JPS62148512A - ポリフエニレンオキサイド固化物の改質法 - Google Patents
ポリフエニレンオキサイド固化物の改質法Info
- Publication number
- JPS62148512A JPS62148512A JP29123285A JP29123285A JPS62148512A JP S62148512 A JPS62148512 A JP S62148512A JP 29123285 A JP29123285 A JP 29123285A JP 29123285 A JP29123285 A JP 29123285A JP S62148512 A JPS62148512 A JP S62148512A
- Authority
- JP
- Japan
- Prior art keywords
- polyphenylene oxide
- solidified
- methacrylates
- acrylates
- modifying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004721 Polyphenylene oxide Substances 0.000 title claims abstract description 46
- 229920006380 polyphenylene oxide Polymers 0.000 title claims abstract description 46
- 230000004048 modification Effects 0.000 title 1
- 238000012986 modification Methods 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 24
- -1 ester acrylate Chemical class 0.000 claims abstract description 17
- 238000005266 casting Methods 0.000 claims abstract description 16
- 239000000178 monomer Substances 0.000 claims abstract description 16
- 229920000642 polymer Polymers 0.000 claims abstract description 15
- 238000004132 cross linking Methods 0.000 claims abstract description 13
- 239000000203 mixture Substances 0.000 claims abstract description 8
- 238000002156 mixing Methods 0.000 claims abstract description 5
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 claims abstract description 5
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims abstract description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 9
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 7
- 150000002734 metacrylic acid derivatives Chemical class 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 5
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- 229920000180 alkyd Polymers 0.000 claims description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000005060 rubber Substances 0.000 claims description 4
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 3
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 claims description 2
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 claims description 2
- 239000004641 Diallyl-phthalate Substances 0.000 claims description 2
- 239000005062 Polybutadiene Substances 0.000 claims description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 claims description 2
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 claims description 2
- 238000000354 decomposition reaction Methods 0.000 claims description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- MHCLJIVVJQQNKQ-UHFFFAOYSA-N ethyl carbamate;2-methylprop-2-enoic acid Chemical class CCOC(N)=O.CC(=C)C(O)=O MHCLJIVVJQQNKQ-UHFFFAOYSA-N 0.000 claims description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 2
- 229920002857 polybutadiene Polymers 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- QCTJRYGLPAFRMS-UHFFFAOYSA-N prop-2-enoic acid;1,3,5-triazine-2,4,6-triamine Chemical class OC(=O)C=C.NC1=NC(N)=NC(N)=N1 QCTJRYGLPAFRMS-UHFFFAOYSA-N 0.000 claims description 2
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 claims description 2
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 claims 1
- 238000002715 modification method Methods 0.000 claims 1
- 239000002904 solvent Substances 0.000 abstract description 24
- 239000000463 material Substances 0.000 abstract description 18
- 239000002994 raw material Substances 0.000 abstract description 4
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
- 239000011342 resin composition Substances 0.000 description 11
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 239000000243 solution Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- AZUYLZMQTIKGSC-UHFFFAOYSA-N 1-[6-[4-(5-chloro-6-methyl-1H-indazol-4-yl)-5-methyl-3-(1-methylindazol-5-yl)pyrazol-1-yl]-2-azaspiro[3.3]heptan-2-yl]prop-2-en-1-one Chemical compound ClC=1C(=C2C=NNC2=CC=1C)C=1C(=NN(C=1C)C1CC2(CN(C2)C(C=C)=O)C1)C=1C=C2C=NN(C2=CC=1)C AZUYLZMQTIKGSC-UHFFFAOYSA-N 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 150000008282 halocarbons Chemical class 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000013557 residual solvent Substances 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- KRDXTHSSNCTAGY-UHFFFAOYSA-N 2-cyclohexylpyrrolidine Chemical compound C1CCNC1C1CCCCC1 KRDXTHSSNCTAGY-UHFFFAOYSA-N 0.000 description 1
- NIAGUSHJWAMKBZ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;1,3,5-triazine-2,4,6-triamine Chemical class CC(=C)C(O)=O.NC1=NC(N)=NC(N)=N1 NIAGUSHJWAMKBZ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- DJEQZVQFEPKLOY-UHFFFAOYSA-N N,N-dimethylbutylamine Chemical compound CCCCN(C)C DJEQZVQFEPKLOY-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 229910000042 hydrogen bromide Inorganic materials 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000005691 oxidative coupling reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920002852 poly(2,6-dimethyl-1,4-phenylene oxide) polymer Polymers 0.000 description 1
- 229920006162 poly(etherimide sulfone) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920013637 polyphenylene oxide polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Polyethers (AREA)
- Graft Or Block Polymers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29123285A JPS62148512A (ja) | 1985-12-23 | 1985-12-23 | ポリフエニレンオキサイド固化物の改質法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29123285A JPS62148512A (ja) | 1985-12-23 | 1985-12-23 | ポリフエニレンオキサイド固化物の改質法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3346690A Division JPH02242852A (ja) | 1990-02-13 | 1990-02-13 | ポリフェニレンオキサイド固化物の改質法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62148512A true JPS62148512A (ja) | 1987-07-02 |
| JPH0310650B2 JPH0310650B2 (enrdf_load_stackoverflow) | 1991-02-14 |
Family
ID=17766183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29123285A Granted JPS62148512A (ja) | 1985-12-23 | 1985-12-23 | ポリフエニレンオキサイド固化物の改質法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62148512A (enrdf_load_stackoverflow) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5218030A (en) * | 1989-02-08 | 1993-06-08 | Asahi Kasei Kogyo Kabushiki Kaisha | Curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom |
| US5308565A (en) * | 1993-02-05 | 1994-05-03 | General Electric Company | Method of preparing modified polyphenylene oxide resin systems for electrical laminates having improved solderability and solvent resistance |
| WO2007094359A1 (ja) | 2006-02-17 | 2007-08-23 | Hitachi Chemical Co., Ltd. | セミｉｐｎ型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
| WO2008136373A1 (ja) | 2007-04-26 | 2008-11-13 | Hitachi Chemical Company, Ltd. | セミｉｐｎ型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
| JP2009035710A (ja) * | 2007-07-11 | 2009-02-19 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物、これを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
| WO2018105071A1 (ja) | 2016-12-07 | 2018-06-14 | 日立化成株式会社 | 熱硬化性樹脂組成物及びその製造方法、プリプレグ、積層板並びにプリント配線板 |
| WO2018105070A1 (ja) | 2016-12-07 | 2018-06-14 | 日立化成株式会社 | 樹脂ワニス、プリプレグ、積層板及びプリント配線板 |
| KR20190131094A (ko) | 2017-03-30 | 2019-11-25 | 히타치가세이가부시끼가이샤 | 프리프레그의 제조 방법, 프리프레그, 적층판, 프린트 배선판 및 반도체 패키지 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58167646A (ja) * | 1982-03-29 | 1983-10-03 | Mitsubishi Gas Chem Co Inc | ポリフェニレンエ−テル系樹脂フイルム |
| JPS59193929A (ja) * | 1983-04-18 | 1984-11-02 | Shin Kobe Electric Mach Co Ltd | 熱可塑性樹脂積層板の製造法 |
| JPS59204294A (ja) * | 1983-05-06 | 1984-11-19 | 日本電気株式会社 | 印刷配線板およびその製造方法 |
| JPS59204296A (ja) * | 1983-05-09 | 1984-11-19 | 昭和電工株式会社 | 印刷回路用基板 |
-
1985
- 1985-12-23 JP JP29123285A patent/JPS62148512A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58167646A (ja) * | 1982-03-29 | 1983-10-03 | Mitsubishi Gas Chem Co Inc | ポリフェニレンエ−テル系樹脂フイルム |
| JPS59193929A (ja) * | 1983-04-18 | 1984-11-02 | Shin Kobe Electric Mach Co Ltd | 熱可塑性樹脂積層板の製造法 |
| JPS59204294A (ja) * | 1983-05-06 | 1984-11-19 | 日本電気株式会社 | 印刷配線板およびその製造方法 |
| JPS59204296A (ja) * | 1983-05-09 | 1984-11-19 | 昭和電工株式会社 | 印刷回路用基板 |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5218030A (en) * | 1989-02-08 | 1993-06-08 | Asahi Kasei Kogyo Kabushiki Kaisha | Curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom |
| US5308565A (en) * | 1993-02-05 | 1994-05-03 | General Electric Company | Method of preparing modified polyphenylene oxide resin systems for electrical laminates having improved solderability and solvent resistance |
| US8568891B2 (en) | 2006-02-17 | 2013-10-29 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same |
| WO2007094359A1 (ja) | 2006-02-17 | 2007-08-23 | Hitachi Chemical Co., Ltd. | セミｉｐｎ型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
| EP2407503A1 (en) | 2006-02-17 | 2012-01-18 | Hitachi Chemical Co., Ltd. | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same |
| US8277948B2 (en) | 2006-02-17 | 2012-10-02 | Hitachi Chemical Co., Ltd. | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same |
| EP2546287A1 (en) | 2006-02-17 | 2013-01-16 | Hitachi Chemical Co., Ltd. | Thermosetting resin composition of semi-ipn composite, and varnish, prepreg and metal clad laminated board using the same |
| US8501870B2 (en) | 2006-02-17 | 2013-08-06 | Hitachi Chemical Co., Ltd. | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same |
| WO2008136373A1 (ja) | 2007-04-26 | 2008-11-13 | Hitachi Chemical Company, Ltd. | セミｉｐｎ型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
| US8404769B2 (en) | 2007-04-26 | 2013-03-26 | Hitachi Chemical Company, Ltd. | Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate |
| JP2009035710A (ja) * | 2007-07-11 | 2009-02-19 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物、これを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
| WO2018105071A1 (ja) | 2016-12-07 | 2018-06-14 | 日立化成株式会社 | 熱硬化性樹脂組成物及びその製造方法、プリプレグ、積層板並びにプリント配線板 |
| WO2018105070A1 (ja) | 2016-12-07 | 2018-06-14 | 日立化成株式会社 | 樹脂ワニス、プリプレグ、積層板及びプリント配線板 |
| KR20180080208A (ko) | 2016-12-07 | 2018-07-11 | 히타치가세이가부시끼가이샤 | 수지 바니시, 프리프레그, 적층판 및 프린트 배선판 |
| KR20190099091A (ko) | 2016-12-07 | 2019-08-23 | 히타치가세이가부시끼가이샤 | 수지 바니시, 프리프레그, 적층판 및 프린트 배선판 |
| US10940674B2 (en) | 2016-12-07 | 2021-03-09 | Showa Denko Materials Co., Ltd. | Resin varnish, prepreg, laminate, and printed wiring board |
| US11136454B2 (en) | 2016-12-07 | 2021-10-05 | Showa Denko Materials Co., Ltd. | Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring board |
| KR20190131094A (ko) | 2017-03-30 | 2019-11-25 | 히타치가세이가부시끼가이샤 | 프리프레그의 제조 방법, 프리프레그, 적층판, 프린트 배선판 및 반도체 패키지 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0310650B2 (enrdf_load_stackoverflow) | 1991-02-14 |
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