JPWO2016158020A1 - 半導体モジュール - Google Patents
半導体モジュール Download PDFInfo
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- JPWO2016158020A1 JPWO2016158020A1 JP2017509350A JP2017509350A JPWO2016158020A1 JP WO2016158020 A1 JPWO2016158020 A1 JP WO2016158020A1 JP 2017509350 A JP2017509350 A JP 2017509350A JP 2017509350 A JP2017509350 A JP 2017509350A JP WO2016158020 A1 JPWO2016158020 A1 JP WO2016158020A1
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Abstract
Description
特許文献1 特開2007−142472号公報
特許文献2 特開平10−200278号公報
特許文献3 特開2013−165298号公報
特許文献4 特開2012−142465号公報
特許文献5 特許第5381561号公報
特許文献6 特開2011−171686号公報
(項目1)
半導体モジュールは、回路板と、絶縁板と、金属板とが積層して構成される積層基板を備えてよい。
半導体モジュールは、回路板に搭載される半導体チップを備えてよい。
半導体モジュールは、はんだにより金属板に接合される冷却器を備えてよい。
冷却器は、金属板と接合される第1板部を有してよい。
冷却器は、第1板部と対向する第2板部を有してよい。
冷却器は、第1板部および第2板部の間に配置される複数の波型フィンを有してよい。
複数の波型フィンは、第1板部および第2板部に繋がってよい。
第1板部、第2板部、および複数の波型フィンは、冷媒が通過する流路を構成してよい。
(項目2)
複数の波型フィンのそれぞれの厚みが、0.5mm以上、0.8mm以下でよい。
(項目3)
複数の波型フィンのそれぞれの波ピッチが、2mm以上、4mm以下でよい。
(項目4)
複数の波型フィンの波角度が、20°以上、35°以下でよい。
(項目5)
金属板の厚みが、0.6mm以上、1.0mm未満でよい。
(項目6)
半導体モジュールは、硬質樹脂で構成され、半導体チップおよび積層基板を封止する樹脂部をさらに備えてよい。
金属板のはんだ接合面は、樹脂部から露出してよい。
(項目7)
金属板のはんだ接合面は、樹脂部から突出してよい。
(項目8)
金属板の厚みが、0.5mm以上、1.0mm未満でよい。
(項目9)
金属板が、絶縁板に接合される金属層と、金属層に接合される第1ヒートスプレッダで構成されてよい。
(項目10)
回路板が、絶縁板に接合される回路層と、回路層に接合される第2ヒートスプレッダで構成されてよい。
なお、上記の発明の概要は、本発明の必要な特徴の全てを列挙したものではない。また、これらの特徴群のサブコンビネーションもまた、発明となりうる。
[数1]
ΔεpNf b=C
Claims (10)
- 回路板と、絶縁板と、金属板とが積層して構成される積層基板と、
前記回路板に搭載される半導体チップと、
はんだにより前記金属板に接合される冷却器と、
を備え、
前記冷却器は、
前記金属板と接合される第1板部と、
前記第1板部と対向する第2板部と、
前記第1板部および前記第2板部の間に配置される複数の波型フィンと、
を有し、
前記複数の波型フィンは、前記第1板部および前記第2板部に繋がっており、
前記第1板部、前記第2板部、および前記複数の波型フィンで、冷媒が通過する流路を構成する
半導体モジュール。 - 前記複数の波型フィンのそれぞれの厚みが、0.5mm以上、0.8mm以下である請求項1に記載の半導体モジュール。
- 前記複数の波型フィンのそれぞれの波ピッチが、2mm以上、4mm以下である請求項1または2に記載の半導体モジュール。
- 前記複数の波型フィンの波角度が、20°以上、35°以下である請求項1から3のいずれか一項に記載の半導体モジュール。
- 前記金属板の厚みが、0.6mm以上、1.0mm未満である請求項1から4のいずれか一項に記載の半導体モジュール。
- 硬質樹脂で構成され、前記半導体チップおよび前記積層基板を封止する樹脂部をさらに備え、
前記金属板のはんだ接合面は、前記樹脂部から露出している請求項1から5のいずれか一項に記載の半導体モジュール。 - 前記金属板のはんだ接合面は、前記樹脂部から突出している請求項6に記載の半導体モジュール。
- 前記金属板の厚みが、0.5mm以上、1.0mm未満である請求項7に記載の半導体モジュール。
- 前記金属板が、前記絶縁板に接合される金属層と、前記金属層に接合される第1ヒートスプレッダで構成される請求項1から8のいずれか一項に記載の半導体モジュール。
- 前記回路板が、前記絶縁板に接合される回路層と、前記回路層に接合される第2ヒートスプレッダで構成される請求項1から9のいずれか一項に記載の半導体モジュール。
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JP2015075001 | 2015-04-01 | ||
JP2015075001 | 2015-04-01 | ||
PCT/JP2016/053873 WO2016158020A1 (ja) | 2015-04-01 | 2016-02-09 | 半導体モジュール |
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JP2019207897A (ja) * | 2016-09-29 | 2019-12-05 | 三菱電機株式会社 | パワーモジュール、その製造方法および電力変換装置 |
WO2020031753A1 (ja) * | 2018-08-09 | 2020-02-13 | 富士電機株式会社 | 冷却器、半導体モジュール |
JP7200549B2 (ja) * | 2018-08-30 | 2023-01-10 | 富士電機株式会社 | 冷却装置、半導体モジュールおよび車両 |
JP7139862B2 (ja) * | 2018-10-15 | 2022-09-21 | 株式会社デンソー | 半導体装置 |
WO2021200992A1 (ja) | 2020-03-31 | 2021-10-07 | 住友精密工業株式会社 | 熱交換システムおよび熱交換器のフィン構造 |
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US20170207145A1 (en) | 2017-07-20 |
CN107078115A (zh) | 2017-08-18 |
US9978664B2 (en) | 2018-05-22 |
CN107078115B (zh) | 2019-11-08 |
WO2016158020A1 (ja) | 2016-10-06 |
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