JPH0564586B2 - - Google Patents

Info

Publication number
JPH0564586B2
JPH0564586B2 JP5971987A JP5971987A JPH0564586B2 JP H0564586 B2 JPH0564586 B2 JP H0564586B2 JP 5971987 A JP5971987 A JP 5971987A JP 5971987 A JP5971987 A JP 5971987A JP H0564586 B2 JPH0564586 B2 JP H0564586B2
Authority
JP
Japan
Prior art keywords
resin composition
ppo
resin
layer
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP5971987A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63224940A (ja
Inventor
Shuji Maeda
Takaaki Sakamoto
Munehiko Ito
Takahiro Heiuchi
Takayoshi Koseki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP5971987A priority Critical patent/JPS63224940A/ja
Publication of JPS63224940A publication Critical patent/JPS63224940A/ja
Publication of JPH0564586B2 publication Critical patent/JPH0564586B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036Multilayers with layers of different types
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
JP5971987A 1987-03-15 1987-03-15 プリント配線板材料 Granted JPS63224940A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5971987A JPS63224940A (ja) 1987-03-15 1987-03-15 プリント配線板材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5971987A JPS63224940A (ja) 1987-03-15 1987-03-15 プリント配線板材料

Publications (2)

Publication Number Publication Date
JPS63224940A JPS63224940A (ja) 1988-09-20
JPH0564586B2 true JPH0564586B2 (enrdf_load_stackoverflow) 1993-09-14

Family

ID=13121292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5971987A Granted JPS63224940A (ja) 1987-03-15 1987-03-15 プリント配線板材料

Country Status (1)

Country Link
JP (1) JPS63224940A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2615196B1 (fr) * 1987-05-14 1994-03-25 Rogers Corp Composition thermodurcissable moulable contenant une resine de polyisoprene ou de polybutadiene et un elastomere thermoplastique avec facultativement une charge, procede de son faconnage et article faconne thermodurci ainsi produit
JPH10338809A (ja) * 1997-04-08 1998-12-22 Sumitomo Chem Co Ltd 低誘電率樹脂とパラ配向芳香族ポリアミドとからなる複合フィルム、そのプリプレグおよびそれらの用途
US6949289B1 (en) 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US7354641B2 (en) 2004-10-12 2008-04-08 Ppg Industries Ohio, Inc. Resin compatible yarn binder and uses thereof
CN105984180A (zh) * 2015-02-11 2016-10-05 律胜科技股份有限公司 用于高频印刷电路板的铜箔基板材及其应用

Also Published As

Publication number Publication date
JPS63224940A (ja) 1988-09-20

Similar Documents

Publication Publication Date Title
US4874826A (en) Method of preparing polyphenylene oxide composition and laminates using such compositions
JPH0583166B2 (enrdf_load_stackoverflow)
JPS63159443A (ja) 積層板
JPH03275760A (ja) ポリフェニレンオキサイド系樹脂組成物
JPH0564586B2 (enrdf_load_stackoverflow)
JP2563137B2 (ja) 難燃化ポリフェニレンオキサイド系樹脂組成物
JPH0811781B2 (ja) 賦形高誘電性ポリフェニレンオキサイド系樹脂組成物
JPS63264662A (ja) ポリフェニレンオキサイド系樹脂組成物
JPH0737567B2 (ja) 硬化性樹脂組成物並びにこれを用いた複合材料および積層体
JPH03275761A (ja) ポリフェニレンオキサイド系樹脂組成物
JP3178918B2 (ja) 硬化性樹脂組成物並びにこれを用いた複合材料及び積層体
GB2200128A (en) Crosslinkable polyphenylene oxide resin composition
JPS63156835A (ja) 積層板
JPH0562590B2 (enrdf_load_stackoverflow)
JPH01215851A (ja) 難燃化ポリフェニレンオキサイド系樹脂組成物とその金属張積層板
JPS6329598A (ja) フレキシブル回路板の実装方法
JPH04161454A (ja) ポリフェニレンオキサイド系樹脂組成物
JPH0682927B2 (ja) ポリフェニレンオキサイド樹脂系lcr多層板
JPH04239018A (ja) 新規な硬化性ポリフェニレンエーテル・エポキシ樹脂組成物並びにこれを用いた複合材料および積層体
JPS62121758A (ja) ポリフエニレンオキサイド系樹脂組成物およびこの樹脂組成物からなるシ−ト
JPS63224906A (ja) プリプレグの製法
JPH03166255A (ja) 難燃化ポリフェニレンオキサイド系樹脂組成物
JPH03165596A (ja) 多層積層板
JPS62121759A (ja) ポリフエニレンオキサイド系樹脂組成物およびこの樹脂組成物からなるシ−ト
JPH0734497B2 (ja) 高周波用積層板の製造方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees