JPH11513347A - 側部に開閉部を備える300mm微小環境ポッド - Google Patents
側部に開閉部を備える300mm微小環境ポッドInfo
- Publication number
- JPH11513347A JPH11513347A JP9515005A JP51500597A JPH11513347A JP H11513347 A JPH11513347 A JP H11513347A JP 9515005 A JP9515005 A JP 9515005A JP 51500597 A JP51500597 A JP 51500597A JP H11513347 A JPH11513347 A JP H11513347A
- Authority
- JP
- Japan
- Prior art keywords
- container
- shell
- wafer
- opening
- supports
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67396—Closed carriers characterised by the presence of antistatic elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/02—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon
- G11B33/04—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon modified to store record carriers
- G11B33/0405—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon modified to store record carriers for storing discs
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.内部に保存された対象物を損傷から保護する微小環境を形成するための容 器であって、 (a)シェルに対して対象物を挿入し取り出すための開口部を有するシェルで あって、僅かに負の電気的荷電を固有に有する材料により作製された前記シェル と、 (b)互いに平行に離間した位置で容器内に保存された複数の対象物を保持す るように共働する一対の支持体と、 (c)前記シェルに保存された対象物の汚染を阻止するために前記シェルの前 記開口部を封止する開閉部と、 (d)シェル内の粒子が、前記容器のシェルに向かって前記対象物および支持 体から吸引除去されるように、この種の支持体が接地される電気的な経路を形成 する手段と を備えることを特徴とする容器。 2.請求項1記載の容器において、容器内に保存される前記対象物が半導体ウ エハであることを特徴とする容器。 3.請求項1記載の容器において、容器の重心の対向側部に配置された一対の ハンドルをさらに備えることを特徴とする容器。 4.請求項3記載の容器において、前記ハンドルのそれぞれが、ロボットによ ってハンドルが確実に把持され得るように、整列用の切欠きを備える溝部を有す ることを特徴とする容器。 5.請求項1記載の容器において、複数のポストによって前記シェルの外側に 固定された動的結合板をさらに備え、前記動的結合板は、3つの整列用溝部を有 し、前記整列用溝部のそれぞれは、概してY字状の形状の断面を有することを特 徴とする容器。 6.請求項5記載の容器において、前記動的結合板の前記整列用溝部は、半導 体ウエハを処理するために使用される用具のポートに対して容器開閉部を整列配 置するために使用され、これにより、容器の開閉部が開放され、ウエハが処理の ために用具へとポートを介してシェルから抜き取られる前に、シェルの開口部お よび用具のポートの周りに封止体が形成されることを特徴とする容器。 7.請求項1記載の容器において、シェルの外側に固定された動的結合板をさ らに備え、前記動的結合板は、電気的に導電性の材料により作製されていること を特徴とする容器。 8.請求項7記載の容器において、支持体が接地される電気的経路を形成する ための前記手段が、前記支持体のそれぞれと前記動的結合板との間の電気的に導 電性の接続体を備えることを特徴とする容器。 9.請求項1記載の容器において、前記開閉部が、その外側表面において前記 開閉部を他の表面に結合させるための手段を備えることを特徴とする容器。 10.請求項1記載の容器において、前記支持体のそれぞれは、シェルに対し て離脱可能に固定されており、これにより、浄化または取り替えのためにこの種 の支持体を取り外すことができることを特徴とする容器。 11.請求項2記載の容器において、前記支持体が複数の溝部を有し、前記溝 部のそれぞれが、円周方向に湾曲した後側部を有することを特徴とする容器。 12.請求項11記載の容器において、円周方向における前記溝部の後側部の 曲率半径が、前記ウエハの円周方向における曲率半径と同一であることを特徴と する容器。 13.請求項2記載の容器において、前記それぞれの対の支持体が、複数のウ エハ仕切り板を備え、前記ウエハ仕切り板のそれぞれが、前記半導体ウエハの1 つの支持を助成する、連続的に変化するスロープを有することを特徴とする容器 。 14.内部に保存された対象物を損傷から保護する微小環境を形成するための 容器であって、 (a)前記シェルに対して対象物を挿入し取り出すための開口部を有するシェ ルと、 (b)互いに平行に離間して容器内に保存された複数の対象物を保持するよう に共働する一対の支持体であって、前記支持体のそれぞれが複数の溝部を有し、 前記溝部のそれぞれが後側部を有し、少なくともその一部分が円周方向に湾曲し た一対の支持体と、 (c)前記シェルに保存された対象物の汚染を阻止するために前記シェルの前 記開口部を封止する開閉部と を有することを特徴とする容器。 15.請求項14記載の容器において、それぞれの溝部の後側部の湾曲した部 分が、保存される対象物の円周方向における曲率半径と概して同一である、円周 方向の曲率半径を有することを特徴とする容器。 16.請求項14記載の容器において、前記支持体が、前記シェルに離脱可能 に固定されていることを特徴とする容器。 17.請求項14記載の容器において、前記支持体が電気的に接地される電気 的経路を設けるための手段をさらに備え、これによりシェル内の粒子が、前記容 器のシェルに向かって前記対象物および支持体から吸引除去されることを特徴と する容器。 18.請求項14記載の容器において、前記容器を他の表面に動的に結合させ るための手段をさらに備えることを特徴とする容器。 19.請求項18記載の容器において、前記容器を前記表面に動的に結合させ るための手段が、それぞれが前記表面上の別々の突起に対合する、前記容器上の 少なくとも3つの溝部を備えることを特徴とする容器。 20.請求項18記載の容器において、前記容器を前記表面に動的に結合させ るための手段が、それぞれが表面上の別々の溝部に対合する、前記容器上の少な くとも3つの突起を備えることを特徴とする容器。 21.請求項14記載の容器において、前記開閉部が、前記一対の支持体が輸 送の際に容器に保存された対象物の移動および振動を低減させるように助成する 、その内側表面上のクッションを有することを特徴とする容器。 22.請求項14記載の容器において、前記一対の支持体のそれぞれが複数の 仕切り板を有し、それぞれの仕切り板は、ウエハの支持を助成するように連続的 に変化するスロープを有する形状であることを特徴とする容器。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US1995/012516 WO1997013710A1 (en) | 1995-10-13 | 1995-10-13 | 300mm MICROENVIRONMENT POD WITH DOOR ON SIDE |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH11513347A true JPH11513347A (ja) | 1999-11-16 |
JP3483573B2 JP3483573B2 (ja) | 2004-01-06 |
Family
ID=22249868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51500597A Expired - Lifetime JP3483573B2 (ja) | 1995-10-13 | 1995-10-13 | パッケージ |
Country Status (9)
Country | Link |
---|---|
US (4) | USRE41231E1 (ja) |
EP (1) | EP0857150B1 (ja) |
JP (1) | JP3483573B2 (ja) |
KR (1) | KR100428827B1 (ja) |
CA (1) | CA2218260C (ja) |
DE (1) | DE69526126T2 (ja) |
HK (1) | HK1017325A1 (ja) |
TW (1) | TW278312B (ja) |
WO (1) | WO1997013710A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100964047B1 (ko) * | 2001-11-14 | 2010-06-16 | 엔테그리스, 아이엔씨. | 웨이퍼 보유 시스템을 구비한 웨이퍼 캐리어 |
WO2011102318A1 (ja) | 2010-02-19 | 2011-08-25 | 信越ポリマー株式会社 | 基板収納容器 |
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US6736268B2 (en) * | 1997-07-11 | 2004-05-18 | Entegris, Inc. | Transport module |
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US6871741B2 (en) | 1998-05-28 | 2005-03-29 | Entegris, Inc. | Composite substrate carrier |
US6808668B2 (en) | 1998-05-28 | 2004-10-26 | Entegris, Inc. | Process for fabricating composite substrate carrier |
US6216874B1 (en) * | 1998-07-10 | 2001-04-17 | Fluoroware, Inc. | Wafer carrier having a low tolerance build-up |
TW437723U (en) | 2000-06-16 | 2001-05-28 | Ind Tech Res Inst | Wafer box with foldable handle |
CN1218364C (zh) * | 2000-12-04 | 2005-09-07 | 恩特格里斯公司 | 带有叠置适配器板的晶片搬运器 |
US20020090282A1 (en) * | 2001-01-05 | 2002-07-11 | Applied Materials, Inc. | Actuatable loadport system |
EP1373099A4 (en) * | 2001-04-01 | 2008-05-28 | Entegris Inc | FINE PLATE INSERT |
US6923325B2 (en) | 2001-07-12 | 2005-08-02 | Entegris, Inc. | Horizontal cassette |
TWI233912B (en) * | 2001-08-27 | 2005-06-11 | Entegris Inc | Modular carrier system for housing semiconductor wafer disks and similar inventory, and method of manufacturing the same |
US20030188990A1 (en) * | 2001-11-14 | 2003-10-09 | Bhatt Sanjiv M. | Composite kinematic coupling |
JP4329541B2 (ja) * | 2001-11-27 | 2009-09-09 | インテグリス・インコーポレーテッド | ドアにより機能化されるアース経路を有した前方開閉型ウエハーキャリア及びウエハーキャリアのドアを経由したアース経路を設ける方法 |
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JP4668133B2 (ja) * | 2006-06-28 | 2011-04-13 | 三甲株式会社 | ウエハ容器の位置決め構造 |
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TWM336941U (en) * | 2007-11-15 | 2008-07-21 | Gudeng Prec Ind Co Ltd | Storage apparatus for storing semiconductor element or reticle |
KR20140035377A (ko) | 2011-05-03 | 2014-03-21 | 인티그리스, 인코포레이티드 | 입자 쉴드를 가지는 웨이퍼 용기 |
JP6329252B2 (ja) | 2013-04-26 | 2018-05-23 | インテグリス・インコーポレーテッド | ウエハ容器、ウエハ容器のドアラッチ機構及びドアラッチ機構を組み立てる方法 |
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- 1995-10-13 CA CA002218260A patent/CA2218260C/en not_active Expired - Fee Related
- 1995-10-13 US US09/943,098 patent/USRE38221E1/en not_active Expired - Lifetime
- 1995-10-13 JP JP51500597A patent/JP3483573B2/ja not_active Expired - Lifetime
- 1995-10-13 EP EP95935679A patent/EP0857150B1/en not_active Expired - Lifetime
- 1995-10-13 US US11/351,214 patent/USRE42402E1/en not_active Expired - Lifetime
- 1995-10-13 US US08/913,260 patent/US5944194A/en not_active Ceased
- 1995-10-13 KR KR1019970707189A patent/KR100428827B1/ko not_active IP Right Cessation
- 1995-10-13 DE DE69526126T patent/DE69526126T2/de not_active Expired - Lifetime
- 1995-10-20 TW TW084111084A patent/TW278312B/zh not_active IP Right Cessation
-
1998
- 1998-12-17 HK HK98113815A patent/HK1017325A1/xx not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100964047B1 (ko) * | 2001-11-14 | 2010-06-16 | 엔테그리스, 아이엔씨. | 웨이퍼 보유 시스템을 구비한 웨이퍼 캐리어 |
WO2011102318A1 (ja) | 2010-02-19 | 2011-08-25 | 信越ポリマー株式会社 | 基板収納容器 |
KR20130008003A (ko) | 2010-02-19 | 2013-01-21 | 신에츠 폴리머 가부시키가이샤 | 기판 수납 용기 |
Also Published As
Publication number | Publication date |
---|---|
KR100428827B1 (ko) | 2005-04-20 |
EP0857150B1 (en) | 2002-03-27 |
US5944194A (en) | 1999-08-31 |
EP0857150A1 (en) | 1998-08-12 |
WO1997013710A1 (en) | 1997-04-17 |
USRE41231E1 (en) | 2010-04-20 |
CA2218260C (en) | 2006-05-23 |
JP3483573B2 (ja) | 2004-01-06 |
TW278312B (en) | 1996-06-11 |
KR19980703789A (ko) | 1998-12-05 |
DE69526126D1 (de) | 2002-05-02 |
EP0857150A4 (en) | 1999-04-14 |
DE69526126T2 (de) | 2002-11-07 |
USRE38221E1 (en) | 2003-08-19 |
HK1017325A1 (en) | 1999-11-19 |
CA2218260A1 (en) | 1997-04-17 |
USRE42402E1 (en) | 2011-05-31 |
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