JPS62217645A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS62217645A
JPS62217645A JP61059481A JP5948186A JPS62217645A JP S62217645 A JPS62217645 A JP S62217645A JP 61059481 A JP61059481 A JP 61059481A JP 5948186 A JP5948186 A JP 5948186A JP S62217645 A JPS62217645 A JP S62217645A
Authority
JP
Japan
Prior art keywords
pellet
base
film
cap
dam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61059481A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0528906B2 (cg-RX-API-DMAC7.html
Inventor
Toshio Hamano
浜野　寿夫
Shigeo Natsume
棗　茂夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP61059481A priority Critical patent/JPS62217645A/ja
Priority to DE8787400612T priority patent/DE3782071T2/de
Priority to KR1019870002470A priority patent/KR900003829B1/ko
Priority to EP87400612A priority patent/EP0238418B1/en
Publication of JPS62217645A publication Critical patent/JPS62217645A/ja
Priority to US07/333,810 priority patent/US4999319A/en
Publication of JPH0528906B2 publication Critical patent/JPH0528906B2/ja
Granted legal-status Critical Current

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP61059481A 1986-03-19 1986-03-19 半導体装置の製造方法 Granted JPS62217645A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP61059481A JPS62217645A (ja) 1986-03-19 1986-03-19 半導体装置の製造方法
DE8787400612T DE3782071T2 (de) 1986-03-19 1987-03-19 Verfahren zur herstellung von halbleiterbauelemente mit gehaeusestruktur.
KR1019870002470A KR900003829B1 (ko) 1986-03-19 1987-03-19 패케이지 구조를 갖는 반도체장치 제조방법
EP87400612A EP0238418B1 (en) 1986-03-19 1987-03-19 Method of manufacturing semiconductor device having package structure
US07/333,810 US4999319A (en) 1986-03-19 1989-04-06 Method of manufacturing semiconductor device having package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61059481A JPS62217645A (ja) 1986-03-19 1986-03-19 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS62217645A true JPS62217645A (ja) 1987-09-25
JPH0528906B2 JPH0528906B2 (cg-RX-API-DMAC7.html) 1993-04-27

Family

ID=13114541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61059481A Granted JPS62217645A (ja) 1986-03-19 1986-03-19 半導体装置の製造方法

Country Status (5)

Country Link
US (1) US4999319A (cg-RX-API-DMAC7.html)
EP (1) EP0238418B1 (cg-RX-API-DMAC7.html)
JP (1) JPS62217645A (cg-RX-API-DMAC7.html)
KR (1) KR900003829B1 (cg-RX-API-DMAC7.html)
DE (1) DE3782071T2 (cg-RX-API-DMAC7.html)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5264393A (en) * 1988-11-25 1993-11-23 Fuji Photo Film Co., Ltd. Solid state image pickup device and method of manufacturing the same
US5098864A (en) * 1989-11-29 1992-03-24 Olin Corporation Process for manufacturing a metal pin grid array package
US5086018A (en) * 1991-05-02 1992-02-04 International Business Machines Corporation Method of making a planarized thin film covered wire bonded semiconductor package
US5273940A (en) * 1992-06-15 1993-12-28 Motorola, Inc. Multiple chip package with thinned semiconductor chips
JP2888040B2 (ja) * 1992-07-10 1999-05-10 日本電気株式会社 半導体装置およびその製造方法
US5663106A (en) * 1994-05-19 1997-09-02 Tessera, Inc. Method of encapsulating die and chip carrier
US5776796A (en) * 1994-05-19 1998-07-07 Tessera, Inc. Method of encapsulating a semiconductor package
US5834339A (en) 1996-03-07 1998-11-10 Tessera, Inc. Methods for providing void-free layers for semiconductor assemblies
JP3199963B2 (ja) * 1994-10-06 2001-08-20 株式会社東芝 半導体装置の製造方法
US5929517A (en) 1994-12-29 1999-07-27 Tessera, Inc. Compliant integrated circuit package and method of fabricating the same
US5723787A (en) * 1996-03-04 1998-03-03 Alliedsignal, Inc. Accelerometer mounting system
US6083768A (en) 1996-09-06 2000-07-04 Micron Technology, Inc. Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components
US6214640B1 (en) 1999-02-10 2001-04-10 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages
DE10297316T5 (de) * 2001-10-09 2004-12-09 Tessera, Inc., San Jose Gestapelte Baugruppen
US6977440B2 (en) * 2001-10-09 2005-12-20 Tessera, Inc. Stacked packages
US7335995B2 (en) * 2001-10-09 2008-02-26 Tessera, Inc. Microelectronic assembly having array including passive elements and interconnects
USD540978S1 (en) 2004-06-08 2007-04-17 The Coleman Company, Inc. Flashlight lens
CN102779910A (zh) * 2011-05-10 2012-11-14 弘凯光电股份有限公司 发光二极管封装方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3706840A (en) * 1971-05-10 1972-12-19 Intersil Inc Semiconductor device packaging
JPS50144758A (cg-RX-API-DMAC7.html) * 1974-05-09 1975-11-20
US4218701A (en) * 1978-07-24 1980-08-19 Citizen Watch Co., Ltd. Package for an integrated circuit having a container with support bars
JPS5632736A (en) * 1979-08-24 1981-04-02 Nec Corp Sealing method of hybrid integrated circuit device
DE3040867C2 (de) * 1980-10-30 1985-01-17 Telefunken electronic GmbH, 7100 Heilbronn Verfahren zur Herstellung einer Halbleiteranordnung
JPS5814545A (ja) * 1981-07-17 1983-01-27 Citizen Watch Co Ltd Ｉｃの実装方法
JPS5880845A (ja) * 1981-11-09 1983-05-16 Hitachi Ltd 固体撮像装置の製造方法
US4477828A (en) * 1982-10-12 1984-10-16 Scherer Jeremy D Microcircuit package and sealing method
JPS59145534A (ja) * 1983-02-09 1984-08-21 Matsushita Electric Ind Co Ltd 半導体デバイスの封止方法
JPS59159547A (ja) * 1983-03-03 1984-09-10 Matsushita Electric Ind Co Ltd 半導体素子の保護方法
JPS6017936A (ja) * 1983-07-12 1985-01-29 Sumitomo Bakelite Co Ltd 半導体封止用樹脂組成物
US4818812A (en) * 1983-08-22 1989-04-04 International Business Machines Corporation Sealant for integrated circuit modules, polyester suitable therefor and preparation of polyester
JPS6080258A (ja) * 1983-10-07 1985-05-08 Fuji Xerox Co Ltd 樹脂封止型半導体装置の製造方法
JPS60111431A (ja) * 1983-11-21 1985-06-17 Toshiba Corp 電子部品の製造方法
JPS60154543A (ja) * 1984-01-24 1985-08-14 Nec Corp 合成樹脂基板を用いた半導体装置
JPS60222450A (ja) * 1984-04-20 1985-11-07 Mitsui Toatsu Chem Inc リジンエステルトリイソシアナ−トの製造方法
JPS6153321A (ja) * 1984-08-23 1986-03-17 Toshiba Corp 半導体封止用エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPH0528906B2 (cg-RX-API-DMAC7.html) 1993-04-27
US4999319A (en) 1991-03-12
KR870009466A (ko) 1987-10-26
DE3782071D1 (de) 1992-11-12
EP0238418A3 (en) 1990-05-16
KR900003829B1 (ko) 1990-06-02
DE3782071T2 (de) 1993-02-11
EP0238418B1 (en) 1992-10-07
EP0238418A2 (en) 1987-09-23

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Legal Events

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