JP6899322B2 - 改善された耐摩耗性を有する2層コーティングされた切削工具を製造するための方法 - Google Patents
改善された耐摩耗性を有する2層コーティングされた切削工具を製造するための方法 Download PDFInfo
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- JP6899322B2 JP6899322B2 JP2017514501A JP2017514501A JP6899322B2 JP 6899322 B2 JP6899322 B2 JP 6899322B2 JP 2017514501 A JP2017514501 A JP 2017514501A JP 2017514501 A JP2017514501 A JP 2017514501A JP 6899322 B2 JP6899322 B2 JP 6899322B2
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3435—Applying energy to the substrate during sputtering
- C23C14/345—Applying energy to the substrate during sputtering using substrate bias
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3485—Sputtering using pulsed power to the target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3492—Variation of parameters during sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Cutting Tools, Boring Holders, And Turrets (AREA)
- Chemical Vapour Deposition (AREA)
Description
特に切削速度および工具寿命に関して、切削の高効率化のための必要性が高まっている。TiNおよび/またはTiCNのような以前のハードコーティング材料は、たとえば、エンドミルおよびインサートなどの耐摩耗性を向上させるために、TiAlNによって置換えられている。
したがって、液滴の問題に遭遇せず、このため滑らかなコーティング層を潜在的にもたらす、欧州特許出願公開第1174528A2号の相分離された膜と少なくとも同程度の良好な改善をもたらすコーティング方法を開示することが本発明の目的である。
本発明による解決策を理解するためには、マグネトロンスパッタリング法の原理を大まかに記述することが有用である。
第1のマグネトロンスパッタリングプロセスで基板上にTiAlNコーティング層を施すステップと、
TixSi1−xNコーティング層をTiAlN層に第2のマグネトロンスパッタリングプロセスを用いて施すステップとを含み、xは、0.85以下であり、好ましくは、0.80〜0.70の範囲内であり、
第2のマグネトロンスパッタリングプロセスは、100W/cm2よりも大きい電力密度で、それ自体がHIPIMS法で行われることを特徴とする。
Claims (7)
- ハードコーティングで被覆された工具を製造するための方法であって、前記方法は、
TiAlNコーティング層を基板上に第1のマグネトロンスパッタリングプロセスを用いて施すステップと、
TixSi1−xNコーティング層を前記TiAlN層上に第2のマグネトロンスパッタリングプロセスを用いて施すステップとを備え、xは0.80〜0.70の範囲内であり、
前記第2のマグネトロンスパッタリングプロセスは、100W/cm2よりも大きい電力密度で、それ自体がHIPIMSプロセスで行われ、
前記TiAlNコーティング層と前記TixSi1−xNコーティング層とを施すことにより2層コーティングが施され、これにより2層コーティングの工具が製造され、
前記第2のマグネトロンスパッタリングプロセスは、−60V〜−100Vの範囲内の値で、前記基板に負のバイアスを印加する間に行われることを特徴とする、方法。 - 前記TiAlNコーティング層のスパッタリングのために、40at%〜60at%のTi:Alの濃度を有するターゲットが選択される、請求項1に記載の方法。
- x=0.75であることを特徴とする、請求項1または請求項2に記載の方法。
- 前記負のバイアスは、−70V〜−80Vの範囲内の値で印加される、請求項3に記載の方法。
- 前記第1のマグネトロンスパッタリングプロセスもまた、HIPIMSプロセスであることを特徴とする、請求項1から請求項4のいずれかに記載の方法。
- 前記第1のマグネトロンスパッタリングプロセスは、−40V〜−70Vの範囲内の値での負のバイアスを前記基板に印加する間に行われることを特徴とする、請求項5に記載の方法。
- 前記HIPIMSプロセスは、100W/cm2よりも大きい電力密度でマイクロ秒からミリ秒の範囲のインパルス持続時間を有する放電の効果を利用することを特徴とする、請求項1に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US201462051456P | 2014-09-17 | 2014-09-17 | |
US62/051,456 | 2014-09-17 | ||
PCT/EP2015/071318 WO2016042072A1 (en) | 2014-09-17 | 2015-09-17 | Method for producing a double-layer coated cutting tool with improved wear resistance |
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JP2020208655A Division JP7187525B2 (ja) | 2014-09-17 | 2020-12-16 | 改善された耐摩耗性を有する2層コーティングされた切削工具を製造するための方法 |
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JP2017529459A JP2017529459A (ja) | 2017-10-05 |
JP2017529459A5 JP2017529459A5 (ja) | 2018-06-28 |
JP6899322B2 true JP6899322B2 (ja) | 2021-07-07 |
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JP2017514501A Active JP6899322B2 (ja) | 2014-09-17 | 2015-09-17 | 改善された耐摩耗性を有する2層コーティングされた切削工具を製造するための方法 |
JP2020208655A Active JP7187525B2 (ja) | 2014-09-17 | 2020-12-16 | 改善された耐摩耗性を有する2層コーティングされた切削工具を製造するための方法 |
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US (1) | US10626493B2 (ja) |
EP (1) | EP3212819B1 (ja) |
JP (2) | JP6899322B2 (ja) |
KR (1) | KR102422356B1 (ja) |
CN (1) | CN107002226B (ja) |
ES (1) | ES2946664T3 (ja) |
HU (1) | HUE061930T2 (ja) |
PL (1) | PL3212819T3 (ja) |
WO (1) | WO2016042072A1 (ja) |
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JP6666431B2 (ja) * | 2016-04-14 | 2020-03-13 | 住友電気工業株式会社 | 硬質被膜および切削工具 |
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US3625848A (en) * | 1968-12-26 | 1971-12-07 | Alvin A Snaper | Arc deposition process and apparatus |
DE4017111C2 (de) * | 1990-05-28 | 1998-01-29 | Hauzer Holding | Lichtbogen-Magnetron-Vorrichtung |
JP2793773B2 (ja) | 1994-05-13 | 1998-09-03 | 神鋼コベルコツール株式会社 | 耐摩耗性に優れた硬質皮膜、硬質皮膜被覆工具及び硬質皮膜被覆部材 |
JP3417907B2 (ja) | 2000-07-13 | 2003-06-16 | 日立ツール株式会社 | 多層皮膜被覆工具 |
JP2007084899A (ja) * | 2005-09-26 | 2007-04-05 | Hitachi Tool Engineering Ltd | 被覆部材、被覆部材の被覆方法 |
DE102006046312B4 (de) * | 2006-09-29 | 2010-01-28 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Solarzellen mit stabilem, transparentem und leitfähigem Schichtsystem |
US8304098B2 (en) * | 2007-10-12 | 2012-11-06 | Hitachi Tool Engineering, Ltd. | Hard-coated member, and its production method |
DE102011117994A1 (de) * | 2011-11-09 | 2013-05-16 | Oerlikon Trading Ag, Trübbach | HIPIMS-Schichten |
CN103382548B (zh) | 2013-06-27 | 2016-05-11 | 中国科学院宁波材料技术与工程研究所 | 一种基体表面纳米复合Me-Si-N超硬涂层的制备方法 |
NO2785538T3 (ja) * | 2014-05-07 | 2018-08-04 |
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JP2017529459A (ja) | 2017-10-05 |
EP3212819A1 (en) | 2017-09-06 |
CN107002226A (zh) | 2017-08-01 |
US20170298497A1 (en) | 2017-10-19 |
KR102422356B1 (ko) | 2022-07-18 |
KR20170055485A (ko) | 2017-05-19 |
PL3212819T3 (pl) | 2023-10-16 |
HUE061930T2 (hu) | 2023-09-28 |
JP2021059786A (ja) | 2021-04-15 |
EP3212819B1 (en) | 2023-03-29 |
JP7187525B2 (ja) | 2022-12-12 |
CN107002226B (zh) | 2021-03-12 |
WO2016042072A1 (en) | 2016-03-24 |
US10626493B2 (en) | 2020-04-21 |
ES2946664T3 (es) | 2023-07-24 |
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