JPWO2012043313A1 - 素子収納用パッケージ、およびこれを用いた電子装置 - Google Patents
素子収納用パッケージ、およびこれを用いた電子装置 Download PDFInfo
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- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 14
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- 238000001816 cooling Methods 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
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- 239000002904 solvent Substances 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
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- 239000010937 tungsten Substances 0.000 description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
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- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BYDQGSVXQDOSJJ-UHFFFAOYSA-N [Ge].[Au] Chemical compound [Ge].[Au] BYDQGSVXQDOSJJ-UHFFFAOYSA-N 0.000 description 1
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- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 1
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- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
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- 230000017525 heat dissipation Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- Engineering & Computer Science (AREA)
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
本発明の一実施形態に係る素子収納用パッケージは、上面に半導体素子9が設けられる載置部1aを有する基体1と、基体1上に載置部1aを取り囲むように設けられた、側壁を切り欠いて形成された切欠き部2bを有する枠体2と、半導体素子9に電気的に接続される配線導体層3aを有する、切欠き部2bに取り付けられた入出力端子3と、枠体2の上部に設けられたシールリング5と、を備えている。さらに、枠体2の側壁は、隣り合った側壁同士の外側の角部2cが曲面形状であって、平面視して角部2cがシールリング5と重なる領域内に収まっている。
ここで、素子収納用パッケージ、およびこれを用いた電子装置の製造方法を説明する。基体1は、例えば、鉄−ニッケル−コバルト合金を型枠に鋳込んで作製したインゴットを周知の切削加工や打ち抜き加工等の金属加工法を用いて所定形状にして製作される。また、枠体2は、例えば、鉄−ニッケル−コバルト合金を型枠に鋳込んで作製したインゴットを周知の切削加工や打ち抜き加工等の金属加工法を用いて、角部2cや貫通孔2aおよび切欠き部2bを設けて製作される。
本実施形態に係る変形例1の素子収納用パッケージでは、図4に示すように、シールリング5は、平面視したときに、外形が枠体2の外形以上の大きさであり、枠体2の切欠き部2bに取り付けられた入出力端子3の上面よりも外方に張り出して設けられていてもよい。ここで、図4の斜線の個所が、枠体2のシールリング5から露出した部分exである。また、図5は、シールリング5に斜線を入れて、シールリング5が入出力端子3の上面よりも外方に張り出している状態の要部拡大図である。なお、入出力端子3の上面とは、入出力端子3を構成している立壁部の上面をいう。
本実施形態に係る変形例2の素子収納用パッケージでは、図6に示すように、シールリング5は、平面視したときに、外形が枠体2の外形以上の大きさであり、枠体2の貫通孔2aを有する側壁よりも外方に張り出して設けられていてもよい。ここで、図6の斜線の個所が、枠体2のシールリング5から露出した部分exである。また、図7は、シールリング5に斜線を入れて、シールリング5が枠体2の貫通孔2aを有する側壁よりも外方に張り出している状態の要部拡大図である。
Claims (6)
- 上面に半導体素子が設けられる載置部を有する基体と、
前記基体上に前記載置部を取り囲むように設けられた、側壁を切り欠いて形成された切欠き部を有する枠体と、
前記半導体素子に電気的に接続される配線導体層を有する、前記切欠き部に取り付けられた入出力端子と、
前記枠体の上部に設けられたシールリングと、を備えており、
前記枠体の側壁は、平面視して隣り合った側壁同士の外側の角部が曲面形状であって、前記角部が平面視して前記シールリングと重なる領域内に収まっていることを特徴とする素子収納用パッケージ。 - 請求項1に記載の素子収納用パッケージであって、
前記シールリングは、平面視したときの外形が矩形枠状であって、平面視して前記シールリングで囲まれる領域に前記枠体の上部の一部が露出していることを特徴とする素子収納用パッケージ。 - 請求項2に記載の素子収納用パッケージであって、
前記枠体の側壁は、平面視して隣り合った側壁同士の内側の角部が曲面形状であることを特徴とする素子収納用パッケージ。 - 請求項3に記載の素子収納用パッケージであって、
前記枠体の露出した前記一部は、平面視して前記枠体の外側の角部と前記枠体の内側の角部との間に挟まれた個所に位置していることを特徴とする素子収納用パッケージ。 - 請求項4に記載の素子収納用パッケージであって、
前記枠体の側壁のうち前記切欠き部が設けられた側壁と隣接する側壁は、平面視して前記枠体の外形と前記シールリングの外形とが一致することを特徴とする素子収納用パッケージ。 - 請求項1ないし請求項5のいずれかに記載の素子収納用パッケージと、
前記素子収納用パッケージの前記載置部に設けられた半導体素子と、
前記素子収納用パッケージの前記シールリング上に設けられた蓋体と、を備えたことを特徴とする電子装置。
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JP2012536361A JP5570609B2 (ja) | 2010-09-28 | 2011-09-21 | 素子収納用パッケージ、およびこれを用いた電子装置 |
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EP (1) | EP2624293B1 (ja) |
JP (1) | JP5570609B2 (ja) |
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JP5743748B2 (ja) * | 2011-06-29 | 2015-07-01 | 京セラ株式会社 | 素子収納用パッケージおよびこれを備えたモジュール |
JP6010394B2 (ja) * | 2012-08-30 | 2016-10-19 | 京セラ株式会社 | 電子素子収納用パッケージおよび電子装置 |
US9462709B2 (en) * | 2012-10-29 | 2016-10-04 | Kyocera Corporation | Element housing package and mounting structure body |
EP2952944B1 (en) * | 2013-01-29 | 2019-01-09 | Kyocera Corporation | Package for housing optical semiconductor element and optical semiconductor device |
JP5981660B2 (ja) * | 2013-09-25 | 2016-08-31 | 京セラ株式会社 | 電子部品収納用パッケージおよび電子装置 |
JP2015173234A (ja) | 2014-03-12 | 2015-10-01 | 株式会社東芝 | 高周波半導体装置用パッケージおよびその製造方法、並びに高周波半導体装置 |
EP3118895B1 (en) * | 2014-03-13 | 2020-04-01 | Kyocera Corporation | Package for housing an electronic component and electronic device including the package |
JP5943985B2 (ja) * | 2014-10-30 | 2016-07-05 | 三菱電機株式会社 | 電子制御装置 |
JP5882507B1 (ja) * | 2015-01-19 | 2016-03-09 | 株式会社フジクラ | 光電変換素子 |
KR102172630B1 (ko) * | 2015-04-16 | 2020-11-04 | 삼성전기주식회사 | 반도체 소자 패키지 및 그 제조방법 |
JP6397127B2 (ja) * | 2015-05-20 | 2018-09-26 | 京セラ株式会社 | 半導体素子パッケージ、半導体装置および実装構造体 |
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JP6913276B2 (ja) * | 2017-01-26 | 2021-08-04 | 日本電気硝子株式会社 | 気密パッケージ |
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-
2011
- 2011-09-21 US US13/813,406 patent/US9237662B2/en not_active Expired - Fee Related
- 2011-09-21 JP JP2012536361A patent/JP5570609B2/ja not_active Expired - Fee Related
- 2011-09-21 CN CN201180022124.4A patent/CN102884618B/zh not_active Expired - Fee Related
- 2011-09-21 EP EP11828870.3A patent/EP2624293B1/en not_active Not-in-force
- 2011-09-21 WO PCT/JP2011/071413 patent/WO2012043313A1/ja active Application Filing
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US9237662B2 (en) | 2016-01-12 |
EP2624293A4 (en) | 2016-08-31 |
EP2624293B1 (en) | 2018-03-07 |
JP5570609B2 (ja) | 2014-08-13 |
CN102884618B (zh) | 2015-07-22 |
EP2624293A1 (en) | 2013-08-07 |
WO2012043313A1 (ja) | 2012-04-05 |
US20130128489A1 (en) | 2013-05-23 |
CN102884618A (zh) | 2013-01-16 |
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