WO2013147240A1 - 流路部材およびこれを用いた熱交換器ならびに半導体装置 - Google Patents
流路部材およびこれを用いた熱交換器ならびに半導体装置 Download PDFInfo
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- WO2013147240A1 WO2013147240A1 PCT/JP2013/059707 JP2013059707W WO2013147240A1 WO 2013147240 A1 WO2013147240 A1 WO 2013147240A1 JP 2013059707 W JP2013059707 W JP 2013059707W WO 2013147240 A1 WO2013147240 A1 WO 2013147240A1
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- flow path
- side wall
- bottom plate
- path member
- wall portion
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a flow path member, a heat exchanger using the same, and a semiconductor device.
- Such a semiconductor device is not limited to being mounted on a vehicle, but many of them repeatedly generate large currents and generate heat to a high temperature. Therefore, forced cooling is necessary to prevent the function of the semiconductor element from being deteriorated.
- Patent Document 1 discloses an in-vehicle inverter device (using a flow path member) in which a cooler having a laminated aluminum nitride layer having excellent thermal conductivity and a cooling flow path inside is used as a cooling means for a semiconductor device that becomes high temperature. Semiconductor device).
- Patent Document 1 forms a flow path through which a fluid flows by a laminated body in which aluminum nitride thin plates are laminated, the laminated body is joined by screwing. If it is installed near the engine, the semiconductor device is subjected to a severe thermal cycle, and the thermal stress accompanying this thermal cycle loosens the screwing of the laminate (broken channel) and seals the channel. There was a problem that the property was easily impaired.
- the present invention has been devised in order to solve the above-described problem, and even when thermal stress is generated in the flow path member, the flow path member capable of suppressing breakage of the flow path, a heat exchanger using the same, and
- An object of the present invention is to provide a semiconductor device.
- the flow path member of the present invention includes a lid body portion, a bottom plate portion, a partition wall portion and a side wall portion provided between the lid body portion and the bottom plate portion, and the lid body portion, the partition wall portion, and the The side wall portion and the bottom plate portion constitute a flow path through which fluid flows, and at least one of the lid portion and the bottom plate portion has at least one part of the partition wall portion and the side wall portion. It is characterized in that it is inserted and directly joined.
- the heat exchanger according to the present invention is characterized by including the flow path member having the above-described configuration and a metal member provided on the lid portion of the flow path member.
- the semiconductor device of the present invention is characterized in that a semiconductor element is provided on the metal member of the heat exchanger having the above-described configuration.
- the lid body part, the partition wall part, the side wall part, and the bottom plate part form a flow path through which fluid flows, and at least one of the lid body part and the bottom plate part includes a partition wall. Since at least one part of the part and the side wall part enters and is directly joined, even if thermal stress occurs in the flow path member, the partition part and the joint part of each member constituting the flow path A joint part in which at least one part of the side wall part enters and is directly joined is not easily broken, and the airtightness of the flow path can be improved.
- the heat exchanger of this invention can perform heat exchange with a cover body part and a metal member efficiently. And a heat exchanger with high heat exchange efficiency.
- the semiconductor device of the present invention is a semiconductor device that suppresses a temperature rise due to heat generation of the semiconductor element with a simple structure because the semiconductor element is provided on the metal member of the heat exchanger having the above configuration. Can do.
- FIG. 1B is a partial cross-sectional view taken along line XX shown in FIG. 1A.
- FIG. 1B is a partial cross-sectional view taken along line XX shown in FIG. 1A. It is the fragmentary sectional view which expanded the C section enclosed with the broken line of FIG. 1B. It is the fragmentary sectional view which expanded the C section enclosed with the broken line of FIG. 1C. It is the fragmentary sectional view which expanded the part corresponded to the C section enclosed with the broken line of FIG. 1B which shows another example of the flow-path member of this embodiment.
- FIG. 2 is a cross-sectional view showing an example in which a housing housing semiconductor device in which the semiconductor device of the present embodiment is housed in a housing is installed on a heating element, in which a bottom plate portion of a flow path member and the housing are integrated. It is sectional drawing which shows an example which installed the housing
- FIG. 1A is a perspective view of a flow path member of the present embodiment.
- 1B and 1C are partial sectional views taken along line XX shown in FIG. 1A.
- FIG. 1D is an enlarged partial cross-sectional view of a portion C surrounded by a broken line in FIG. 1B.
- FIG. 1E is an enlarged partial cross-sectional view of a portion C surrounded by a broken line in FIG. 1C.
- the flow path member 1 of the present embodiment includes a lid body portion 2, a bottom plate portion 4, a partition wall portion 3b provided between the lid body portion 2 and the bottom plate portion 4, and An internal space that is configured by the side wall portion 3 and is surrounded by the lid body portion 2, the partition wall portion 3b, the side wall portion 3, and the bottom plate portion 4 serves as a flow path 5 for flowing a fluid such as gas or liquid.
- At least one of the partition wall portion 3b and the side wall portion 3 enters and is directly joined to at least one of the lid body portion 2 and the bottom plate portion 4. .
- the direct bonding means that at least one of the partition wall portion 3b and the side wall portion 3 is directly bonded to at least one of the lid portion 2 and the bottom plate portion 4, for example, the bonding portion 8
- the bonding portion 8 This refers to a joint having no elastic body such as an O-ring or adhesive.
- a part of the bottom surface side of the side wall part 3 and the partition wall part 3 b constituting the flow path 5 enters inside the surface constituting the flow path wall of the bottom plate part 4. It is directly joined with.
- a part of the upper surface side of the side wall part 3 and the partition part 3b penetrates into the inner side from the surface which comprises the flow path wall of the cover part 2, and is joined directly. Has been.
- FIG. 2A and 2B show another mode in which a part of the bottom surface side of the side wall portion 3 constituting the flow path 5 enters the bottom plate portion 4, and FIG. 2A shows a portion A surrounded by a broken line.
- 2B shows an example in which the bottom plate portion 4 is partially protruded, and a part of the bottom surface side of the side wall portion 3 enters a recess formed in the protruded region.
- FIG. 2B is a broken line.
- a convex part is provided at one end of the side wall part 3
- a concave part is provided on the surface of the opposite bottom plate part 4
- the convex part at one end of the side wall part 3 enters the concave part of the bottom plate part 4.
- An example is shown.
- the same configuration can be adopted on the side of the lid portion 2 of the side wall portion 3, and the same configuration as that of the side wall portion 3 can be adopted for the partition wall portion 3 b.
- the sintered member used as the partition part 3b and the side wall part 3 is prepared first.
- the lid body part 2 and the bottom plate part 4 are formed into a desired shape with a powder material having a melting point lower than that of the partition wall part 3 b and the side wall part 3.
- a melt of a low melting point material is formed into a desired shape by injection molding or the like.
- the partition part 3b and the side wall part 3 previously prepared are combined so as to be sandwiched between the lid part 2 and the bottom plate part 4, and then fired at a desired temperature in a pressurized state, whereby the lid part 2 and the bottom plate
- the flow path member 1 in which the portion 4, the partition wall portion 3b, and the side wall portion 3 are directly joined can be obtained.
- the lid 2 and the bottom plate 4 use a material having a lower melting point than the partition 3b and the side wall 3 prepared in advance, the firing temperature is determined from the melting points of the partition 3b and the side wall 3.
- part of the partition wall portion 3b and the side wall portion 3 enters the lid body portion 2 and the bottom plate portion 4 and is directly joined thereto.
- the lid portion 2 and the bottom plate portion 4 are made of a metal or resin such as copper or aluminum as a material having a relatively low melting point.
- the lid body portion 2 and the bottom plate portion 4 can be made of a resin as a material having a relatively low melting point.
- the flow path member 1 of the present embodiment is directly joined to at least one of the lid portion 2 and the bottom plate portion 4 with at least one of the partition wall portion 3b and the side wall portion 3 entering. .
- the partition wall portion 3b and the side wall portion 3 enters and is joined. It can suppress that it breaks and the gap
- the sealing performance of the flow path 5 can be improved and the pressure of the fluid flowing in the flow path 5 can be increased, so that the cooling capacity can be increased.
- FIG. 3A and 3B show still another example of the flow path member of the present embodiment
- FIG. 3A is an enlarged partial cross-sectional view of a portion corresponding to a C portion surrounded by a broken line in FIG. 1B
- FIG. 2 is an enlarged partial cross-sectional view of a portion corresponding to a portion C surrounded by a broken line in FIG. 1C.
- a plurality of concave portions are provided at one end of the side wall portion 3, and at least a part of the lid body portion 2 and the bottom plate portion 4 corresponds to the concave portions. It is preferable that the convex part is provided and the concave part enters the convex part and is joined.
- the partition wall portion 3b is not shown in FIGS. 3A and 3B, but the partition wall portion 3b is similarly provided with a recess at one end thereof, and the recess is formed on the lid body portion 2 and the bottom plate portion 4. At least a part of the protrusions can enter and be joined.
- each joint portion 8 includes a plurality of concave portions in the partition wall portion 3b and the side wall portion 3, and is attached to the lid body portion 2 and the bottom plate portion 4.
- a two-stage joint configuration comprising a plurality of convex portions corresponding to the concave portions, and the concave portions of the partition wall portion 3b and the side wall portion 3 entering and joining the corresponding convex portions of the lid body portion 2 and the bottom plate portion 4 Is taking. Therefore, it is possible to have a stronger anchor effect at the joint 8 and to suppress the destruction of the joint 8 that is the most vulnerable to thermal stress. Thereby, the sealing performance of the flow path 5 can be improved and the pressure of the fluid flowing in the flow path 5 can be increased, so that the cooling capacity can be increased.
- the size of the recesses provided in the partition wall portion 3b and the side wall portion 3 is, for example, an equivalent circle diameter when the width dimension of the partition wall portion 3b and the side wall portion 3 is 1 to 20 mm, and the partition wall portion 3b and the side wall portion 3 It is preferable that the width dimension is in the range of 100,000 to 1 / 1,000,000, and the depth is in the range of 0.1 to 10 ⁇ m. Since a plurality of such recesses are provided uniformly over the entire bonding surface of the partition wall portion 3b and the side wall portion 3, stress can be distributed over the entire bonding surface and the bonding strength can be increased.
- the convex portion may have a size corresponding to the concave portion.
- the joint portion 8 of the lid portion 2 and the bottom plate portion 4 does not have a deteriorated layer, whereby the original strength of each member can be ensured and a decrease in the joint strength can be suppressed.
- the altered layer refers to a layer in which, for example, when a resin is used as each member, the property of the bonding strength is deteriorated due to the resin being thermally welded.
- ceramics is used as part of the material of the flow path member and the thermal conductivity is improved by removing the glassy component of the surface layer by applying heat to improve heat dissipation characteristics, it is called an altered layer. Instead, it shall be called a modified layer.
- the flow path member 1 of the present embodiment is more flexible when at least one of the partition wall portion 3b and the side wall portion 3 of the lid portion 2 and the bottom plate portion 4 enters and is directly joined. It is preferable to consist of materials. With such a configuration, when an electronic component such as a semiconductor element is mounted on a highly rigid ceramic substrate or the like further provided above the lid portion 2 or below the bottom plate portion 4, the electronic component and the flow path It is possible to suppress the problem of peeling due to the difference in thermal expansion from the member 1 and the occurrence of a large warp in response to the electronic component of the lid portion 2 or the bottom plate portion 4. Therefore, the burden on each joint portion 8 of the lid portion 2 and the bottom plate portion 4, the side wall portion 3 and the partition wall portion 3b can be reduced.
- examples of the flexible material that can be used as the lid portion 2 and the bottom plate portion 4 include resin materials and metal materials.
- an inflexible material can be used as the material of the partition wall portion 3b and the side wall portion 3.
- a resin material as the material of the partition wall portion 3b and the side wall portion 3
- a highly rigid ceramic, a resin composite ceramic, or a metal material can be used.
- the cover part 2 and the baseplate part 4 are metal materials, as a material of the partition part 3b and the side wall part 3, metal materials, such as copper and aluminum, or ceramics may be sufficient.
- the lid part 2 and the bottom plate part 4 may be a metal foil, and in the case of stainless steel or titanium other than copper, aluminum, or an alloy thereof, it is more preferable because it has particularly high chemical resistance. .
- the partition wall portion 3b and the side wall portion 3 are made of ceramics or a metal material and the lid body portion 2, the partition wall portion 3b, the side wall portion 3 and the bottom plate portion 4 are pressure bonded, the partition wall portion 3b and the side wall portion 3 are used.
- the partition wall portion 3b and the side wall portion 3 are used.
- the flow path member 1 can be made high.
- POM polyoxymethylene
- ABS acrylonitrile butadiene styrene
- PA polypropylene
- PE Polyethylene
- PMMA polymethyl methacrylate
- PET polyethylene terephthalate
- PEI polyetherimide resin
- PBT polybutylene terephthalate resin
- PA polyamide resin
- PAI polyamideimide resin
- PPS polyphenylene sulfide resin
- PEEK polyether ether ketone
- PTFE polytetrafluoroethylene fluororesin
- the ceramic material constituting the partition wall portion 3b and the side wall portion 3 may be alumina, silicon nitride, aluminum nitride, silicon carbide, zirconia, and a composite thereof, all of which are heat resistant and chemical resistant. If the heat conductivity is preferred, silicon carbide, aluminum nitride, and silicon nitride are preferable. If the low-cost and high-strength flow path member 1 is used, alumina or silicon carbide is preferable.
- the resin material of the cover part 2 or the baseplate part 4 is resin with high heat conductivity. It is preferable that Thereby, the heat generated in the heating element is efficiently transferred to the fluid flowing inside the flow path member 1, and the flow path member 1 with higher heat exchange efficiency can be obtained.
- the resin material having high thermal conductivity a resin to which a filler having high thermal conductivity is added is preferable, and the thermal conductivity may be in the range of 15 to 30 W / m ⁇ K.
- the filler body 2 and the bottom plate portion 4 only need to use alumina, aluminum nitride, boron nitride, or the like as a main component, and the insulating properties are not required.
- a metal such as tin, aluminum, magnesium, silver, manganese and copper may be used as the filler.
- a resin material having high thermal conductivity is used as the lid portion 2 or the bottom plate portion 4 of the flow path member 1, and the flow path member 1 is incorporated in a heat exchanger or a semiconductor device, and these are disposed in a high-temperature environment.
- the hardness of the partition wall portion 3 b and the side wall portion 3 is harder than the hardness of the lid body portion 2 and the bottom plate portion 4.
- the partition wall portion 3b and the side wall portion 3 are ceramics having an alumina content of 96% by mass and the bottom plate portion 4 is a polycarbonate resin
- the partition wall portion 3b, the side wall portion 3, the lid body portion 2, and the bottom plate portion. 4 is flat
- the pressure applied at the time of bonding may be about 1 MPa
- a recess of about 5 to 10 ⁇ m is obtained at the bonding portion 8 in the lid portion 2 and the bottom plate portion 4.
- the larger the dent amount the higher the effect of suppressing the destruction of the joint 8 due to the pressure of the fluid, but even if the dent amount is small, the probability of channel breakage is significantly reduced compared to when there is no dent. it can.
- a base such as sodium hydroxide is preliminarily formed on a portion to be the joint portion 8 of the partition wall portion 3b and the side wall portion 3. After immersion in an aqueous solution and pretreatment, a plurality of fine recesses are formed by electrochemical treatment etching.
- the non-flexible material is a ceramic
- a method of uniformly dispersing spherical resin particles by a known method for producing a porous body into a ceramic slurry and molding it may be used.
- a plurality of recesses can be formed at a site to be the joint 8 by firing at a predetermined temperature.
- the non-flexible material may be alumina.
- the glass component such as silica is removed by immersing only the portion to be the joint portion 8 in the hydrofluoric acid solution, and a gap serving as a concave portion is obtained between the alumina particles only in the surface layer necessary for the joint.
- the concave portion may be formed by removing glass components such as silica by surface irradiation with laser light.
- the thermal resistance of the joint portion with the opposing metal material or resin material can be reduced.
- the removed portion may be regarded as a modified layer, not a deteriorated layer.
- partition wall portions 3b and the side wall portion 3 are placed in the mold, and the resin or metal obtained by melting the lid body portion 2 and the bottom plate portion 4 is injection molded. If it shape
- the joint portion 8 between the flexible member and the non-flexible member obtained in this manner is a non-flexible member at least one of the lid portion 2 and the bottom plate portion 4 that are flexible members. At least one part of the partition wall part 3b and the side wall part 3 enters and is directly joined, and each joint part 8 includes at least one part of the partition wall part 3b and the side wall part 3 provided with a plurality of recesses.
- a two-stage joining configuration in which at least one convex portion of the portion 2 and the bottom plate portion 4 enters and is joined can be achieved.
- the bonding part 8 is more It can have a strong anchor effect and can suppress the joint 8 from being destroyed by thermal stress.
- the heating elements When the heating elements are mounted above the lid part 2 or below the bottom plate part 4, if these are resin, it may be a highly thermally conductive resin for transferring heat to the flow path member 1.
- resin if these are resin, it may be a highly thermally conductive resin for transferring heat to the flow path member 1.
- the molten resin that becomes the highly thermally conductive resin is disposed in the mold so that the members that become the side wall portion 3 and the partition wall portion 3b are disposed in the mold and the joint portion 8 with the lid portion 2 and the bottom plate portion 4.
- PPS, PTFE or PAI resin having a heat resistance of at least 200 ° C. and a melting point of about 230 ° C. or more, for example, tin and magnesium or manganese, silver, copper, aluminum, etc.
- the low melting point metal alloy powder added with the above members is added, and injection molding is performed at a temperature equal to or higher than these melting points, so that the lid portion 2 and the bottom plate portion 4 of the high thermal conductive resin, the partition wall portion 3b and the side wall portion Thus, the flow path member 1 can be joined to the flow path member 1.
- the thermal conductivity is controlled by the amount of metal powder added to the molten resin, the flow of the resin will be worsened by the added metal powder and the moldability will be worsened, but the amount of metal powder added will be reduced and high thermal conductivity will be achieved. Can be obtained by increasing the aspect ratio of the metal powder, or by controlling the temperature at the time of injection molding near the melting point of the metal powder, so that the major axis direction of the metal filler can be oriented, and therefore low amount Even if the metal powder is added, a heat transfer path can be formed between the metal fillers to obtain a highly thermally conductive resin. In particular, the fact that the major axis direction of the metal filler is substantially perpendicular to the joint portion 8 can be accommodated by the design of the mold structure and the gate position.
- FIG. 4A is a perspective view showing still another example of the flow path member of the present embodiment
- FIG. 4B is a plan view showing a part of the laminated body of the flow path member.
- the flow path member 21 of the present embodiment includes a plurality of plate-like bodies 7 (here, three layers) in which at least one of the partition wall portion 3b and the side wall portion 3 is formed of a ceramic layer.
- the example which consists of the plate-shaped body 7 is shown.) It consists of the laminated body which was laminated
- the complicated flow path 5 can be easily formed, and any of heat resistance, chemical resistance, and pressure resistance can be achieved.
- a rich channel member 21 can be obtained.
- the flow path 5 is a simple shape, it can be easily processed by extrusion molding or the like, but if the shape of the flow path 5 when viewed in plan is a complicated shape such as a wavy line, It is difficult to process, and even when the width between the flow paths 5 is narrow, it may be difficult to ensure heat resistance, chemical resistance, and pressure resistance. Therefore, when it is intended to provide the channel 5 having such a shape, a through-hole 5a to be a desired channel 5 is formed on a flat plate of an unfired ceramic green sheet, and this is laminated and fired. Thus, the partition wall portion 3b and the side wall portion 3 which are laminates obtained by laminating the plate-like bodies 7 of the ceramic layer may be produced.
- FIG. 5A shows still another example of the flow path member of the present embodiment, and is a side view of a state in which a lid portion, a partition wall portion, a side wall portion, and a bottom plate portion constituting the flow path member are fastened with screws.
- FIG. 5B is a side view of a state where it is fastened with a caulking member.
- the flow path member 41 shown in FIG. 5B joins both ends in the longitudinal direction of the lid 2, the partition 3 b, the side wall 3, and the bottom plate 4 by the caulking member 12.
- the partition wall portion 3b and the side wall portion 3 in which the plate-like body 7 of the ceramic layer is integrated is obtained by laminating and firing ceramic green sheets has been described.
- the plate-like body 7 may be overlapped, and the lid body portion 2 and the bottom plate portion 4 may be sandwiched and joined together and fixed together by screwing or caulking members.
- FIG. 6 is a perspective view of a heat exchanger in which a metal member is provided on the lid portion of the flow path member, showing an example of the heat exchanger of the present embodiment.
- the heat exchanger 101 of the present embodiment is provided with a metal member 102 on the lid body portion 2 of the flow path member 1 of the present embodiment.
- the bottom plate portion 4 is made of a flexible material. Since the metal member is provided on the lid part 2, heat exchange between the lid part 2 and the metal member 102 can be performed efficiently, and a heat exchanger with high heat exchange efficiency can be obtained. . And since the baseplate part 4 consists of a flexible material, even when a thermal stress repeatedly generate
- FIG. 7 is a perspective view of a semiconductor device in which a semiconductor element is mounted on a heat exchanger, showing an example of the semiconductor device of this embodiment.
- the semiconductor device 201 of the present embodiment has the semiconductor element 202 mounted on the heat exchanger 101 of the present embodiment, the heat stress generated by the semiconductor device 201 itself is repeatedly applied from the fluid, fluid, or external environment. Even when it occurs, the heat exchanger 101 that can absorb and reduce thermal stress is used, so that the flow path 5 is prevented from being destroyed, and the fluid and the semiconductor flowing through the flow path 5 via the heat exchanger 101 Since the element 202 has high heat exchange efficiency, the temperature of the semiconductor element 202 can be efficiently reduced.
- FIG. 8A shows an example in which a housing housing semiconductor device in which the semiconductor device of this embodiment is housed in a housing is installed on a heating element, and a cross-sectional view in which a bottom plate portion and a housing of a flow path member are individually formed.
- 8B is a cross-sectional view in which the bottom plate portion of the flow path member and the housing are integrated
- FIG. 8C is a cross-sectional view showing a modification of the flow path member in which fins are housed in the flow path.
- a housing housing semiconductor device 211 of this embodiment shown in FIG. 8A is obtained by housing and covering the semiconductor device 201 using the flow path member 1 of this embodiment in the housing 13.
- a storage semiconductor device 211 is disposed on the heating element 301.
- the heat conductivity of the bottom plate portion 4 of the flow path member 1 is lower than the heat conductivity of the side wall portion 3, and the signal terminal 15 connected to the semiconductor element 202.
- all of the semiconductor device 201 including the flow path member 1 excluding the fluid supply pipe and the discharge pipe (not shown), or at least the bottom plate portion 4 and the side wall portion 3 of the flow path member 1 It is preferable to cover with a housing 13 made of a low thermal conductivity material equivalent to the portion 4.
- the housing 13 for example, the resin material used in the above-described bottom plate portion 4 can be used.
- the casing 13 and the bottom plate portion 4 and the side wall portion 3 of the flow path member 1 pick up heat from the heating element 301. It can suppress receiving. Thereby, it can suppress that ambient heat influences the fluid which flows through the flow-path member 1, and it can be set as the housing
- FIG 8B shows a modified example of the flow path member 1 of the present embodiment described above, and the bottom plate portion 14 of the casing 13 replaces the bottom plate portion of the flow path member 51.
- the housing housing semiconductor device 212 of this embodiment is disposed on the heating element 301.
- the thermal conductivity of the bottom plate portion 14 of the housing 13 that also serves as the bottom plate portion of the flow path member 51 is preferably lower than the thermal conductivity of the side wall portion 3.
- the bottom plate portion 14 and the side wall portion 3 of the housing 13 that also serves as the bottom plate portion of the flow path member 51 pick up the heat of the heating element 301. It can suppress receiving. Thereby, it is possible to suppress the influence of ambient heat on the fluid flowing through the flow path member 51, and the housing-encased semiconductor device 212 with high heat exchange efficiency can be obtained.
- FIG. 8C shows a further modification of the flow path member 1 of the present embodiment described above, and the bottom plate portion 24 of the housing 13 is the bottom plate portion of the flow path member 61. Furthermore, a plurality of plate-like fins 16 protruding into the flow path 5 are joined to the surface of the partition wall portion 3b, and the housing-encased semiconductor device 213 of this embodiment is mounted on the heating element 301. It is arranged.
- the fins 16 are a plurality of square fins or square fins including a long ellipse (oval shape) in cross section or a rectangle or rhombus, and a metal such as aluminum or copper having high thermal conductivity. It is preferably formed of a plate or a ceramic plate such as aluminum nitride, silicon carbide, or silicon nitride and connected to the lid portion 2 through a metal having high thermal conductivity so as to be capable of heat transfer.
- casing accommodation semiconductor device 213 of this embodiment WHEREIN: It is preferable that the heat conductivity of the baseplate part 24 of the housing
- the housing-storing semiconductor device 213 configured as described above is disposed on the heating element 301, the bottom plate portion 24 and the side wall portion 3 of the housing 13, which also serves as the bottom plate portion of the flow path member 61, heat the heating element 301. Therefore, it is possible to suppress the influence of ambient heat on the fluid flowing through the flow path member 61, and the housing-containing semiconductor device 213 with high heat exchange efficiency can be obtained.
- the fins 16 may be provided by being bonded to the surfaces of the bottom plate portions 4, 14, and 24 of the respective housing housing semiconductor devices 211, 212, and 213.
- the bottom plate portions 4, 14, and 24 are in contact with the surface of the joining side end portion of the fin 16 even at the joint portion with the bottom plate portions 4, 14, and 24.
- the joint strength of the joint portion between the bottom plate portions 4, 14, 24 and the fins 16 is increased, and the solid flow path members 1, 51, 61 can be obtained.
- the metal member 102 is directly provided on the upper surface of the lid portion 2.
- a highly insulating member for example, a ceramic thin plate, aluminum that has been subjected to electrolytic treatment of aluminum to form an alumina oxide film on the surface is used.
- a metal member coated with a highly heat-resistant resin such as a thin plate, polyimide, or a metal member coated with glass may be used by interposing between the lid portion 2 and the metal member 102.
Abstract
Description
2:蓋体部、2a:内面
3:側壁部、3b:隔壁部、
4,14,24:底板部
5:流路、5a:貫通孔
7:板状体
8:接合部
9:ねじ孔
10:ねじ
12:かしめ部材
13:筐体
16:フィン
101:熱交換器
102:金属部材
201:半導体装置
202:半導体素子
211,212,213:筐体収納半導体装置
301:発熱体
Claims (7)
- 蓋体部と底板部と、前記蓋体部と前記底板部との間に設けられた隔壁部および側壁部とを備え、
前記蓋体部と前記隔壁部と前記側壁部と前記底板部とで内部に流体が流れる流路を構成してなり、
前記蓋体部および前記底板部のうち少なくとも一方に、前記隔壁部および前記側壁部のうち少なくとも一方の一部が入りこんで直接接合されていることを特徴とする流路部材。 - 前記蓋体部および前記底板部のうち、前記隔壁部および前記側壁部のうち少なくとも一方の一部が入り込んで直接接合されている方が可撓性材料からなることを特徴とする請求項1に記載の流路部材。
- 前記可撓性材料が樹脂材料であることを特徴とする請求項2に記載の流路部材。
- 前記樹脂材料が高熱伝導性の樹脂であることを特徴とする請求項3に記載の流路部材。
- 前記側壁部および前記隔壁部のうち少なくとも一方がセラミックスの積層体からなることを特徴とする請求項1乃至請求項4に記載の流路部材。
- 請求項1乃至請求項5のいずれかに記載の流路部材と、前記流路部材の前記蓋体部上に設けられた金属部材とを備えることを特徴とする熱交換器。
- 請求項6に記載の熱交換器の前記金属部材上に半導体素子が設けられていることを特徴とする半導体装置。
Priority Applications (5)
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US14/389,636 US20150076685A1 (en) | 2012-03-30 | 2013-03-29 | Flow path member, and heat exchanger and semiconductor device using the same |
CN201380018428.2A CN104247008A (zh) | 2012-03-30 | 2013-03-29 | 流路构件和使用该流路构件的换热器以及半导体装置 |
JP2014508217A JP5968425B2 (ja) | 2012-03-30 | 2013-03-29 | 流路部材およびこれを用いた熱交換器ならびに半導体装置 |
KR1020147027603A KR20140142269A (ko) | 2012-03-30 | 2013-03-29 | 유로 부재 및 이것을 사용한 열교환기와 반도체 장치 |
EP13767597.1A EP2833402A1 (en) | 2012-03-30 | 2013-03-29 | Flow path member, and heat exchanger and semiconductor device using same |
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JP2012079114 | 2012-03-30 | ||
JP2012-079114 | 2012-03-30 |
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US (1) | US20150076685A1 (ja) |
EP (1) | EP2833402A1 (ja) |
JP (1) | JP5968425B2 (ja) |
KR (1) | KR20140142269A (ja) |
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Also Published As
Publication number | Publication date |
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CN104247008A (zh) | 2014-12-24 |
KR20140142269A (ko) | 2014-12-11 |
JPWO2013147240A1 (ja) | 2015-12-14 |
JP5968425B2 (ja) | 2016-08-10 |
US20150076685A1 (en) | 2015-03-19 |
EP2833402A1 (en) | 2015-02-04 |
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