WO2016152661A1 - ボンディングツール冷却装置およびこれを備えたボンディング装置ならびにボンディングツール冷却方法 - Google Patents
ボンディングツール冷却装置およびこれを備えたボンディング装置ならびにボンディングツール冷却方法 Download PDFInfo
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- WO2016152661A1 WO2016152661A1 PCT/JP2016/058232 JP2016058232W WO2016152661A1 WO 2016152661 A1 WO2016152661 A1 WO 2016152661A1 JP 2016058232 W JP2016058232 W JP 2016058232W WO 2016152661 A1 WO2016152661 A1 WO 2016152661A1
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- bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Definitions
- the present invention relates to a bonding tool cooling device and a bonding tool cooling method for a bonding apparatus that heats and presses a semiconductor chip component on a circuit board for mounting.
- thermocompression bonding method As a method of mounting a semiconductor chip component on a circuit board, a thermocompression bonding method, a soldering method, or the like is used.
- a ceramic heater provided in the bonding tool is heated at a high speed, and the thermosetting resin film or thermosetting resin paste filled between the semiconductor chip component and the circuit board is heated and cured to perform thermocompression bonding. is doing.
- the temperature of the bonding tool is raised to the solder melting temperature, the semiconductor chip component is mounted on the circuit board, and then cooled to below the solid phase temperature to mount the next semiconductor chip component.
- a bonding apparatus for mounting a semiconductor chip component on a circuit board has a structure as shown in FIG.
- the bonding apparatus 1 includes a bonding tool 10 that sucks and holds a semiconductor chip component 4 and presses and heats the circuit board 2 and a substrate stage 20 that sucks and holds the circuit board 2.
- a chip slider 26 is provided between the bonding apparatus 1 and the supply unit of the semiconductor chip component 4 as a conveying means 25 for horizontally conveying the semiconductor chip component 4.
- the semiconductor chip component 4 conveyed by the chip slider 26 is delivered to the bonding tool 10.
- the bonding tool 10 has a structure as shown in FIG.
- a holder portion 11 is provided at the tip of the bonding tool 10, and a heater base 12 is fixed to the lower surface of the holder portion 11 with mounting bolts.
- a heater 14 is disposed on the lower surface of the heater base 12 via a heat insulating block 13, and the heater 14 and the heat insulating block 13 are fixed by bolts (not shown).
- An attachment tool 15 for attracting and holding the semiconductor chip component 4 is provided on the lower surface of the heater 14.
- An attachment adsorption flow path 17 is formed in the heat insulating block 13 and the heater 14, and the attachment tool 15 is sucked by vacuum through the flow path.
- a cooling air flow path 18 is formed in the heat insulation block 13, and is configured such that compressed air is supplied from a pressure air source (not shown) and air is blown onto the upper surface of the heater 14 to cool it.
- the bonding tool 10 When the attachment tool 15 receives the semiconductor chip component 4 when the attachment tool 15 receives the cooling, the bonding tool 10 is deformed by melting or softening the solder at the tip of the bump 5 of the semiconductor chip component 4 when the heater 14 receives it at a high temperature. It has been done to prevent that.
- the bonding tool 10 When the resin film is laminated on the circuit surface of the semiconductor chip component 4, the bonding tool 10 needs to be cooled in order to prevent the resin film from reacting due to high temperature and proceeding curing.
- Patent Document 1 discloses a method in which an attachment tool is brought into direct contact with a heat radiating member and cooled by heat propagation as a method for increasing the cooling time of the heater.
- the cooling method described in Patent Document 1 requires a step in which the bonding tool is raised after the bonding is finished, the substrate stage is moved to a position where the bonding tool is brought into contact with the heat radiating member unit, and the bonding tool is lowered and cooled.
- these extra tact times are required and the production efficiency is lowered.
- the attachment tool is brought into contact with the heat radiating member, problems of durability and contamination due to wear also occur.
- an object of the present invention is to provide a bonding tool cooling apparatus capable of efficiently cooling a bonding tool in a non-contact manner, a bonding apparatus including the bonding tool, and a bonding tool cooling method.
- a bonding tool cooling device for cooling a bonding tool comprising an attachment tool for sucking and holding semiconductor chip parts, a heater for heating the attachment tool, and a suction mechanism for sucking and holding the attachment tool on the heater, It is the bonding tool cooling device provided with the cooling device which consists of an injection port which injects gas perpendicularly
- the invention according to claim 2 is the invention according to claim 1,
- the said cooling device is a bonding tool cooling device provided in the conveyance means which conveys a semiconductor chip component in a horizontal direction.
- the invention according to claim 3 is the invention according to claim 2,
- the transporting means is a bonding tool cooling device for transporting the semiconductor chip component to a height between the recognition means for recognizing the image of the semiconductor chip component and the bonding tool.
- Claim 4 is provided with the bonding tool cooling device in any one of Claims 1-3, A bonding apparatus that heats and presses the semiconductor chip component and mounts it on a circuit board using the bonding tool.
- the bonding apparatus includes a plurality of bonding tools, and the bonding tool cooling apparatus has a function of cooling another bonding tool when one bonding tool mounts the semiconductor chip component on a substrate.
- a bonding tool cooling method for cooling a bonding tool comprising an attachment tool for sucking and holding semiconductor chip parts, a heater for heating the attachment tool, and a suction mechanism for sucking and holding the attachment tool on the heater, After the attachment tool has bonded the semiconductor chip component to the circuit board and then lifted and is waiting to supply the semiconductor chip component, Move the conveying means to convey the semiconductor chip parts below the attachment tool, By injecting gas in the vertical direction from the gas injection port of the cooling device provided in the conveying means, This is a bonding tool cooling method for cooling the attachment tool surface.
- the bonding tool can be efficiently cooled in a short time without contact. Moreover, since it cools in a non-contact manner, there is no wear or contamination of the attachment tool. Since the gas is injected perpendicularly to the attachment surface, the pressure applied to the attachment tool surface can be maximized, so that the cooling efficiency can be increased.
- the cooling device is provided in the conveying means for conveying the semiconductor chip component, the semiconductor chip component can be supplied to the attachment tool immediately after the bonding tool is cooled, and the delivery time is shortened. Is done.
- the transport means transports the semiconductor chip component to a height between the recognition means for recognizing the image of the semiconductor chip component and the bonding tool, the semiconductor chip component is transferred to the bonding tool. It can be performed at the shortest distance and the delivery time can be shortened.
- one bonding tool mounts a semiconductor chip component on a substrate and simultaneously cools another bonding tool, continuous mounting without a cooling waiting time becomes possible.
- the transport means for transporting the semiconductor chip component is attached to the attachment tool.
- the attachment tool surface is cooled by moving it below the tool and injecting gas in the vertical direction from the gas injection port of the cooling device provided in the transport means, so that the bonding tool can be efficiently used in a short time without contact. Can be cooled.
- FIG. 1 is a schematic side view of a bonding apparatus according to an embodiment of the present invention. It is a schematic plan view of the conveying means of the present invention. It is an operation
- the direction toward the bonding apparatus 1 is the X axis as the left-right direction, the Y axis as the front direction, the Z axis as the axis perpendicular to the XY plane composed of the X axis and the Y axis, Is the ⁇ direction.
- the bonding apparatus 1 includes a bonding tool 10 that presses and heats a semiconductor chip component 4 (hereinafter referred to as a chip component 4) to a circuit board 2, a substrate stage 20 that holds the circuit board 2 by suction, and a chip component 4 that is bonded to the circuit board 2.
- 10 includes a conveying means 25 that horizontally conveys to 10, a recognition means 30 that recognizes an image of alignment marks attached to the chip component 4 and the circuit board 2, and a control unit 50 that controls the entire bonding apparatus 1.
- the bonding tool 10 has the structure shown in FIG. 5 and is composed of the members described in the background art.
- the conveying means 25 includes a chip slider 26 and a conveying rail 27 that horizontally convey the chip component 4 from the chip supply unit to the lower side of the attachment tool 15.
- the chip slider 26 conveys semiconductor chip components to a height between the bonding tool 10 and the recognition means 30.
- FIG. 2 shows a state in which the chip slider 26 is referenced from the upper side in the Z direction.
- the chip slider 26 is provided with a chip adsorbing portion 28 for adsorbing and holding the chip component 4 and a plurality of jet outlets 29 for ejecting air supplied from a compressed air source (not shown).
- the ejection port 29 of the chip slider 26 functions as a bonding tool cooling device by ejecting air perpendicularly to the attachment tool surface.
- a gas such as an inert gas such as nitrogen or argon may be used.
- the chip slider 26 of the transport means 25 transports the chip component 4 to the lower side of the bonding tool 10, and the bonding tool 10 descends to pick up the chip component 4 from the chip slider 26 (step ST01).
- the chip slider 26 moves to the chip component supply unit, and the bonding tool 10 moves up to the standby position.
- the recognition means 30 is inserted between the circuit board 2 and the bonding tool 10.
- the recognizing means recognizes the image of the alignment mark attached to the chip component 4 and the circuit board 2 (step ST02).
- step ST03 the bonding tool 10 and the substrate stage 20 are aligned based on data obtained by image recognition by the recognition means 30 (step ST03).
- step ST04 the bonding tool 10 is lowered (step ST04).
- step ST05 the heater 14 of the bonding tool 10 is heated to bond the chip component 4 to the circuit board 2 (step ST05).
- step ST06 the bonding tool 10 is raised to the standby position.
- cooling air is supplied to the cooling air flow path 18 provided in the bonding tool 10 to start the internal cooling of the heater 14 (step ST07).
- the air injection port 29 of the chip slider 26 is moved to the lower side of the bonding tool 10, and air is injected from the injection port 29 to start surface cooling of the attachment tool 15. (Step ST09).
- the chip slider 26 moves in a state where the chip component 4 to be bonded next is adsorbed by the chip adsorbing portion 28.
- step ST10 it is confirmed whether or not the heater 14 has reached an appropriate temperature.
- a temperature at which the heater 14 does not melt the solder for example, 150 ° C. or less is an appropriate temperature.
- step ST11 the cooling air for cooling the inside of the heater 14 is stopped and the injection of air from the injection port 29 of the chip slider 26 is stopped.
- step ST12 the chip slider 26 is moved so that the chip component 4 is positioned below the attachment tool 15 (step ST12).
- step ST13 the bonding tool 10 is lowered, and the chip component 4 is picked up from the chip slider 26 (step ST13).
- step ST02 the bonding of the chip component 4 and the cooling of the bonding tool 10 are repeated sequentially.
- the nozzle 29 for jetting air is provided in the chip slider 26 that horizontally conveys the chip component 4 and the attachment tool 15 is cooled by blowing air from the lower side as the chip component 4 is conveyed,
- the bonding tool 10 can be efficiently cooled by the contact.
- the conveying means 25 of the bonding apparatus 1 shown in FIG. 1 may be used for a bonding apparatus having a plurality of bonding tools, and enables efficient operation.
- FIG. 6 One example thereof is shown in FIG. 6 as another embodiment.
- the bonding apparatus 100 in FIG. 6 includes two bonding tools, a bonding tool 10A and a bonding tool 10B.
- one chip slider 26 supplies the chip component 4 to both bonding tools.
- the bonding tool 10A and the bonding tool 10B have the same structure as the bonding tool 10 shown in FIGS.
- FIG. 7 shows a perspective view of the conveying means 25.
- the bonding tool 10B can bond the chip component 4 to the circuit board 2 at the same time as the attachment tool 15A of the bonding tool 10A is cooled by the ejection port of the chip slider 26.
- FIG. 8 shows the operations of the bonding tool 10A and the bonding tool 10B and the position of the chip slider 26 during each operation in the bonding apparatus 100 of FIG.
- STA01 to STA12 representing the operation steps of the bonding tool 10A and STB01 to STB12 representing the operation steps of the bonding tool 10B are the same operation steps as ST01 to ST12 of (bonding tool 10) shown in FIG.
- the bonding apparatus 100 while one bonding tool is cooling, the other bonding tool performs a bonding operation starting from the pickup of the chip component 4.
- the bonding tool performs bonding, and continuous bonding without cooling waiting time can be realized.
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- Engineering & Computer Science (AREA)
- Wire Bonding (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
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Abstract
Description
半導体チップ部品を吸着保持するアタッチメントツールと、アタッチメントツールを加熱するヒータと、アタッチメントツールをヒータに吸着保持する吸着機構とを備えるボンディングツールを冷却するボンディングツール冷却装置であって、
アタッチメントツール面に垂直に気体を噴射する噴射口からなる冷却装置を備えたボンディングツール冷却装置である。
前記冷却装置が、半導体チップ部品を水平方向に搬送する搬送手段に設けられているボンディングツール冷却装置である。
前記搬送手段が、半導体チップ部品を画像認識する認識手段とボンディングツールの間の高さに半導体チップ部品を搬送するボンディングツール冷却装置である。
前記ボンディングツールを用いて、前記半導体チップ部品を加熱および押圧して回路基板に実装するボンディング装置である。
複数のボンディングツールを備え、1つのボンディングツールが前記半導体チップ部品を基板に実装しているときに、前記ボンディングツール冷却装置が他のボンディングツールを冷却する機能を有するボンディング装置である。
半導体チップ部品を吸着保持するアタッチメントツールと、アタッチメントツールを加熱するヒータと、アタッチメントツールをヒータに吸着保持する吸着機構とを備えるボンディングツールを冷却するボンディングツール冷却方法であって、
アタッチメントツールが半導体チップ部品を回路基板にボンディングした後、上昇し半導体チップ部品の供給を待機している際に、
半導体チップ部品を搬送する搬送手段をアタッチメントツールの下方に移動させて、
搬送手段に設けられた冷却装置の気体の噴射口より垂直方向に気体を噴射させて、
アタッチメントツール面を冷却するボンディングツール冷却方法である。
2 回路基板
3 電極
4 半導体チップ部品(チップ部品)
5 バンプ
10、10A、10B ボンディングツール
11 ホルダー部
12 ヒータベース
13 断熱ブロック
14 ヒータ
15 アタッチメントツール
16 チップ吸着用流路
17 アタッチメント吸着用流路
18 冷却エアー流路
20 基板ステージ
25 搬送手段
26 チップスライダ
27 搬送レール
28 チップ吸着部
29 噴出口
30 認識手段
50 制御部
Claims (6)
- 半導体チップ部品を吸着保持するアタッチメントツールと、アタッチメントツールを加熱するヒータと、アタッチメントツールをヒータに吸着保持する吸着機構とを備えるボンディングツールを冷却するボンディングツール冷却装置であって、
アタッチメントツール面に垂直に気体を噴射する噴射口からなる冷却装置を備えたボンディングツール冷却装置。 - 請求項1に記載の発明において、
前記冷却装置が、半導体チップ部品を水平方向に搬送する搬送手段に設けられているボンディングツール冷却装置。 - 請求項2に記載の発明において、
前記搬送手段が、半導体チップ部品を画像認識する認識手段とボンディングツールの間の高さに半導体チップ部品を搬送するボンディングツール冷却装置。 - 請求項1から請求項3に記載のいずれかのボンディングツール冷却装置を備え、
前記ボンディングツールを用いて、前記半導体チップ部品を加熱および押圧して回路基板に実装するボンディング装置。 - 請求項4に記載のボンディング装置であって、
複数のボンディングツールを備え、1つのボンディングツールが前記半導体チップ部品を基板に実装しているときに、前記ボンディングツール冷却装置が他のボンディングツールを冷却する機能を有するボンディング装置。 - 半導体チップ部品を吸着保持するアタッチメントツールと、アタッチメントツールを加熱するヒータと、アタッチメントツールをヒータに吸着保持する吸着機構とを備えるボンディングツールを冷却するボンディングツール冷却方法であって、
アタッチメントツールが半導体チップ部品を回路基板にボンディングした後、上昇し半導体チップ部品の供給を待機している際に、
半導体チップ部品を搬送する搬送手段をアタッチメントツールの下方に移動させて、
搬送手段に設けられた冷却装置の気体の噴射口より垂直方向に気体を噴射させて、
アタッチメントツール面を冷却するボンディングツール冷却方法。
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JP2017508263A JP6778676B2 (ja) | 2015-03-20 | 2016-03-16 | ボンディングツール冷却装置およびこれを備えたボンディング装置ならびにボンディングツール冷却方法 |
KR1020177029802A KR102452411B1 (ko) | 2015-03-20 | 2016-03-16 | 본딩 툴 냉각 장치 및 이것을 구비한 본딩 장치 및 본딩 툴 냉각 방법 |
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WO2012165313A1 (ja) * | 2011-05-27 | 2012-12-06 | 東レエンジニアリング株式会社 | 実装方法および実装装置 |
WO2014157134A1 (ja) * | 2013-03-28 | 2014-10-02 | 東レエンジニアリング株式会社 | 実装方法および実装装置 |
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JPS574129A (en) * | 1980-06-09 | 1982-01-09 | Mitsubishi Electric Corp | Die-bonding device for semiconductor element |
JP2839673B2 (ja) * | 1990-08-31 | 1998-12-16 | 株式会社東芝 | ボンディングツールのクリーニング方法およびクリーニング装置 |
JP2006120657A (ja) * | 2004-10-19 | 2006-05-11 | Matsushita Electric Ind Co Ltd | 半導体製造装置および方法 |
JP4808283B1 (ja) * | 2010-06-30 | 2011-11-02 | 株式会社新川 | 電子部品実装装置及び電子部品実装方法 |
JP2014007328A (ja) * | 2012-06-26 | 2014-01-16 | Shibuya Kogyo Co Ltd | ボンディング装置 |
TWI576196B (zh) | 2012-12-05 | 2017-04-01 | Shinkawa Kk | The cooling method of the joining tool cooling device and the joining tool |
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WO2012165313A1 (ja) * | 2011-05-27 | 2012-12-06 | 東レエンジニアリング株式会社 | 実装方法および実装装置 |
WO2014157134A1 (ja) * | 2013-03-28 | 2014-10-02 | 東レエンジニアリング株式会社 | 実装方法および実装装置 |
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JPWO2016152661A1 (ja) | 2018-01-11 |
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