KR100204345B1 - 더어미스터 - Google Patents
더어미스터 Download PDFInfo
- Publication number
- KR100204345B1 KR100204345B1 KR1019930026844A KR930026844A KR100204345B1 KR 100204345 B1 KR100204345 B1 KR 100204345B1 KR 1019930026844 A KR1019930026844 A KR 1019930026844A KR 930026844 A KR930026844 A KR 930026844A KR 100204345 B1 KR100204345 B1 KR 100204345B1
- Authority
- KR
- South Korea
- Prior art keywords
- glass
- layer
- thermistor
- demister
- glass layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/034—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
- H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Ceramic Engineering (AREA)
- Thermistors And Varistors (AREA)
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5032755A JPH06231906A (ja) | 1993-01-28 | 1993-01-28 | サーミスタ |
| JP93-32755 | 1993-01-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR940019178A KR940019178A (ko) | 1994-08-19 |
| KR100204345B1 true KR100204345B1 (ko) | 1999-06-15 |
Family
ID=12367664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019930026844A Expired - Lifetime KR100204345B1 (ko) | 1993-01-28 | 1993-12-08 | 더어미스터 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5534843A (https=) |
| JP (1) | JPH06231906A (https=) |
| KR (1) | KR100204345B1 (https=) |
| TW (1) | TW269736B (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100807217B1 (ko) | 2006-07-28 | 2008-02-28 | 조인셋 주식회사 | 세라믹 부품 및 그 제조방법 |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5900800A (en) * | 1996-01-22 | 1999-05-04 | Littelfuse, Inc. | Surface mountable electrical device comprising a PTC element |
| US5907272A (en) * | 1996-01-22 | 1999-05-25 | Littelfuse, Inc. | Surface mountable electrical device comprising a PTC element and a fusible link |
| JP3058097B2 (ja) * | 1996-10-09 | 2000-07-04 | 株式会社村田製作所 | サーミスタチップ及びその製造方法 |
| JP3060966B2 (ja) * | 1996-10-09 | 2000-07-10 | 株式会社村田製作所 | チップ型サーミスタおよびその製造方法 |
| JP3031268B2 (ja) * | 1996-11-20 | 2000-04-10 | 株式会社村田製作所 | 磁器コンデンサ |
| JPH1154301A (ja) * | 1997-08-07 | 1999-02-26 | Murata Mfg Co Ltd | チップ型サーミスタ |
| DE19736855A1 (de) * | 1997-08-23 | 1999-02-25 | Philips Patentverwaltung | Schaltungsanordnung mit einem SMD-Bauelement, insbesondere Temperatursensor und Verfahren zur Herstellung eines Temperatursensors |
| US6172592B1 (en) * | 1997-10-24 | 2001-01-09 | Murata Manufacturing Co., Ltd. | Thermistor with comb-shaped electrodes |
| JP2000082603A (ja) * | 1998-07-08 | 2000-03-21 | Murata Mfg Co Ltd | チップ型サ―ミスタおよびその製造方法 |
| JP2000091105A (ja) * | 1998-09-11 | 2000-03-31 | Murata Mfg Co Ltd | チップ型セラミックサーミスタおよびその製造方法 |
| US7625509B2 (en) * | 2001-08-02 | 2009-12-01 | 3M Innovative Properties Company | Method of making ceramic articles |
| CN100453486C (zh) | 2001-08-02 | 2009-01-21 | 3M创新有限公司 | 磨粒及其制备和使用方法 |
| KR100885329B1 (ko) | 2001-08-02 | 2009-02-26 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Al₂O₃-희토류 산화물-ZrO₂/HfO₂물질, 및그의 제조 및 사용 방법 |
| KR100885328B1 (ko) * | 2001-08-02 | 2009-02-26 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 알루미나-산화 이트륨-산화 지르코늄/산화 하프늄 물질,및 그의 제조 및 사용 방법 |
| CN101417860B (zh) | 2001-08-02 | 2012-01-18 | 3M创新有限公司 | 从玻璃制备制品的方法以及所制备的玻璃陶瓷制品 |
| AU2002321872A1 (en) | 2001-08-02 | 2003-02-17 | 3M Innovative Properties Company | Abrasive particles, and methods of making and using the same |
| JP2004241754A (ja) * | 2002-07-16 | 2004-08-26 | Chem Art Technol:Kk | 基板処理方法及び基板処理装置 |
| US7179526B2 (en) | 2002-08-02 | 2007-02-20 | 3M Innovative Properties Company | Plasma spraying |
| US8056370B2 (en) | 2002-08-02 | 2011-11-15 | 3M Innovative Properties Company | Method of making amorphous and ceramics via melt spinning |
| US7258707B2 (en) | 2003-02-05 | 2007-08-21 | 3M Innovative Properties Company | AI2O3-La2O3-Y2O3-MgO ceramics, and methods of making the same |
| US7175786B2 (en) | 2003-02-05 | 2007-02-13 | 3M Innovative Properties Co. | Methods of making Al2O3-SiO2 ceramics |
| US6984261B2 (en) * | 2003-02-05 | 2006-01-10 | 3M Innovative Properties Company | Use of ceramics in dental and orthodontic applications |
| US7811496B2 (en) | 2003-02-05 | 2010-10-12 | 3M Innovative Properties Company | Methods of making ceramic particles |
| US7292766B2 (en) * | 2003-04-28 | 2007-11-06 | 3M Innovative Properties Company | Use of glasses containing rare earth oxide, alumina, and zirconia and dopant in optical waveguides |
| US7197896B2 (en) | 2003-09-05 | 2007-04-03 | 3M Innovative Properties Company | Methods of making Al2O3-SiO2 ceramics |
| US7297171B2 (en) | 2003-09-18 | 2007-11-20 | 3M Innovative Properties Company | Methods of making ceramics comprising Al2O3, REO, ZrO2 and/or HfO2 and Nb205 and/or Ta2O5 |
| US7141523B2 (en) | 2003-09-18 | 2006-11-28 | 3M Innovative Properties Company | Ceramics comprising Al2O3, REO, ZrO2 and/or HfO2, and Nb2O5 and/or Ta2O5 and methods of making the same |
| US7141522B2 (en) | 2003-09-18 | 2006-11-28 | 3M Innovative Properties Company | Ceramics comprising Al2O3, Y2O3, ZrO2 and/or HfO2, and Nb2O5 and/or Ta2O5 and methods of making the same |
| DE10356367B4 (de) | 2003-11-28 | 2009-06-10 | Georg Bernitz | Verfahren zur Herstellung eines Bauelements und Bauelement |
| US20050132658A1 (en) * | 2003-12-18 | 2005-06-23 | 3M Innovative Properties Company | Method of making abrasive particles |
| US7332453B2 (en) * | 2004-07-29 | 2008-02-19 | 3M Innovative Properties Company | Ceramics, and methods of making and using the same |
| US7497093B2 (en) * | 2004-07-29 | 2009-03-03 | 3M Innovative Properties Company | Method of making ceramic articles |
| EP2549491B1 (en) | 2005-02-08 | 2017-07-26 | Murata Manufacturing Co., Ltd. | Surface mountable negative coefficient characteristic ceramic thermistor based on Mn, Co and Ti |
| US7598188B2 (en) | 2005-12-30 | 2009-10-06 | 3M Innovative Properties Company | Ceramic materials and methods of making and using the same |
| US7281970B2 (en) | 2005-12-30 | 2007-10-16 | 3M Innovative Properties Company | Composite articles and methods of making the same |
| US20090027821A1 (en) * | 2007-07-26 | 2009-01-29 | Littelfuse, Inc. | Integrated thermistor and metallic element device and method |
| TWI469158B (zh) * | 2012-07-31 | 2015-01-11 | Polytronics Technology Corp | 過電流保護元件 |
| JP6107062B2 (ja) * | 2012-11-06 | 2017-04-05 | Tdk株式会社 | チップサーミスタ |
| KR101718950B1 (ko) * | 2012-12-18 | 2017-03-22 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층 세라믹 전자부품 및 그 제조방법 |
| KR102029545B1 (ko) * | 2017-12-01 | 2019-10-07 | 삼성전기주식회사 | 적층형 커패시터 |
| CN109712767A (zh) * | 2018-12-29 | 2019-05-03 | 广东爱晟电子科技有限公司 | 一种高可靠玻璃封装热敏电阻芯片及其制作方法 |
| US11854723B2 (en) * | 2019-03-22 | 2023-12-26 | Littelfuse Electronics (Shanghai) Co., Ltd. | PTC device including polyswitch |
| JP7401320B2 (ja) * | 2020-01-24 | 2023-12-19 | 株式会社村田製作所 | 積層セラミック電子部品 |
| KR102908322B1 (ko) * | 2020-12-31 | 2026-01-05 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0770373B2 (ja) * | 1986-05-09 | 1995-07-31 | 松下電器産業株式会社 | 積層型チツプバリスタの製造方法 |
| JP2591205B2 (ja) * | 1989-12-28 | 1997-03-19 | 三菱マテリアル株式会社 | サーミスタ |
| KR970006424B1 (ko) * | 1990-02-22 | 1997-04-28 | 가부시키가이샤 무라타세이사큐쇼 | 정특성더미스터와 그 제조방법 |
| JP3199264B2 (ja) * | 1990-06-08 | 2001-08-13 | 三菱マテリアル株式会社 | 負特性サーミスタ |
| JP2847102B2 (ja) * | 1990-06-08 | 1999-01-13 | 三菱マテリアル株式会社 | チップ型サーミスタおよびその製造方法 |
| JPH04181702A (ja) * | 1990-11-15 | 1992-06-29 | Matsushita Electric Ind Co Ltd | チップサーミスタおよびその製造方法 |
| JPH04261001A (ja) * | 1990-12-28 | 1992-09-17 | Mitsubishi Materials Corp | サーミスタおよびその製造方法 |
-
1993
- 1993-01-28 JP JP5032755A patent/JPH06231906A/ja active Pending
- 1993-12-08 KR KR1019930026844A patent/KR100204345B1/ko not_active Expired - Lifetime
- 1993-12-20 TW TW082110795A patent/TW269736B/zh not_active IP Right Cessation
-
1994
- 1994-01-28 US US08/189,163 patent/US5534843A/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100807217B1 (ko) | 2006-07-28 | 2008-02-28 | 조인셋 주식회사 | 세라믹 부품 및 그 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06231906A (ja) | 1994-08-19 |
| TW269736B (https=) | 1996-02-01 |
| US5534843A (en) | 1996-07-09 |
| KR940019178A (ko) | 1994-08-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100204345B1 (ko) | 더어미스터 | |
| EP0564652B1 (en) | Manufacture of multilayer ceramic part, and multilayer ceramic part | |
| JPH0343786B2 (https=) | ||
| US11842854B2 (en) | Ceramic electronic device and manufacturing method of ceramic electronic device | |
| KR100204255B1 (ko) | 도전성 칩형 세라믹소자 및 그 제조방법 | |
| US11763993B2 (en) | Ceramic electronic device and mounting substrate | |
| JP2010147098A (ja) | 電子部品 | |
| JPS608229B2 (ja) | 多層セラミック基板 | |
| US6623845B1 (en) | Glass-ceramic composition, and electronic component and multilayer LC composite component using the same | |
| JP3622853B2 (ja) | サーミスタ | |
| JPH06215908A (ja) | チップ型サーミスタ及びその製造方法 | |
| JP3109700B2 (ja) | チップ型サーミスタ及びその製造方法 | |
| JP3622851B2 (ja) | チップ型サーミスタの製造方法 | |
| JP3622852B2 (ja) | サーミスタの製造方法 | |
| JPH06302406A (ja) | チップ型サーミスタ及びその製造方法 | |
| EP1130003A1 (en) | Glass ceramics composition and electronic parts and multilayered lc multiple component using the same | |
| KR100465845B1 (ko) | 적층 세라믹 커패시터 및 그 전극 조성물 | |
| JP2020015635A (ja) | セラミックス組成物及び当該セラミックス組成物を用いた電子部品 | |
| JPH07183105A (ja) | チップ型サーミスタ | |
| JP3625053B2 (ja) | チップ型サーミスタ及びその製造方法 | |
| JP2001135501A (ja) | チップ型サーミスタ | |
| JP2001196203A (ja) | チップ型サーミスタ | |
| KR0174589B1 (ko) | 리드 부착형 ntc 서미스터 | |
| JP3269404B2 (ja) | チップ型サーミスタ及びその製造方法 | |
| JPH11340082A (ja) | 積層チップ部品とその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19931208 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19951130 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 19931208 Comment text: Patent Application |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 19990225 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 19990327 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 19990329 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| PR1001 | Payment of annual fee |
Payment date: 20020327 Start annual number: 4 End annual number: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20030224 Start annual number: 5 End annual number: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20040219 Start annual number: 6 End annual number: 6 |
|
| PR1001 | Payment of annual fee |
Payment date: 20050224 Start annual number: 7 End annual number: 7 |
|
| PR1001 | Payment of annual fee |
Payment date: 20060302 Start annual number: 8 End annual number: 8 |
|
| PR1001 | Payment of annual fee |
Payment date: 20070227 Start annual number: 9 End annual number: 9 |
|
| PR1001 | Payment of annual fee |
Payment date: 20080226 Start annual number: 10 End annual number: 10 |
|
| PR1001 | Payment of annual fee |
Payment date: 20090324 Start annual number: 11 End annual number: 11 |
|
| PR1001 | Payment of annual fee |
Payment date: 20100324 Start annual number: 12 End annual number: 12 |
|
| PR1001 | Payment of annual fee |
Payment date: 20110322 Start annual number: 13 End annual number: 13 |
|
| PR1001 | Payment of annual fee |
Payment date: 20120319 Start annual number: 14 End annual number: 14 |
|
| FPAY | Annual fee payment |
Payment date: 20130315 Year of fee payment: 15 |
|
| PR1001 | Payment of annual fee |
Payment date: 20130315 Start annual number: 15 End annual number: 15 |
|
| EXPY | Expiration of term | ||
| PC1801 | Expiration of term |
Termination date: 20140608 Termination category: Expiration of duration |