KR100321815B1 - 정전 보호 회로를 갖는 반도체 집적 회로 장치 - Google Patents

정전 보호 회로를 갖는 반도체 집적 회로 장치 Download PDF

Info

Publication number
KR100321815B1
KR100321815B1 KR1019990012874A KR19990012874A KR100321815B1 KR 100321815 B1 KR100321815 B1 KR 100321815B1 KR 1019990012874 A KR1019990012874 A KR 1019990012874A KR 19990012874 A KR19990012874 A KR 19990012874A KR 100321815 B1 KR100321815 B1 KR 100321815B1
Authority
KR
South Korea
Prior art keywords
transistor
power supply
wiring
input
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019990012874A
Other languages
English (en)
Korean (ko)
Other versions
KR19990083141A (ko
Inventor
나꾸라도루
우에다기미오
Original Assignee
다니구찌 이찌로오, 기타오카 다카시
미쓰비시덴키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다니구찌 이찌로오, 기타오카 다카시, 미쓰비시덴키 가부시키가이샤 filed Critical 다니구찌 이찌로오, 기타오카 다카시
Publication of KR19990083141A publication Critical patent/KR19990083141A/ko
Application granted granted Critical
Publication of KR100321815B1 publication Critical patent/KR100321815B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/811Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
KR1019990012874A 1998-04-20 1999-04-12 정전 보호 회로를 갖는 반도체 집적 회로 장치 Expired - Fee Related KR100321815B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP10954798 1998-04-20
JP1998-109547 1998-04-20
JP23992898A JP4132270B2 (ja) 1998-04-20 1998-08-26 半導体集積回路装置
JP1998-239928 1998-08-26

Publications (2)

Publication Number Publication Date
KR19990083141A KR19990083141A (ko) 1999-11-25
KR100321815B1 true KR100321815B1 (ko) 2002-02-02

Family

ID=26449284

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019990012874A Expired - Fee Related KR100321815B1 (ko) 1998-04-20 1999-04-12 정전 보호 회로를 갖는 반도체 집적 회로 장치

Country Status (3)

Country Link
US (1) US6208494B1 (https=)
JP (1) JP4132270B2 (https=)
KR (1) KR100321815B1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101424917B1 (ko) 2012-09-20 2014-08-01 가부시끼가이샤 도시바 Esd 보호 회로를 구비한 반도체 집적 회로

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US7110227B2 (en) 1997-04-08 2006-09-19 X2Y Attenuators, Llc Universial energy conditioning interposer with circuit architecture
US7042703B2 (en) 2000-03-22 2006-05-09 X2Y Attenuators, Llc Energy conditioning structure
US6606011B2 (en) 1998-04-07 2003-08-12 X2Y Attenuators, Llc Energy conditioning circuit assembly
US7106570B2 (en) 1997-04-08 2006-09-12 Xzy Altenuators, Llc Pathway arrangement
US20030161086A1 (en) 2000-07-18 2003-08-28 X2Y Attenuators, Llc Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US6894884B2 (en) 1997-04-08 2005-05-17 Xzy Attenuators, Llc Offset pathway arrangements for energy conditioning
US6018448A (en) * 1997-04-08 2000-01-25 X2Y Attenuators, L.L.C. Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US7301748B2 (en) 1997-04-08 2007-11-27 Anthony Anthony A Universal energy conditioning interposer with circuit architecture
US7110235B2 (en) 1997-04-08 2006-09-19 Xzy Altenuators, Llc Arrangement for energy conditioning
US6954346B2 (en) 1997-04-08 2005-10-11 Xzy Attenuators, Llc Filter assembly
US7274549B2 (en) 2000-12-15 2007-09-25 X2Y Attenuators, Llc Energy pathway arrangements for energy conditioning
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
WO1999052210A1 (en) 1998-04-07 1999-10-14 X2Y Attenuators, L.L.C. Component carrier
US7336467B2 (en) 2000-10-17 2008-02-26 X2Y Attenuators, Llc Energy pathway arrangement
US6603646B2 (en) 1997-04-08 2003-08-05 X2Y Attenuators, Llc Multi-functional energy conditioner
US6650525B2 (en) 1997-04-08 2003-11-18 X2Y Attenuators, Llc Component carrier
US7427816B2 (en) 1998-04-07 2008-09-23 X2Y Attenuators, Llc Component carrier
US6524897B1 (en) * 2000-03-31 2003-02-25 Intel Corporation Semiconductor-on-insulator resistor-capacitor circuit
US7113383B2 (en) 2000-04-28 2006-09-26 X2Y Attenuators, Llc Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
EP1312148A4 (en) 2000-08-15 2009-06-03 X2Y Attenuators Llc ELECTRODE ARRANGEMENT FOR CIRCUIT BREAKER PROCESSING
KR100536511B1 (ko) 2000-10-17 2005-12-14 엑스2와이 어테뉴에이터스, 엘.엘.씨 공통 기준 노드를 갖는 단일 또는 다수의 회로들을 위한 차폐 아말감 및 차폐된 에너지 경로들 및 다른 엘리먼트들
US7193831B2 (en) 2000-10-17 2007-03-20 X2Y Attenuators, Llc Energy pathway arrangement
KR20020085101A (ko) * 2001-05-04 2002-11-16 삼성전자 주식회사 다이오드를 이용한 정전기적 방전으로부터의 보호 회로
JP4790166B2 (ja) * 2001-07-05 2011-10-12 Okiセミコンダクタ株式会社 保護トランジスタ
US6667648B2 (en) * 2002-04-23 2003-12-23 International Business Machines Corporation Voltage island communications circuits
US20040100745A1 (en) * 2002-11-21 2004-05-27 Industrial Technology Research Institute Silicon-controlled rectifier with dynamic holding voltage for on-chip electrostatic discharge protection
US7180718B2 (en) * 2003-01-31 2007-02-20 X2Y Attenuators, Llc Shielded energy conditioner
WO2005002018A2 (en) 2003-05-29 2005-01-06 X2Y Attenuators, Llc Connector related structures including an energy
KR20060120683A (ko) 2003-12-22 2006-11-27 엑스2와이 어테뉴에이터스, 엘.엘.씨 내부적으로 차폐된 에너지 컨디셔너
JP2005217043A (ja) * 2004-01-28 2005-08-11 Toshiba Corp 静電破壊保護回路
US7187527B2 (en) * 2004-09-02 2007-03-06 Macronix International Co., Ltd. Electrostatic discharge conduction device and mixed power integrated circuits using same
US7129545B2 (en) * 2005-02-24 2006-10-31 International Business Machines Corporation Charge modulation network for multiple power domains for silicon-on-insulator technology
JP2008537843A (ja) 2005-03-01 2008-09-25 エックストゥーワイ アテニュエイターズ,エルエルシー 内部で重なり合った調整器
WO2006093831A2 (en) 2005-03-01 2006-09-08 X2Y Attenuators, Llc Energy conditioner with tied through electrodes
WO2006099297A2 (en) 2005-03-14 2006-09-21 X2Y Attenuators, Llc Conditioner with coplanar conductors
EP1991996A1 (en) 2006-03-07 2008-11-19 X2Y Attenuators, L.L.C. Energy conditioner structures
US20070246778A1 (en) * 2006-04-21 2007-10-25 Meng-Chi Liou Electrostatic discharge panel protection structure
JP5006580B2 (ja) * 2006-05-31 2012-08-22 ルネサスエレクトロニクス株式会社 保護回路を備える半導体装置
JP4856609B2 (ja) * 2007-10-10 2012-01-18 日本オプネクスト株式会社 通信モジュール
JP5564818B2 (ja) * 2009-03-31 2014-08-06 富士通セミコンダクター株式会社 電源クランプ回路
US8947839B2 (en) * 2009-07-30 2015-02-03 Xilinx, Inc. Enhanced immunity from electrostatic discharge
EP2715382B1 (en) * 2011-05-27 2018-06-27 NXP USA, Inc. Ground loss monitoring circuit and integrated circuit comprising the same
US9851392B2 (en) * 2013-01-10 2017-12-26 Nxp Usa, Inc. Ground-loss detection circuit
JP6519972B2 (ja) * 2014-02-07 2019-05-29 株式会社リコー ハイパスフィルタ回路及びバンドパスフィルタ回路
EP2919262B1 (en) * 2014-03-14 2022-12-21 EM Microelectronic-Marin SA Fault detection assembly
JP2016066673A (ja) * 2014-09-24 2016-04-28 株式会社東芝 半導体装置
CN208045498U (zh) 2017-03-29 2018-11-02 意法半导体国际有限公司 用于提供静电放电(esd)保护的电路
US11063429B2 (en) 2018-04-12 2021-07-13 Stmicroelectronics International N.V. Low leakage MOSFET supply clamp for electrostatic discharge (ESD) protection
US10944257B2 (en) 2018-04-13 2021-03-09 Stmicroelectronics International N.V. Integrated silicon controlled rectifier (SCR) and a low leakage SCR supply clamp for electrostatic discharge (ESP) protection
JP7408595B2 (ja) * 2021-03-30 2024-01-05 株式会社東芝 保護回路
US20230197709A1 (en) * 2021-12-22 2023-06-22 Intel Corporation Electrostatic discharge (esd) circuit with diodes in metal layers of a substrate

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6112043A (ja) 1984-06-27 1986-01-20 Toshiba Corp マスタ−スライス型ゲ−トアレイ装置
JPS61292351A (ja) 1985-06-20 1986-12-23 Sanyo Electric Co Ltd 入力保護回路
JPS6239045A (ja) 1985-08-14 1987-02-20 Oki Electric Ind Co Ltd 半導体集積回路の入力保護回路
JP2659214B2 (ja) 1988-06-10 1997-09-30 日本電気アイシーマイコンシステム株式会社 マスタスライス型半導体集積回路
JPH0286317A (ja) 1988-09-22 1990-03-27 Hitachi Ltd 半導体集積回路装置
JPH05102475A (ja) 1991-10-09 1993-04-23 Ricoh Co Ltd 半導体装置とその製造方法
JPH05291503A (ja) 1992-04-06 1993-11-05 Hitachi Ltd 半導体装置
US5345356A (en) * 1992-06-05 1994-09-06 At&T Bell Laboratories ESD protection of output buffers
JP2809020B2 (ja) 1992-12-07 1998-10-08 日本電気株式会社 入出力保護回路
JPH08213555A (ja) 1995-02-02 1996-08-20 Mitsubishi Electric Corp 半導体集積回路
JPH09162407A (ja) 1995-12-06 1997-06-20 Hitachi Ltd 半導体集積回路装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101424917B1 (ko) 2012-09-20 2014-08-01 가부시끼가이샤 도시바 Esd 보호 회로를 구비한 반도체 집적 회로

Also Published As

Publication number Publication date
US6208494B1 (en) 2001-03-27
JP4132270B2 (ja) 2008-08-13
KR19990083141A (ko) 1999-11-25
JP2000012788A (ja) 2000-01-14

Similar Documents

Publication Publication Date Title
KR100321815B1 (ko) 정전 보호 회로를 갖는 반도체 집적 회로 장치
US6559508B1 (en) ESD protection device for open drain I/O pad in integrated circuits with merged layout structure
CN102903715B (zh) 半导体集成电路
US5825601A (en) Power supply ESD protection circuit
JP2914292B2 (ja) 半導体装置
CN101373768A (zh) 半导体器件
US5847429A (en) Multiple node ESD devices
EP0632560B1 (en) Semiconductor integrated circuit device equipped with protective system for directly discharging surge voltage from pad to discharging line
TWI628447B (zh) 半導體積體電路裝置
US20250324767A1 (en) Electrostatic discharge protection for integrated circuit during back end-of-line processing
KR100223352B1 (ko) 반도체 집적 회로 장치
US6803632B2 (en) Semiconductor circuit having an input protection circuit
US6826026B2 (en) Output buffer and I/O protection circuit for CMOS technology
US7561390B2 (en) Protection circuit in semiconductor circuit device comprising a plurality of chips
CN101257019B (zh) 沿着半导体芯片的长边具有细长静电保护元件的半导体器件
KR20010021489A (ko) 반도체 집적 회로
US5784235A (en) Semiconductor IC device including ESD protection circuit
US6355960B1 (en) ESD protection for open drain I/O pad in integrated circuit with parasitic field FET devices
JPH0494161A (ja) 集積回路用入出力保護装置
JP2751898B2 (ja) 半導体装置
JP2000208718A (ja) 半導体装置
JP3535744B2 (ja) 半導体集積回路
WO2023190001A1 (ja) 半導体装置
KR20070029059A (ko) 반도체 장치
JPH05335485A (ja) 半導体集積回路装置

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

FPAY Annual fee payment

Payment date: 20111216

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20130111

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20130111

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000