Chinchanikar et al.;《Measurement》;20140619;第55卷;第536-548页 *

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JP6899322B2 (ja) 2021-07-07
EP3212819B1 (en) 2023-03-29
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CN107002226A (zh) 2017-08-01
EP3212819A1 (en) 2017-09-06
US10626493B2 (en) 2020-04-21
ES2946664T3 (es) 2023-07-24
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