JPWO2014054590A1 - ローラコンベア及び板状体の検査装置、並びにガラス板の製造装置 - Google Patents
ローラコンベア及び板状体の検査装置、並びにガラス板の製造装置 Download PDFInfo
- Publication number
- JPWO2014054590A1 JPWO2014054590A1 JP2014539735A JP2014539735A JPWO2014054590A1 JP WO2014054590 A1 JPWO2014054590 A1 JP WO2014054590A1 JP 2014539735 A JP2014539735 A JP 2014539735A JP 2014539735 A JP2014539735 A JP 2014539735A JP WO2014054590 A1 JPWO2014054590 A1 JP WO2014054590A1
- Authority
- JP
- Japan
- Prior art keywords
- glass plate
- flow path
- liquid
- cleaning
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011521 glass Substances 0.000 title claims description 116
- 238000007689 inspection Methods 0.000 title claims description 44
- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 239000011347 resin Substances 0.000 claims abstract description 96
- 229920005989 resin Polymers 0.000 claims abstract description 96
- 239000007788 liquid Substances 0.000 claims abstract description 89
- 238000005096 rolling process Methods 0.000 claims abstract description 53
- 238000004140 cleaning Methods 0.000 claims description 65
- 238000001035 drying Methods 0.000 claims description 38
- 238000005520 cutting process Methods 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 8
- 230000002265 prevention Effects 0.000 claims description 5
- 239000006060 molten glass Substances 0.000 claims description 4
- 230000032258 transport Effects 0.000 claims description 2
- 239000000428 dust Substances 0.000 description 34
- 238000000034 method Methods 0.000 description 25
- 238000005498 polishing Methods 0.000 description 23
- 230000008569 process Effects 0.000 description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 19
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 12
- 239000004810 polytetrafluoroethylene Substances 0.000 description 12
- -1 polytetrafluoroethylene Polymers 0.000 description 7
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 230000001174 ascending effect Effects 0.000 description 5
- 239000004519 grease Substances 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000007500 overflow downdraw method Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000006124 Pilkington process Methods 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000669 Chrome steel Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000003673 groundwater Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
- B24B9/102—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass for travelling sheets
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C33/00—Parts of bearings; Special methods for making bearings or parts thereof
- F16C33/30—Parts of ball or roller bearings
- F16C33/58—Raceways; Race rings
- F16C33/62—Selection of substances
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C33/00—Parts of bearings; Special methods for making bearings or parts thereof
- F16C33/30—Parts of ball or roller bearings
- F16C33/66—Special parts or details in view of lubrication
- F16C33/6637—Special parts or details in view of lubrication with liquid lubricant
- F16C33/6659—Details of supply of the liquid to the bearing, e.g. passages or nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Rollers For Roller Conveyors For Transfer (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012222761 | 2012-10-05 | ||
JP2012222761 | 2012-10-05 | ||
PCT/JP2013/076582 WO2014054590A1 (ja) | 2012-10-05 | 2013-09-30 | ローラコンベア及び板状体の検査装置、並びにガラス板の製造装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2014054590A1 true JPWO2014054590A1 (ja) | 2016-08-25 |
Family
ID=50434917
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014539735A Withdrawn JPWO2014054590A1 (ja) | 2012-10-05 | 2013-09-30 | ローラコンベア及び板状体の検査装置、並びにガラス板の製造装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2014054590A1 (zh) |
KR (1) | KR20150066530A (zh) |
CN (2) | CN104703898A (zh) |
TW (1) | TW201420525A (zh) |
WO (1) | WO2014054590A1 (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203994992U (zh) * | 2014-05-16 | 2014-12-10 | 日东电工株式会社 | 玻璃基板搬送装置 |
CN106458459A (zh) * | 2014-05-21 | 2017-02-22 | 夏普株式会社 | 搬运装置和湿式处理装置 |
JPWO2017086257A1 (ja) * | 2015-11-17 | 2018-08-30 | Agc株式会社 | 薄板状体の搬送方法、装置、及びガラス薄板状体製品の製造方法 |
CN105905563B (zh) * | 2016-06-20 | 2018-10-12 | 昆山国显光电有限公司 | 辊子擦拭装置 |
WO2019070654A2 (en) * | 2017-10-06 | 2019-04-11 | Corning Incorporated | APPARATUS AND METHOD FOR PROCESSING GLASS SHEET |
FR3075375A1 (fr) * | 2017-12-19 | 2019-06-21 | Saint-Gobain Glass France | Systeme d’inspection a nettoyage ameliore |
CN108589022B (zh) * | 2018-07-02 | 2023-12-05 | 海安国洋机械科技有限公司 | 金属纤维拉断喷射装置 |
JP2020040757A (ja) * | 2018-09-07 | 2020-03-19 | 日本電気硝子株式会社 | ガラス板の製造装置、及びガラス板の製造方法 |
BR112021006936A2 (pt) * | 2018-10-12 | 2021-07-20 | Saint-Gobain Glass France | esteira rolante para chapas de vidro |
KR102111370B1 (ko) * | 2018-10-22 | 2020-05-15 | 주식회사 모션퀘스트 | 글라스 이송 장치용 롤러 |
KR102008142B1 (ko) * | 2019-03-04 | 2019-08-08 | (주)엠에스솔루션 | 기판 이송 장치의 원터치 캡 결합형 베어링 홀더 |
DE102019210063B4 (de) * | 2019-07-09 | 2021-05-20 | NICE Solar Energy GmbH | Substratfördereinrichtung, Vakuumbehandlungsvorrichtung mit einer Substratfördereinrichtung und Verfahren zum Fördern eines Substrats |
JP2023165241A (ja) * | 2022-05-02 | 2023-11-15 | 日本電気硝子株式会社 | ガラス製品の製造方法及び製造装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03283487A (ja) * | 1990-03-30 | 1991-12-13 | Shibaura Eng Works Co Ltd | 基板搬送装置の発塵防止装置 |
JPH06156678A (ja) * | 1992-11-21 | 1994-06-03 | Dainippon Screen Mfg Co Ltd | 基板搬送装置の発塵防止装置 |
JPH11230178A (ja) * | 1998-02-17 | 1999-08-27 | Nippon Seiko Kk | 円筒ころ軸受装置 |
JP2002347928A (ja) * | 2001-05-23 | 2002-12-04 | Sumitomo Precision Prod Co Ltd | 基板処理装置 |
JP2008082547A (ja) * | 2006-08-28 | 2008-04-10 | Ntn Corp | 転がり軸受の潤滑方法 |
JP2009519881A (ja) * | 2005-12-16 | 2009-05-21 | コーニング インコーポレイテッド | ガラスシートを仕上げる方法および装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2172270Y (zh) * | 1993-06-23 | 1994-07-20 | 张世昭 | 带式输送机用脲醛塑料托辊 |
JP3364016B2 (ja) * | 1994-08-19 | 2003-01-08 | 三菱重工業株式会社 | 冷凍機用スクロール型圧縮機 |
JPH0864564A (ja) * | 1994-08-22 | 1996-03-08 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH11108066A (ja) * | 1997-10-01 | 1999-04-20 | Nippon Seiko Kk | 循環給油軸受装置 |
JP2001341827A (ja) * | 2000-05-31 | 2001-12-11 | Canon Inc | 枚葉式洗浄機および枚葉式洗浄機に用いられるローラーコンベア用の中間軸受け |
JP2003314544A (ja) * | 2002-04-18 | 2003-11-06 | Hitachi Ltd | 磁気ディスク装置 |
JP4562424B2 (ja) * | 2004-05-25 | 2010-10-13 | 三機工業株式会社 | ホイールコンベヤ |
JP2006214461A (ja) * | 2005-02-01 | 2006-08-17 | Maruyasu Kikai Kk | 軸受装置及びそれを用いたローラコンベヤ |
JP2009083699A (ja) * | 2007-10-01 | 2009-04-23 | Jtekt Corp | 車輪支持装置 |
CN101381195A (zh) * | 2008-08-05 | 2009-03-11 | 河南安飞电子玻璃有限公司 | 玻璃板生产中熔融玻璃流量控制装置及控制方法 |
JP5444667B2 (ja) * | 2008-09-08 | 2014-03-19 | 日本電気硝子株式会社 | ガラス板付着液体除去装置及びガラス板付着液体除去方法 |
JP5428811B2 (ja) * | 2009-12-04 | 2014-02-26 | 凸版印刷株式会社 | 基板乾燥方法、基板乾燥装置、基板の製造方法、及びフラットパネルディスプレイ |
CN202030662U (zh) * | 2011-03-15 | 2011-11-09 | 山东寿光第一建筑有限公司 | 一种立式中空玻璃加工装置 |
-
2013
- 2013-09-30 CN CN201380052211.3A patent/CN104703898A/zh active Pending
- 2013-09-30 JP JP2014539735A patent/JPWO2014054590A1/ja not_active Withdrawn
- 2013-09-30 WO PCT/JP2013/076582 patent/WO2014054590A1/ja active Application Filing
- 2013-09-30 KR KR1020157008606A patent/KR20150066530A/ko not_active Application Discontinuation
- 2013-09-30 CN CN201610631566.3A patent/CN106271957A/zh active Pending
- 2013-10-04 TW TW102136097A patent/TW201420525A/zh unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03283487A (ja) * | 1990-03-30 | 1991-12-13 | Shibaura Eng Works Co Ltd | 基板搬送装置の発塵防止装置 |
JPH06156678A (ja) * | 1992-11-21 | 1994-06-03 | Dainippon Screen Mfg Co Ltd | 基板搬送装置の発塵防止装置 |
JPH11230178A (ja) * | 1998-02-17 | 1999-08-27 | Nippon Seiko Kk | 円筒ころ軸受装置 |
JP2002347928A (ja) * | 2001-05-23 | 2002-12-04 | Sumitomo Precision Prod Co Ltd | 基板処理装置 |
JP2009519881A (ja) * | 2005-12-16 | 2009-05-21 | コーニング インコーポレイテッド | ガラスシートを仕上げる方法および装置 |
JP2008082547A (ja) * | 2006-08-28 | 2008-04-10 | Ntn Corp | 転がり軸受の潤滑方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20150066530A (ko) | 2015-06-16 |
WO2014054590A1 (ja) | 2014-04-10 |
CN106271957A (zh) | 2017-01-04 |
TW201420525A (zh) | 2014-06-01 |
CN104703898A (zh) | 2015-06-10 |
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