JPS6413717A - Wafer carrier - Google Patents

Wafer carrier

Info

Publication number
JPS6413717A
JPS6413717A JP62170342A JP17034287A JPS6413717A JP S6413717 A JPS6413717 A JP S6413717A JP 62170342 A JP62170342 A JP 62170342A JP 17034287 A JP17034287 A JP 17034287A JP S6413717 A JPS6413717 A JP S6413717A
Authority
JP
Japan
Prior art keywords
wafer
carrier body
static electricity
base
lowering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62170342A
Other languages
Japanese (ja)
Inventor
Takashi Yonezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62170342A priority Critical patent/JPS6413717A/en
Publication of JPS6413717A publication Critical patent/JPS6413717A/en
Pending legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To avoid generating both change of characteristics and lowering of yield owing to static electricity, by arranging a grounding means which discharges electric charges on wafer into the ground. CONSTITUTION:A wafer 1 is engaged in a longitudinal groove of a carrier body 4 to be disposed in the carrier body 4. Then, the bottom edge 1a of the wafer 1 is in contact with two parallel Al rods 2, 2 to be supported be the supporting means 4b which is arranged at the bottom of the carrier body 4. Accordingly, when a wafer carrier is placed on a conductive base with the earth plate 3 of the carrier body 4 being in contact with the base, electric charges on the wafer 1 are discharged into the base through the Al rods 2 and the earth plate 3, thereby static electricity on the wafer 1 is eliminated effectively. Therefore, it is possible to eliminate both degradation of characteristics and lowering of yield owing to static electricity.
JP62170342A 1987-07-08 1987-07-08 Wafer carrier Pending JPS6413717A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62170342A JPS6413717A (en) 1987-07-08 1987-07-08 Wafer carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62170342A JPS6413717A (en) 1987-07-08 1987-07-08 Wafer carrier

Publications (1)

Publication Number Publication Date
JPS6413717A true JPS6413717A (en) 1989-01-18

Family

ID=15903151

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62170342A Pending JPS6413717A (en) 1987-07-08 1987-07-08 Wafer carrier

Country Status (1)

Country Link
JP (1) JPS6413717A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08274061A (en) * 1995-03-30 1996-10-18 Nec Yamaguchi Ltd Rotationally drying device for semiconductor wafer
KR100287024B1 (en) * 1996-07-12 2001-04-16 플루오로웨어, 아이엔씨. Wafer carrier
USRE42402E1 (en) 1995-10-13 2011-05-31 Entegris, Inc. 300 mm microenvironment pod with door on side
US8276759B2 (en) 2001-11-27 2012-10-02 Entegris, Inc. Front opening wafer carrier with path to ground effectuated by door

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08274061A (en) * 1995-03-30 1996-10-18 Nec Yamaguchi Ltd Rotationally drying device for semiconductor wafer
USRE42402E1 (en) 1995-10-13 2011-05-31 Entegris, Inc. 300 mm microenvironment pod with door on side
KR100287024B1 (en) * 1996-07-12 2001-04-16 플루오로웨어, 아이엔씨. Wafer carrier
US8276759B2 (en) 2001-11-27 2012-10-02 Entegris, Inc. Front opening wafer carrier with path to ground effectuated by door

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