TW269736B - - Google Patents

Info

Publication number
TW269736B
TW269736B TW082110795A TW82110795A TW269736B TW 269736 B TW269736 B TW 269736B TW 082110795 A TW082110795 A TW 082110795A TW 82110795 A TW82110795 A TW 82110795A TW 269736 B TW269736 B TW 269736B
Authority
TW
Taiwan
Application number
TW082110795A
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Application granted granted Critical
Publication of TW269736B publication Critical patent/TW269736B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/008—Thermistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/034—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
TW082110795A 1993-01-28 1993-12-20 TW269736B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5032755A JPH06231906A (ja) 1993-01-28 1993-01-28 サーミスタ

Publications (1)

Publication Number Publication Date
TW269736B true TW269736B (zh) 1996-02-01

Family

ID=12367664

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082110795A TW269736B (zh) 1993-01-28 1993-12-20

Country Status (4)

Country Link
US (1) US5534843A (zh)
JP (1) JPH06231906A (zh)
KR (1) KR100204345B1 (zh)
TW (1) TW269736B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7548149B2 (en) 2005-02-08 2009-06-16 Murata Manufacturing Co., Ltd. Surface-mount negative-characteristic thermistor

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5900800A (en) * 1996-01-22 1999-05-04 Littelfuse, Inc. Surface mountable electrical device comprising a PTC element
US5907272A (en) * 1996-01-22 1999-05-25 Littelfuse, Inc. Surface mountable electrical device comprising a PTC element and a fusible link
JP3058097B2 (ja) * 1996-10-09 2000-07-04 株式会社村田製作所 サーミスタチップ及びその製造方法
JP3060966B2 (ja) * 1996-10-09 2000-07-10 株式会社村田製作所 チップ型サーミスタおよびその製造方法
JP3031268B2 (ja) * 1996-11-20 2000-04-10 株式会社村田製作所 磁器コンデンサ
JPH1154301A (ja) * 1997-08-07 1999-02-26 Murata Mfg Co Ltd チップ型サーミスタ
DE19736855A1 (de) * 1997-08-23 1999-02-25 Philips Patentverwaltung Schaltungsanordnung mit einem SMD-Bauelement, insbesondere Temperatursensor und Verfahren zur Herstellung eines Temperatursensors
US6172592B1 (en) * 1997-10-24 2001-01-09 Murata Manufacturing Co., Ltd. Thermistor with comb-shaped electrodes
JP2000082603A (ja) * 1998-07-08 2000-03-21 Murata Mfg Co Ltd チップ型サ―ミスタおよびその製造方法
JP2000091105A (ja) * 1998-09-11 2000-03-31 Murata Mfg Co Ltd チップ型セラミックサーミスタおよびその製造方法
US7563293B2 (en) 2001-08-02 2009-07-21 3M Innovative Properties Company Al2O3-rare earth oxide-ZrO2/HfO2 materials, and methods of making and using the same
US7507268B2 (en) * 2001-08-02 2009-03-24 3M Innovative Properties Company Al2O3-Y2O3-ZrO2/HfO2 materials, and methods of making and using the same
US7625509B2 (en) * 2001-08-02 2009-12-01 3M Innovative Properties Company Method of making ceramic articles
BR0211576A (pt) 2001-08-02 2004-06-29 3M Innovative Properties Co Método para fabricar um artigo a partir de vidro
JP2004241754A (ja) * 2002-07-16 2004-08-26 Chem Art Technol:Kk 基板処理方法及び基板処理装置
US8056370B2 (en) 2002-08-02 2011-11-15 3M Innovative Properties Company Method of making amorphous and ceramics via melt spinning
US6984261B2 (en) * 2003-02-05 2006-01-10 3M Innovative Properties Company Use of ceramics in dental and orthodontic applications
US7811496B2 (en) 2003-02-05 2010-10-12 3M Innovative Properties Company Methods of making ceramic particles
US7292766B2 (en) * 2003-04-28 2007-11-06 3M Innovative Properties Company Use of glasses containing rare earth oxide, alumina, and zirconia and dopant in optical waveguides
DE10356367B4 (de) * 2003-11-28 2009-06-10 Georg Bernitz Verfahren zur Herstellung eines Bauelements und Bauelement
US20050132658A1 (en) * 2003-12-18 2005-06-23 3M Innovative Properties Company Method of making abrasive particles
US7497093B2 (en) * 2004-07-29 2009-03-03 3M Innovative Properties Company Method of making ceramic articles
US7332453B2 (en) * 2004-07-29 2008-02-19 3M Innovative Properties Company Ceramics, and methods of making and using the same
KR100807217B1 (ko) 2006-07-28 2008-02-28 조인셋 주식회사 세라믹 부품 및 그 제조방법
US20090027821A1 (en) * 2007-07-26 2009-01-29 Littelfuse, Inc. Integrated thermistor and metallic element device and method
TWI469158B (zh) * 2012-07-31 2015-01-11 Polytronics Technology Corp 過電流保護元件
JP6107062B2 (ja) * 2012-11-06 2017-04-05 Tdk株式会社 チップサーミスタ
CN104871270B (zh) * 2012-12-18 2017-08-29 株式会社村田制作所 层叠陶瓷电子部件及其制造方法
KR102029545B1 (ko) * 2017-12-01 2019-10-07 삼성전기주식회사 적층형 커패시터
CN109712767A (zh) * 2018-12-29 2019-05-03 广东爱晟电子科技有限公司 一种高可靠玻璃封装热敏电阻芯片及其制作方法
WO2020191522A1 (en) * 2019-03-22 2020-10-01 Littelfuse Electronics (Shanghai) Co., Ltd. Ptc device including polyswitch
JP7401320B2 (ja) * 2020-01-24 2023-12-19 株式会社村田製作所 積層セラミック電子部品
KR20220096782A (ko) * 2020-12-31 2022-07-07 삼성전기주식회사 적층 세라믹 전자부품

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0770373B2 (ja) * 1986-05-09 1995-07-31 松下電器産業株式会社 積層型チツプバリスタの製造方法
JP2591205B2 (ja) * 1989-12-28 1997-03-19 三菱マテリアル株式会社 サーミスタ
US5210516A (en) * 1990-02-22 1993-05-11 Murata Manufacturing Co., Ltd. Ptc thermistor and ptc thermistor producing method, and resistor with a ptc thermistor
JP3199264B2 (ja) * 1990-06-08 2001-08-13 三菱マテリアル株式会社 負特性サーミスタ
JP2847102B2 (ja) * 1990-06-08 1999-01-13 三菱マテリアル株式会社 チップ型サーミスタおよびその製造方法
JPH04181702A (ja) * 1990-11-15 1992-06-29 Matsushita Electric Ind Co Ltd チップサーミスタおよびその製造方法
JPH04261001A (ja) * 1990-12-28 1992-09-17 Mitsubishi Materials Corp サーミスタおよびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7548149B2 (en) 2005-02-08 2009-06-16 Murata Manufacturing Co., Ltd. Surface-mount negative-characteristic thermistor

Also Published As

Publication number Publication date
KR940019178A (ko) 1994-08-19
US5534843A (en) 1996-07-09
JPH06231906A (ja) 1994-08-19
KR100204345B1 (ko) 1999-06-15

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