TWM336941U - Storage apparatus for storing semiconductor element or reticle - Google Patents

Storage apparatus for storing semiconductor element or reticle Download PDF

Info

Publication number
TWM336941U
TWM336941U TW096219271U TW96219271U TWM336941U TW M336941 U TWM336941 U TW M336941U TW 096219271 U TW096219271 U TW 096219271U TW 96219271 U TW96219271 U TW 96219271U TW M336941 U TWM336941 U TW M336941U
Authority
TW
Taiwan
Prior art keywords
storage device
cover
flange
cover body
item
Prior art date
Application number
TW096219271U
Other languages
Chinese (zh)
Inventor
Chin-Ming Lin
Original Assignee
Gudeng Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gudeng Prec Ind Co Ltd filed Critical Gudeng Prec Ind Co Ltd
Priority to TW096219271U priority Critical patent/TWM336941U/en
Priority to US12/106,274 priority patent/US20090127160A1/en
Publication of TWM336941U publication Critical patent/TWM336941U/en
Priority to US12/695,562 priority patent/US20100126905A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1902—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1906—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for containing masks, reticles or pellicles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

M336941 八、新型說明： 【新型所屬之技術領域】 本創作係《於-種存放裝置肋魏半導航件或光罩，制是有關於 種犬緣與第-蓋體-體成型之用以存放半導體元件或光罩之存放裝置。 【先前技術】 近代半導财碰舰速，其巾絲鄕_ (Qptieal Lith嗯aphy)扮演 重要的角色，只要是關於圖形(pattem)定義，皆需仰賴光學微影技術。光學微影 技術在半導_朗上，是將設計好的線路製作成具树定雜可透光之光 罩。利用曝光原理，則光源通過光罩投影至石夕晶圓(silie〇n wafer)可曝光顯示特定 圖案由於任何附著於光罩上的塵埃顆粒(如微粒、粉塵或有機物)都會造成投影 成像的品質劣化，麟1生_的光罩賴㈣絕對潔淨，而被投射的石夕晶圓 或者其他半導體投射體亦必須保持絕對清靜，因此在一般的晶圓製程中，都提 供無塵室(dean 的環境以避免空氣中的顆粒污染。然而，目前的無塵室也 無法達到絕對無塵狀態。 •因此，現代的半導體製程皆利用抗污染的存放裝置進行光罩的保存與運 ‘輸’以使光罩爛F潔淨；也湘抗污染的半導體元件存放裝置進行半導體元件 的保存與運輸，錢轉體元件保持潔淨。存放裝置係在半賴触中用於存 放光罩’關光罩在機台之間的搬運與傳送，並隔絕光罩與大氣的接觸，避免 光罩被雜質心而產生變化；而半導體元件存放裝置係在半導體製程中用於存 放半^體讀’糊轉體元件在機台之間的搬運與傳送，並隔絕半導體元件 與大乳的接觸’避免半導體猶被雜質汙染而產生變化。因此，光罩或是半導 體7〇件均需置放轉放鼓巾，輯聰淨與聽污染之效果。 傳統=用以存放半導體元件或光罩之存放裝置均具有相當多的結構，舉凡 :要:兩蓋:組合，而為了達到機械運送之功能，在其中一蓋體之頂部尚須在 大緣或犬緣承座以供機器人或機械手持取移動，需設置把手以供人力取 M336941 12 27 修 ί 補怎ί 放’另還需设置板件等供貼放標籤，尚須在設置其他裝置以‘至支他元件。- 如此一來，此種用以存放半導體元件或光罩之存放裝置上，因增加了突緣、 突緣承座、把手、板件等元件，除了增加用以存放半導體元件或光罩之存放裝 置本身之重篁、增加組裝置工時外，連接此等元件莫不使用接合零件，縱使作 工精密，難鮮^疏鬆，當零件疏鱗，接合之個元件财脫離之危險，輕 則僅造成板件脫落或者辨識機能喪失，重則突緣、突緣承座甚或是把手脫落， ，造成用轉放轉體元件或鮮之械裝置在運輸過程巾之危險，增加光罩或 半導體元件毀損之可能。 有攀於此，本創作所提供之一種突緣與第一蓋體一體成型之用以存放半導 體元件或光罩之姐裝置，乃針戦前技術Μ改良者。 【新型内容】 為解決先前技術之問題’本創作係有關於一種用以存放半導體元件或光罩之 存放裝置’此二種存放裝置均係由第—蓋體、第二蓋體錢錄組合而成。在 第-蓋體之部分，其具有頂部以及複數個側邊設於該·之周圍；而第二蓋體， 用以與第-蓋體組合，形成内部㈣可容納光罩；至於突緣，則設於該第一蓋 體，贱容許機械把持與放置；本創作之特徵在於，突緣與第—蓋體係一 ί!丨之ί!】能。 因此 ，本創作之主要目的錄提供—觀雜第H 置與半導體元件存放裝置，其組裝簡便，可節省工作時間。 存放裝 毀損之風險 本創作之再-目的在於提供H緣與第—蓋體—體成型之敎存 體猶或光罩之存放裝置，其接合Μ娜，減侧料_所⑽導致物件 本創作之再-目的在於提供-種突緣與第—蓋體—體趟之用贿放半導 M336941 正 本創作之再—目的在於提供一種突緣與第一蓋體一體成型之用 件===爾置，其接合孩料’可絲__或半導體元 【實施方式】 —由於本創作係揭露—種突緣與第—蓋體—體成型之存放裝置用以存放 體7G件或光罩之結構，其情到的__些光罩或半導體或存放裝置之詳 .造或處理過程，係現有技術來達成，故在下述中，並不作完整描述。 而且下述内文中之圖式，亦並未依據實際之相關尺寸完整綠製，其作用僅 達與本創作特徵有關之示意圖。 請參閱第i，係本卿H請放半導體元件或光罩之存放裝置之示意 圖，本創作之肋存放半導體元件献罩之存放裝置包含有第—蓋體⑴、第二 設於該頂部⑴)之關；而第二蓋體⑺，個以與該第—蓋體⑴組合，形成一 内部空間可容納光罩或是半導體元件；突緣(3)設於第—蓋體⑴上，可以是一個 或-個以上，當欲移動本創作之用以存放轉體元件或光罩之存放裝置時，可 直接將麵人或機械手置於突緣⑶下，將突緣⑶抬升，藉以升抬本創作之用以 存放半導體it件或光罩之械裝置，得以進行運送、雜或置放本難之用以 存放半導體元件或光罩之存放裝置之工作；而本創作之特徵係在於突緣⑺與第 -蓋體(1)係-體成型。其中，突緣(3)可自第—蓋體⑴之側邊⑽突出，如第二 A圖所示；或自第-蓋體⑴之頂部(11)突出，如第二B圖所示。 接著請再參閱第三®，在本創作之用轉放半導體元件絲罩之存放裝置 中’犬緣(3)可再增設突緣承座(31)，與第一蓋體⑴連接，用以支撐突緣⑶，使 機器人或麵手持4本創狀轉料導體元件絲罩之存放裝置時有更好 之支樓力’突緣承座(31)之設置方式有許多，如第三a圖至第三κ圖所示，突 緣承座(31)可垂直設置於該第一蓋體⑴之頂部⑼；或突緣承座⑼與第一蓋體 ⑴之頂部(11)之爽角設置成大於或小於九十度，均得視使用之需要而加以改變設 M3 3 6941 ㊉· i2· 27 修!·M336941 VIII, new description: [New technical field] This creation is "in the storage device rib Wei semi-navigation parts or reticle, the system is related to the kind of dog edge and the first - cover body - body shape for storage A storage device for a semiconductor component or a photomask. [Prior Art] Modern semi-conducting money hits the ship, and its Q (Qptieal Lith aphy) plays an important role. As long as it is about the definition of graphic, it depends on optical lithography. In the semi-conductor _lang, the optical lithography technology is to make the designed circuit into a opaque opaque hood. Using the principle of exposure, the light source is projected through a reticle to a silie〇n wafer to expose a specific pattern. Any dust particles (such as particles, dust or organic matter) attached to the reticle will cause the quality of the projection image. Degraded, Lin 1 _ _ _ _ _ _ _ (4) is absolutely clean, and the projected Shi Xi wafer or other semiconductor projectile must also remain absolutely quiet, so in the general wafer process, provide a clean room (dean Environment to avoid particle contamination in the air. However, the current clean room can not reach the absolute dust-free state. Therefore, modern semiconductor processes use the anti-pollution storage device to save and transport the mask. The photomask is rotted and cleaned; the anti-pollution semiconductor component storage device is used for the storage and transportation of the semiconductor components, and the money-transfer components are kept clean. The storage device is used for storing the reticle in the middle of the touch. Handling and transporting between, and insulating the contact of the reticle with the atmosphere to prevent the reticle from being changed by the impurity core; and the semiconductor component storage device is made of semiconductor It is used to store the transfer and transfer of the paste-like components between the machines, and to isolate the contact between the semiconductor components and the large breasts. 'The semiconductor is still contaminated by impurities. Therefore, the mask or the semiconductor 7 〇 均 均 转 转 转 转 , 辑 辑 辑 辑 辑 辑 辑 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统 传统In order to achieve the function of mechanical transport, the top of one of the covers must be placed on the big edge or the dog's edge for robot or mechanical hand-held movement. Need to set the handle for the manpower to take M336941 12 27 'There is also a need to set the board and other materials for labeling. It is necessary to set up other devices to 'to support the components.' - As a result, the storage device for storing semiconductor components or masks has increased Elements such as flanges, flange holders, handles, plates, etc., except for the weight of the storage device itself for storing semiconductor components or reticle, and the increase in the number of unit installations, the connection of these components does not use the joint parts, even ifPrecision, difficult to fresh and loose, when the parts are scaled, the joint components of the wealth are out of danger, but only cause the board to fall off or the identification function is lost, but the flange, flange bearing or even the handle is off, causing The possibility of transferring the rotating component or the fresh device in the process of transporting the towel increases the possibility of damage to the reticle or the semiconductor component. As a result, a flange provided by the present invention is integrally formed with the first cover. The device for storing semiconductor components or reticle is a prior art improvement. [New content] In order to solve the problems of the prior art, the present invention relates to a storage device for storing semiconductor components or masks. The storage device is composed of a first cover body and a second cover body. In the portion of the first cover body, the top portion and the plurality of side edges are disposed around the top cover; and the second cover body is used for the second cover body. In combination with the first cover body, the inner (four) can be accommodated to receive the reticle; and the flange is disposed on the first cover body, and the cymbal is allowed to be mechanically held and placed; the present invention is characterized in that the flange and the first cover system are ί!丨之ί!] Can. Therefore, the main purpose of this creation is to provide a view of the H-position and the semiconductor component storage device, which is easy to assemble and saves working time. The risk of storing damage is the re-creation of the creation - the purpose is to provide the storage device of the H-edge and the first-body-body-forming body or the reticle, which is joined to the enamel, and the side material _ (10) leads to the creation of the object. Re--the purpose is to provide a kind of flange and the first cover-body 贿 贿 M 336 336 M336941 re-creation of the original - the purpose is to provide a flange and the first cover body molded piece === Set, it is a child's material, which can be used as a storage device for storing 7G pieces or a reticle. The details of the reticle or semiconductor or storage device are made by the prior art, and therefore are not fully described below. Moreover, the drawings in the following texts are not completely green according to the actual relevant dimensions, and their functions only reach the schematic diagram related to the creative features. Please refer to the i, the schematic diagram of the storage device of the semiconductor component or the reticle. The storage device of the rib storage semiconductor component of the present invention includes a first cover (1) and a second set at the top (1). The second cover (7) is combined with the first cover (1) to form an internal space for accommodating the reticle or the semiconductor component; the flange (3) is disposed on the first cover (1), which may be One or more, when you want to move the storage device for storing the rotating element or the reticle, you can directly place the person or manipulator under the flange (3) and raise the flange (3) to raise it. The device for storing a semiconductor element or a reticle of the present invention is capable of transporting, miscellaneous or placing a storage device for storing a semiconductor element or a reticle; and the feature of the creation is a flange (7) Forming the body with the first cover (1). Wherein, the flange (3) may protrude from the side edge (10) of the first cover body (1) as shown in FIG. 2A; or protrude from the top portion (11) of the first cover body (1), as shown in FIG. Next, please refer to the third®. In the storage device for transferring the semiconductor component wire cover of the present invention, the dog edge (3) can be further provided with a flange bearing seat (31), which is connected with the first cover body (1) for The support flange (3) allows the robot or the surface to hold the storage device of the wire cover of the four creative transfer conductor elements with better support. The flange holder (31) is arranged in many ways, such as the third a diagram. As shown in the third κ diagram, the flange socket (31) may be vertically disposed at the top (9) of the first cover (1); or the flange seat (9) and the top (11) of the first cover (1) may be set at a cool angle. If it is greater than or less than 90 degrees, it must be changed according to the needs of use. M3 3 6941 十· i2· 27 Repair!·

ί年月丨:】I i 補无丨 又，請參閱第四圖，係本創作之用以存放半導體元件或光罩之; 緣承座(31)之他種實施方式，突緣承座(31)得設置於第一蓋體(1)之側邊(12)，突 緣承座(31)與第一蓋體(1)之侧邊(12)之角度可以是九十度或大於或小於九十 度，其實施方式如第四Α圖至第四F圖所示，端視使用之需要而得加以改變。 接著，清參閱第五圖，本創作之用以存放半導體元件或光罩之存放裝置得再 δ又置把手(41)於第一蓋體(1)上，以供人力提取、移動本創作之用以存放半導體元 .件或光罩之存放裝置，該把手(41)之設置，得另外架設或是將該把手(41)與第一 蓋體(1)設置為一體成型之型態。 X，如第六圖所丨，本創作之用以存放半導體元件絲罩之存放裝置得再設 置板件(42)於第一蓋體(1)上，板件(42)得以額外加裝之方式或者與第一蓋體為一 體成型之型態，板件(42)得用以設置標籤(43)於上，達到辨識本創作之用以存放 半導體元件或光罩之存放裝置本身或其内容物之資料。 又如第七Α圖至第七C圖所示，本創作之用以存放半導體元件或光罩之存 放裝置得再設4警示H(44)當本創作H時放轉體元件或光罩之存放裝置 受到預先設定之威脅時，該警示器(44)將產生警示之功效。或是可再增設感應器 ⑼’藉由感應器⑼可直接感應相關資訊。或是可再增設辨識裝置(46)，用以 達到辨識之功能，該辨識裝置(46)可以是無線射頻辨識裝置(卿)。 φ -以上所述僅為本創作之較佳實施例而已，並非用以限定本創作之申請專利 .權利；同時以上的描述，對於熟知本技術領域之專門人士應可明瞭及實施，因 此其他未脫離本發明所揭示之精神下所完成的等效改變或修飾，均應包含在下 述之Φ諸直别範圍中。 【圖式簡單說明】 第-圖：本創作用轉放半賴元件或光罩之魏裝置之示意圖。 示 意圖 第二A酿第二3圖：糊個轉放半導體元件或光罩之存放裝置之 8 .M336941 !--- 、 笛- a国 ri料胁日^正 • 弟圖至第三匕圖：本編r LL—補充 ν關於突緣、突緣承座與第一:巧作用以存放半導體元件或光罩之， ^ 第四a圖至第蓋體之頂部之位置關係示意圖。 關於突緣、突緣承座與本創作用以存放半導體元件或光罩之存放裝置中， 第五圖：本創作體之側邊之位置關麵意圖。 第六A圖與第六g^放半導體元件或光罩之存放裝置增設把手之示意圖。 '板件之示意圖。 劊作用以存放半導體元件或光罩之存放裝置增設 第七A圖至第七C圖· 名 警示器、感應器或辨識裝置之示= 乍圖用以存放半導體元件或光罩之存放裝置增設 【主要元件符號說明】 第一蓋體(1) 頂部(11) 側邊(12) 第二蓋體(2) 突緣⑶ί年月丨:]I i is indispensable, please refer to the fourth picture, which is used to store semiconductor components or reticle; the other embodiment of the rim bearing (31), the flange bearing ( 31) disposed on the side edge (12) of the first cover body (1), the angle between the flange seat (31) and the side edge (12) of the first cover body (1) may be ninety degrees or greater or Less than ninety degrees, the embodiment is as shown in the fourth to fourth F diagrams, and is changed depending on the needs of use. Next, referring to the fifth figure, the storage device for storing the semiconductor component or the photomask of the present invention is further provided with a handle (41) on the first cover body (1) for human extraction and movement of the creation. The storage device for storing the semiconductor element or the reticle, the handle (41) is arranged to be additionally erected or the handle (41) and the first cover (1) are integrally formed. X, as shown in the sixth figure, the storage device for storing the wire cover of the semiconductor component is provided with the plate member (42) on the first cover body (1), and the plate member (42) can be additionally installed. The method is either integrally formed with the first cover body, and the plate member (42) is configured to set the label (43) thereon, so as to identify the storage device for storing the semiconductor component or the mask itself or the content thereof. Material information. As shown in the seventh to seventh C, the storage device for storing the semiconductor component or the reticle of the present invention is further provided with a warning H (44). When the original H is used, the body member or the reticle is rotated. The alerter (44) will generate an alert when the storage device is subject to a pre-set threat. Alternatively, a sensor (9) can be added to directly sense relevant information by means of the sensor (9). Alternatively, an identification device (46) may be added to achieve the function of identification. The identification device (46) may be a radio frequency identification device. φ - The above is only a preferred embodiment of the present invention, and is not intended to limit the patent application rights of the present invention; at the same time, the above description should be understood and implemented by those skilled in the art, and therefore other Equivalent changes or modifications made without departing from the spirit of the invention shall be included in the Φ range of the following. [Simple description of the diagram] Fig.: Schematic diagram of the Wei device used for the transfer of components or masks. Diagram 2, A, Brewing, 2nd Figure 3: Pasting a semiconductor device or a photomask storage device. 8. M336941 !---, flute-a country ri material threatening day ^正• 弟图至第匕图: This series r LL - supplement ν about the flange, the flange socket and the first: the role of the semiconductor element or the reticle, ^ the relationship between the position of the fourth a to the top of the cover. Regarding the flange, the flange socket, and the storage device for storing the semiconductor element or the photomask, the fifth figure: the position of the side of the original body is intended to be closed. FIG. 6A and FIG. 6 are schematic diagrams showing the addition of a handle to a storage device of a semiconductor component or a photomask. 'Schematic diagram of the board.刽 以 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放 存放Main component symbol description] First cover (1) Top (11) Side (12) Second cover (2) Flange (3)

突緣承座(31) 把手(41) 板件(42) 標麵(43) 警示器(44) 感應器(45) 辨識裝置(46) 9Flange Seat (31) Handle (41) Plate (42) Face (43) Warning (44) Sensor (45) Identification Device (46) 9

Claims (1)

•M336941 : 九、申請專利範圍： 1· 一種存放裝置，用以姐半導體元件或輕，包含有： -第：,，具有一頂部’以及複數侧則邊設於該頂部之周圍； 罩；以2用以與4第—蓋體組合’形成—畴空間可容納半導體元件或光 至少-突緣，設於該第一蓋體’用以容許—機械持置； 其中，該突緣與該第一蓋體係一體成型。 2.=請她μ丨㈣繼，料職_觸—蓋體之侧• M336941: IX. Patent application scope: 1. A storage device for a semiconductor component or light, comprising: - a:, having a top 'and a plurality of sides disposed around the top; a cover; 2 for combining with the 4th cover body to form a domain space for accommodating a semiconductor component or a light at least a flange disposed on the first cover body for allowing mechanical holding; wherein the flange and the first A cover system is integrally formed. 2.=Please ask her to 丨(4) follow, the job _ touch - the side of the cover 3·如申請專利範圍第丨項之存放裝置， 部0 其中該突緣係突出於該第-蓋體之頂 4. 5· 如申請專利範圍第1項之存放裝置，該突缝 蓋體連接· ^緣純含有—練承座，與該第一 狀躲裝置，糾贼録剌^纽置於該第一 蓋 6. 2請專利範圍第4項之存放裝置，其中該突緣承座與該第—蓋體之 夾角係大於或小於九十度。 F之 -7.如f請專利綱第4項之存放裝置’其中該突緣承雜垂 體之側邊。 夏於孩第—盍 8·如申請專利範圍第4項之存放裝置， 夾角係大於或小於九十度。 其中該突緣承额該帛—蓋體之側邊之 另包含有-把手設於該第—蓋體上。 該把手與該第—蓋體為-體成型。 另包含有-板件設於該第— 該板件與該第-蓋體為-體成型。。 其中該板件係用以設置一標籤。 9·如申請專利範圍第1項之存放裝置， 10·如申請專利範圍第9項之存放裝置， 11·如申請專利範圍第1項之存放裝置， 12·如申請專利範圍第11項之存放裝置， 13·如申請專利範圍第11項之存放裝置， M336941 14. 如申請專利範圍第1項之存放裝置，另包含有一警示器。 15. 如申請專利範圍第1項之存放裝置，另包含有一感應器。 16. 如申請專利範圍第1項之存放裝置，另包含有一辨識裝置。 -17.如申請專利範圍第16項之存放裝置，其中該辨識裝置為一無線射頻辨識裝 置(RFID)。3. The storage device according to the scope of the patent application, the portion 0, wherein the flange protrudes from the top of the first cover body 4. 5 · The storage device of the first application of the patent scope, the joint cover connection · ^缘 pure contains - training seat, and the first shape hiding device, thief record 剌 ^ button placed in the first cover 6.2 patent area of the fourth item storage device, wherein the flange bearing and The angle of the first cover is greater than or less than ninety degrees. F -7. For example, please refer to the storage device of the fourth item of the patent program, where the flange bears the side of the pituitary. Xia Yu Children - 盍 8 · If you apply for the storage device of item 4 of the patent scope, the angle is greater than or less than 90 degrees. Wherein the flange bearing is disposed on the side of the cover body, and the handle is disposed on the first cover body. The handle and the first cover are formed in a body. Further comprising - a plate member is disposed on the first portion - the plate member and the first cover body are formed in a body. . The plate is used to set a label. 9. If you are applying for the storage device of item 1 of the patent scope, 10·If you are applying for the storage device of item 9 of the patent scope, 11·If you are applying for the storage device of item 1 of the patent scope, 12) Device, 13· The storage device of claim 11 of the patent scope, M336941 14. The storage device of claim 1 of the patent application, further comprising a warning device. 15. The storage device of claim 1 of the patent application further comprises a sensor. 16. The storage device of claim 1 of the patent application further comprises an identification device. -17. The storage device of claim 16, wherein the identification device is a radio frequency identification device (RFID). 1111
TW096219271U 2007-11-15 2007-11-15 Storage apparatus for storing semiconductor element or reticle TWM336941U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW096219271U TWM336941U (en) 2007-11-15 2007-11-15 Storage apparatus for storing semiconductor element or reticle
US12/106,274 US20090127160A1 (en) 2007-11-15 2008-04-19 Storage apparatus for storing semiconductor element or reticle
US12/695,562 US20100126905A1 (en) 2007-11-15 2010-01-28 Storage apparatus for storing semiconductor element or reticle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096219271U TWM336941U (en) 2007-11-15 2007-11-15 Storage apparatus for storing semiconductor element or reticle

Publications (1)

Publication Number Publication Date
TWM336941U true TWM336941U (en) 2008-07-21

Family

ID=40640798

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096219271U TWM336941U (en) 2007-11-15 2007-11-15 Storage apparatus for storing semiconductor element or reticle

Country Status (2)

Country Link
US (2) US20090127160A1 (en)
TW (1) TWM336941U (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8602239B2 (en) * 2010-08-16 2013-12-10 Robert L. Thomas, JR. Decorative paper plate storage units
US8925290B2 (en) * 2011-09-08 2015-01-06 Taiwan Semiconductor Manufacturing Company, Ltd. Mask storage device for mask haze prevention and methods thereof
US8915368B2 (en) * 2012-09-20 2014-12-23 Shenzhen China Star Optoelectronics Technology Co., Ltd LCD glass substrate storage tray

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5024329A (en) * 1988-04-22 1991-06-18 Siemens Aktiengesellschaft Lockable container for transporting and for storing semiconductor wafers
USD376688S (en) * 1994-12-20 1996-12-24 Empak, Inc. Semiconductor wafer cassette transport box
CA2218260C (en) * 1995-10-13 2006-05-23 Empak, Inc. 300mm microenvironment pod with door on side
USD378873S (en) * 1995-10-13 1997-04-22 Empak, Inc. 300 mm microenvironment pod with door on side
US6319297B1 (en) * 1998-03-27 2001-11-20 Asyst Technologies, Inc. Modular SMIF pod breather, adsorbent, and purge cartridges
US6216873B1 (en) * 1999-03-19 2001-04-17 Asyst Technologies, Inc. SMIF container including a reticle support structure
US6340933B1 (en) * 1999-11-29 2002-01-22 Taiwan Semiconductor Manufacturing Company, Ltd Semiconductor wafer transport pod having cover latch indicator
US6528836B2 (en) * 2001-07-12 2003-03-04 Taiwan Semiconductor Manufacturing Co., Ltd Photomask ESD protection and an anti-ESD pod with such protection
US6653944B2 (en) * 2001-07-20 2003-11-25 Taiwan Semiconductor Manufacturing Co. Ltd Semiconductor wafer transport pod equipped with cover latch indicator
US6825916B2 (en) * 2002-07-05 2004-11-30 Entegris, Inc. Reticle carrier with positioning cover
US6948619B2 (en) * 2002-07-05 2005-09-27 Taiwan Semiconductor Manufacturing Co., Ltd Reticle pod and reticle with cut areas
TWI262164B (en) * 2004-12-15 2006-09-21 Gudeng Prec Ind Co Ltd Airtight semiconductor transferring container
US7528936B2 (en) * 2005-02-27 2009-05-05 Entegris, Inc. Substrate container with pressure equalization
US7581372B2 (en) * 2006-08-17 2009-09-01 Microtome Precision, Inc. High cleanliness article transport system

Also Published As

Publication number Publication date
US20100126905A1 (en) 2010-05-27
US20090127160A1 (en) 2009-05-21

Similar Documents

Publication Publication Date Title
TWI344926B (en) Reticle pod
US9829809B2 (en) System and method for attaching a mask to a mask holder
TW562965B (en) System and method for reticle protection and transport
US20080251473A1 (en) Apparatus for storing contamination-sensitive flat articles, in particular for storing semiconductor wafers
TW201126581A (en) Reticle clean process for a lithography tool and a clean system thereof
TW201111244A (en) Reticle pod
TWM336941U (en) Storage apparatus for storing semiconductor element or reticle
Bonam et al. EUV mask and wafer defectivity: strategy and evaluation for full die defect inspection
US20020089656A1 (en) Containers for lithography mask and method of use
TWM330970U (en) Semiconductor elements storage apparatus and reticle storage apparatus
US7694498B2 (en) Gas filling apparatus and gas filling port thereof
TW567395B (en) De-pellicle tool
TW465006B (en) Wafer inspecting apparatus and wafer inspection method
TWI303618B (en) Metal photomask box
CN201117642Y (en) Storage device for storing semiconductor elements or masks
CN201107546Y (en) Metal light shield box and filter device thereof
JP2013041947A (en) Lithographic device and article manufacturing method
JP2005326634A (en) Method for housing pellicle
CN201214503Y (en) Photomask box and support piece thereof
JP2024016096A (en) Equipment for positioning and clamp hardening
CN201090993Y (en) Container and cover thereof
JP4356443B2 (en) Substrate transfer device
CN201194222Y (en) Container with fool-proof device
CN201196950Y (en) Inflation equipment and air inlet port device
TWM336219U (en) Gas filling apparatus and gas filling port thereof