DK2449154T3 - Fremgangsmåde til plettering eller belægning til fremstilling af metalkeramisk belægning på et substrat - Google Patents

Fremgangsmåde til plettering eller belægning til fremstilling af metalkeramisk belægning på et substrat Download PDF

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Publication number
DK2449154T3
DK2449154T3 DK10794416.7T DK10794416T DK2449154T3 DK 2449154 T3 DK2449154 T3 DK 2449154T3 DK 10794416 T DK10794416 T DK 10794416T DK 2449154 T3 DK2449154 T3 DK 2449154T3
Authority
DK
Denmark
Prior art keywords
coating
plating
substrate
production
metal
Prior art date
Application number
DK10794416.7T
Other languages
English (en)
Inventor
Wei Gao
Weiwei Chen
Original Assignee
Cirrus Mat Science Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cirrus Mat Science Limited filed Critical Cirrus Mat Science Limited
Application granted granted Critical
Publication of DK2449154T3 publication Critical patent/DK2449154T3/da

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1637—Composition of the substrate metallic substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Automation & Control Theory (AREA)
  • Dispersion Chemistry (AREA)
  • Chemically Coating (AREA)
DK10794416.7T 2009-06-29 2010-06-29 Fremgangsmåde til plettering eller belægning til fremstilling af metalkeramisk belægning på et substrat DK2449154T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NZ57803809 2009-06-29
PCT/NZ2010/000128 WO2011002311A1 (en) 2009-06-29 2010-06-29 Plating or coating method for producing metal-ceramic coating on a substrate

Publications (1)

Publication Number Publication Date
DK2449154T3 true DK2449154T3 (da) 2022-01-10

Family

ID=43411214

Family Applications (1)

Application Number Title Priority Date Filing Date
DK10794416.7T DK2449154T3 (da) 2009-06-29 2010-06-29 Fremgangsmåde til plettering eller belægning til fremstilling af metalkeramisk belægning på et substrat

Country Status (8)

Country Link
US (1) US9562302B2 (da)
EP (1) EP2449154B1 (da)
JP (1) JP5839407B2 (da)
KR (1) KR101746240B1 (da)
CN (1) CN102575367B (da)
AU (1) AU2010266798B2 (da)
DK (1) DK2449154T3 (da)
WO (1) WO2011002311A1 (da)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102560576B (zh) * 2012-02-21 2015-01-14 合肥工业大学 一种作为焊点反应阻挡层的Ni-Cu-P三元合金涂层及其电镀制备工艺
JP5896889B2 (ja) * 2012-12-07 2016-03-30 株式会社豊田自動織機 光学選択膜
US20140287208A1 (en) * 2013-03-22 2014-09-25 Surface Technology, Inc. Blackened composite electroless nickel coatings
CN103367165A (zh) * 2013-07-01 2013-10-23 北京京东方光电科技有限公司 薄膜晶体管及其制作方法、阵列基板及显示器
CN103436927B (zh) * 2013-08-19 2016-07-06 沈阳理工大学 一种铝溶胶和金属镍离子共沉积的方法
CN104141160B (zh) * 2013-10-29 2018-02-16 中国石油化工集团公司 Cr/Al2O3/SiC复合涂层及其制备方法
CN107075683A (zh) * 2014-05-27 2017-08-18 奥克兰联合服务公司 于基材上产生金属‑陶瓷覆层的镀覆或涂覆方法
KR101536717B1 (ko) * 2014-07-18 2015-07-15 (주)스마트코리아 박막 태양전지의 비진공 버퍼층 증착장치
CN104988474B (zh) * 2015-07-18 2017-05-10 西安科技大学 一种复合梯度涂层的化学镀制备方法
CN106835089A (zh) * 2017-01-21 2017-06-13 扬州大学 Ni‑W‑P‑纳米SiO2化学复合镀层的制备方法
CN109433209A (zh) * 2018-09-26 2019-03-08 昆明理工大学 镍硼非晶态合金催化剂及其制备方法和应用
CN110029377B (zh) * 2019-05-15 2021-02-09 东南大学 一种长波段超黑多孔复合材料及其制备方法
CN110129778A (zh) * 2019-06-27 2019-08-16 福建工程学院 高均匀度高性能复合Ni-P-TiO2镀层的制备方法
CN110484942B (zh) * 2019-08-07 2022-01-04 湖南纳菲尔新材料科技股份有限公司 一种Ni-P-C-Si-W多元微米晶镀层、镀液及其制备方法
CN110923607A (zh) * 2019-12-27 2020-03-27 上海英佛曼纳米科技股份有限公司 一种带有耐磨损抗粗糙度下降纳米涂层的冷轧活套辊
TW202212640A (zh) 2020-04-24 2022-04-01 紐西蘭商西洛斯材料科學有限公司 在合金上施加著色塗層的方法
CN112226800A (zh) * 2020-10-13 2021-01-15 中国兵器工业第五九研究所 一种铝合金表面叠层陶瓷涂层的制备方法
CN112195491A (zh) * 2020-10-13 2021-01-08 中国兵器工业第五九研究所 一种基于微弧氧化的SiC-Al2O3涂层的制备方法
CN114016008B (zh) * 2021-10-27 2023-08-29 东北电力大学 一种化学镀Ni-P-PTFE-TiO2复合纳米镀层及其制备方法
CN115889770A (zh) * 2022-12-07 2023-04-04 长沙岱勒新材料科技股份有限公司 一种在金刚石微粉表面镀镍的方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB842092A (en) * 1955-07-26 1960-07-20 Kurt Graf Blucher Von Wahlstat A new or improved method for forging toothed wheels
GB824092A (en) * 1956-04-10 1959-11-25 Sherritt Gordon Mines Ltd Method of producing composite metal coated metal compound particles
DE1621206B2 (de) 1967-01-18 1971-12-16 Friedr. Blasberg Gmbh & Co, Kg, 5650 Solingen Verfahren zur beschichtung gleitend reibend auf verschleiss beanspruchter werkstuecke
JPS59123796A (ja) 1982-12-28 1984-07-17 Kawasaki Steel Corp 高耐食性電気亜鉛めつき鋼板の製造方法
JPS63282294A (ja) 1987-05-11 1988-11-18 Inax Corp 金属・固体微細物系複合めっき膜およびその製法
EP0441636B1 (en) * 1990-02-09 1994-06-22 Nihon Parkerizing Co., Ltd. Process for surface treating titanium-containing metallic material
JP2714470B2 (ja) 1990-03-02 1998-02-16 三菱電機株式会社 黒鉛粒子分散銀めっき方法
US5266181A (en) * 1991-11-27 1993-11-30 C. Uyemura & Co., Ltd. Controlled composite deposition method
JPH05171454A (ja) 1991-12-20 1993-07-09 Kanai Hiroyuki 分散めっき方法
DE4424168A1 (de) 1994-07-08 1996-01-11 Merck Patent Gmbh Metallische Dispersionsschichten
JPH0885898A (ja) * 1994-09-20 1996-04-02 Kawasaki Steel Corp 耐低温チッピング性および裸耐食性に優れたＺｎ系分散めっき鋼板およびその製造方法
JP2908711B2 (ja) 1994-10-20 1999-06-21 株式会社三協精機製作所 複合めっき及びこれを用いた摺動部材
JPH09320885A (ja) 1996-05-28 1997-12-12 Read Rite S M I Kk 磁性薄膜および磁性薄膜の製造方法
DE19654953A1 (de) * 1996-06-01 1998-03-26 Glyco Metall Werke Schichtwerkstoff für Gleitelemente
US6183908B1 (en) * 1997-03-14 2001-02-06 Fuji Photo Film Co., Ltd. Negative electrode material for nonaqueous secondary battery and nonaqueous secondary battery comprising same negative electrode material
JP3687722B2 (ja) * 1999-01-12 2005-08-24 上村工業株式会社 無電解複合めっき液及び無電解複合めっき方法
CA2614620C (en) 2000-05-10 2010-02-02 Alberta Research Council Inc. Production of hollow ceramic membranes by electrophoretic deposition
JP4139124B2 (ja) 2002-04-16 2008-08-27 株式会社荏原製作所 めっき装置及び方法
JP4125765B2 (ja) 2006-09-28 2008-07-30 日本パーカライジング株式会社 金属のセラミックス皮膜コーティング方法およびそれに用いる電解液ならびにセラミックス皮膜および金属材料
WO2009017266A1 (en) 2007-07-31 2009-02-05 Hanwha Chemical Corporation Electroless plating process of crosslinked monodisperse polymer particles with a diameter of micron and the plated particles therefrom
CN101270476A (zh) * 2008-04-25 2008-09-24 浙江大学 溶胶－凝胶制备高结合强度碳素钢基Al2O3陶瓷涂层方法
CN101397657B (zh) * 2008-10-31 2010-09-01 华东理工大学 采用纳米二氧化硅溶胶和稀土强化复合镀层的方法

Also Published As

Publication number Publication date
AU2010266798A1 (en) 2012-01-19
CN102575367A (zh) 2012-07-11
EP2449154B1 (en) 2021-09-29
EP2449154A4 (en) 2017-01-04
JP2012532253A (ja) 2012-12-13
KR20120103547A (ko) 2012-09-19
WO2011002311A1 (en) 2011-01-06
KR101746240B1 (ko) 2017-06-27
CN102575367B (zh) 2015-03-25
US9562302B2 (en) 2017-02-07
AU2010266798B2 (en) 2016-08-11
WO2011002311A9 (en) 2011-02-24
EP2449154A1 (en) 2012-05-09
US20120107627A1 (en) 2012-05-03
JP5839407B2 (ja) 2016-01-06

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