JP6107062B2 - チップサーミスタ - Google Patents
チップサーミスタ Download PDFInfo
- Publication number
- JP6107062B2 JP6107062B2 JP2012244643A JP2012244643A JP6107062B2 JP 6107062 B2 JP6107062 B2 JP 6107062B2 JP 2012244643 A JP2012244643 A JP 2012244643A JP 2012244643 A JP2012244643 A JP 2012244643A JP 6107062 B2 JP6107062 B2 JP 6107062B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode layer
- base electrode
- thermistor
- pair
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007747 plating Methods 0.000 claims description 16
- 239000002243 precursor Substances 0.000 description 11
- 238000009529 body temperature measurement Methods 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000005259 measurement Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 7
- 229910052748 manganese Inorganic materials 0.000 description 6
- 229910044991 metal oxide Inorganic materials 0.000 description 6
- 150000004706 metal oxides Chemical class 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000000635 electron micrograph Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
- H01C17/283—Precursor compositions therefor, e.g. pastes, inks, glass frits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Thermistors And Varistors (AREA)
Description
Claims (3)
- 互いに略平行に延びるように対向する一対の端面と、前記一対の端面同士を接続する主面とを有する略直方体形状のサーミスタ素体と、
前記一対の端面にそれぞれ配置された一対の外部電極とを備え、
前記一対の外部電極は、四角錐台形状を呈すると共に、前記一対の端面の対向方向と交差する方向における幅が前記サーミスタ素体から離れるにつれて狭くなっており、
前記一対の外部電極はそれぞれ、前記端面上に配置された下地電極層と、前記下地電極層を覆うめっき膜とを有し、
前記下地電極層は、四角錐台形状を呈すると共に、前記対向方向と交差する方向における幅が前記サーミスタ素体以下であると共に、前記対向方向と交差する方向における幅が前記サーミスタ素体から離れるにつれて狭くなっている、チップサーミスタ。 - 前記下地電極層は多孔質状を呈する、請求項1に記載のチップサーミスタ。
- 前記下地電極層の空隙率は10%〜80%である、請求項2に記載のチップサーミスタ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012244643A JP6107062B2 (ja) | 2012-11-06 | 2012-11-06 | チップサーミスタ |
US14/061,238 US9230718B2 (en) | 2012-11-06 | 2013-10-23 | Chip thermistor |
CN201310544737.5A CN103811139B (zh) | 2012-11-06 | 2013-11-06 | 片状热敏电阻 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012244643A JP6107062B2 (ja) | 2012-11-06 | 2012-11-06 | チップサーミスタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014093483A JP2014093483A (ja) | 2014-05-19 |
JP6107062B2 true JP6107062B2 (ja) | 2017-04-05 |
Family
ID=50621816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012244643A Active JP6107062B2 (ja) | 2012-11-06 | 2012-11-06 | チップサーミスタ |
Country Status (3)
Country | Link |
---|---|
US (1) | US9230718B2 (ja) |
JP (1) | JP6107062B2 (ja) |
CN (1) | CN103811139B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018061461A1 (ja) | 2016-09-30 | 2018-04-05 | 株式会社村田製作所 | 電子部品および電子部品の製造方法 |
WO2018147014A1 (ja) * | 2017-02-08 | 2018-08-16 | パナソニックIpマネジメント株式会社 | チップ抵抗器の製造方法およびチップ抵抗器 |
JP7268393B2 (ja) * | 2019-02-22 | 2023-05-08 | 三菱マテリアル株式会社 | サーミスタの製造方法 |
DE102019122611A1 (de) * | 2019-08-22 | 2021-02-25 | Endress+Hauser SE+Co. KG | SMD-lötbares Bauelement und Verfahren zum Herstellen eines SMD-lötbaren Bauelements |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5843762Y2 (ja) * | 1979-02-15 | 1983-10-04 | ティーディーケイ株式会社 | チップ形正特性サ−ミスタ |
JPS63300507A (ja) * | 1987-05-30 | 1988-12-07 | Murata Mfg Co Ltd | 積層型セラミック電子部品の電極形成方法 |
FR2653588B1 (fr) * | 1989-10-20 | 1992-02-07 | Electro Resistance | Resistance electrique sous forme de puce a montage de surface et son procede de fabrication. |
JP3277292B2 (ja) * | 1992-03-31 | 2002-04-22 | 太陽誘電株式会社 | チップ型サーミスタ及びその製造方法 |
JPH06140278A (ja) | 1992-10-23 | 1994-05-20 | Tokin Corp | 積層セラミックコンデンサ |
US5339068A (en) * | 1992-12-18 | 1994-08-16 | Mitsubishi Materials Corp. | Conductive chip-type ceramic element and method of manufacture thereof |
JPH06231906A (ja) * | 1993-01-28 | 1994-08-19 | Mitsubishi Materials Corp | サーミスタ |
US5750264A (en) * | 1994-10-19 | 1998-05-12 | Matsushita Electric Industrial Co., Inc. | Electronic component and method for fabricating the same |
JPH09205005A (ja) * | 1996-01-24 | 1997-08-05 | Matsushita Electric Ind Co Ltd | 電子部品とその製造方法 |
JP3028069B2 (ja) * | 1997-03-10 | 2000-04-04 | 株式会社村田製作所 | サーミスタの製造方法 |
JP3555563B2 (ja) * | 1999-08-27 | 2004-08-18 | 株式会社村田製作所 | 積層チップバリスタの製造方法および積層チップバリスタ |
US6535105B2 (en) * | 2000-03-30 | 2003-03-18 | Avx Corporation | Electronic device and process of making electronic device |
KR100476158B1 (ko) * | 2000-12-11 | 2005-03-15 | 주식회사 아모텍 | 글래스 코팅막을 갖는 세라믹 칩 소자 및 그의 제조방법 |
DE102006017796A1 (de) * | 2006-04-18 | 2007-10-25 | Epcos Ag | Elektrisches Kaltleiter-Bauelement |
TW200903527A (en) * | 2007-03-19 | 2009-01-16 | Murata Manufacturing Co | Laminated positive temperature coefficient thermistor |
-
2012
- 2012-11-06 JP JP2012244643A patent/JP6107062B2/ja active Active
-
2013
- 2013-10-23 US US14/061,238 patent/US9230718B2/en not_active Expired - Fee Related
- 2013-11-06 CN CN201310544737.5A patent/CN103811139B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN103811139A (zh) | 2014-05-21 |
US9230718B2 (en) | 2016-01-05 |
US20140125448A1 (en) | 2014-05-08 |
JP2014093483A (ja) | 2014-05-19 |
CN103811139B (zh) | 2016-09-07 |
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