JPWO2014157134A1 - 実装方法および実装装置 - Google Patents

実装方法および実装装置 Download PDF

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JPWO2014157134A1
JPWO2014157134A1 JP2015508510A JP2015508510A JPWO2014157134A1 JP WO2014157134 A1 JPWO2014157134 A1 JP WO2014157134A1 JP 2015508510 A JP2015508510 A JP 2015508510A JP 2015508510 A JP2015508510 A JP 2015508510A JP WO2014157134 A1 JPWO2014157134 A1 JP WO2014157134A1
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Prior art keywords
mounting
chip component
chip
bonding
substrate
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JP2015508510A
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Japanese (ja)
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寺田　勝美
勝美 寺田
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Toray Engineering Co Ltd
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Toray Engineering Co Ltd
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    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
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JP2015508510A 2013-03-28 2014-03-25 実装方法および実装装置 Pending JPWO2014157134A1 (ja)

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JP2013069628 2013-03-28
JP2013069628 2013-03-28
PCT/JP2014/058178 WO2014157134A1 (ja) 2013-03-28 2014-03-25 実装方法および実装装置

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KR (1) KR102232636B1 (ko)
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WO2016152661A1 (ja) * 2015-03-20 2016-09-29 東レエンジニアリング株式会社 ボンディングツール冷却装置およびこれを備えたボンディング装置ならびにボンディングツール冷却方法
US10285317B2 (en) 2015-06-15 2019-05-07 Fuji Corporation Component mounter
JP6705668B2 (ja) * 2016-03-11 2020-06-03 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP2017183616A (ja) * 2016-03-31 2017-10-05 東レエンジニアリング株式会社 ボンディングツール冷却装置およびこれを備えたボンディング装置ならびにボンディングツール冷却方法
KR20180072035A (ko) 2016-12-20 2018-06-29 삼성전자주식회사 본딩 장치
JP6781677B2 (ja) * 2017-08-01 2020-11-04 芝浦メカトロニクス株式会社 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法
WO2020022345A1 (ja) * 2018-07-24 2020-01-30 株式会社新川 電子部品実装装置
KR102493189B1 (ko) * 2018-10-09 2023-01-30 야마하하쓰도키 가부시키가이샤 부품 실장 장치
JP6667879B1 (ja) * 2018-12-19 2020-03-18 アサヒ・エンジニアリング株式会社 電子部品の実装装置
KR102122042B1 (ko) * 2019-02-19 2020-06-26 세메스 주식회사 칩 본더 및 이를 갖는 기판 처리 장치
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TWI619181B (zh) 2018-03-21
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