TW278312B - 300mm microenvironment pod with door on side - Google Patents

300mm microenvironment pod with door on side

Info

Publication number
TW278312B
TW278312B TW084111084A TW84111084A TW278312B TW 278312 B TW278312 B TW 278312B TW 084111084 A TW084111084 A TW 084111084A TW 84111084 A TW84111084 A TW 84111084A TW 278312 B TW278312 B TW 278312B
Authority
TW
Taiwan
Prior art keywords
door
supports
container
microenvironment
pod
Prior art date
Application number
TW084111084A
Other languages
English (en)
Inventor
Gregerson Barry
m gallagher Gary
Wiseman Brian
Original Assignee
Empak Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Empak Inc filed Critical Empak Inc
Application granted granted Critical
Publication of TW278312B publication Critical patent/TW278312B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67396—Closed carriers characterised by the presence of antistatic elements
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/02—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon
    • G11B33/04—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon modified to store record carriers
    • G11B33/0405—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon modified to store record carriers for storing discs
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW084111084A 1995-10-13 1995-10-20 300mm microenvironment pod with door on side TW278312B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1995/012516 WO1997013710A1 (en) 1995-10-13 1995-10-13 300mm MICROENVIRONMENT POD WITH DOOR ON SIDE

Publications (1)

Publication Number Publication Date
TW278312B true TW278312B (en) 1996-06-11

Family

ID=22249868

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084111084A TW278312B (en) 1995-10-13 1995-10-20 300mm microenvironment pod with door on side

Country Status (9)

Country Link
US (4) USRE41231E1 (zh)
EP (1) EP0857150B1 (zh)
JP (1) JP3483573B2 (zh)
KR (1) KR100428827B1 (zh)
CA (1) CA2218260C (zh)
DE (1) DE69526126T2 (zh)
HK (1) HK1017325A1 (zh)
TW (1) TW278312B (zh)
WO (1) WO1997013710A1 (zh)

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USRE41231E1 (en) 1995-10-13 2010-04-20 Entegris, Inc. 300 mm microenvironment pod with door on side
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US6736268B2 (en) * 1997-07-11 2004-05-18 Entegris, Inc. Transport module
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US6871741B2 (en) 1998-05-28 2005-03-29 Entegris, Inc. Composite substrate carrier
US6808668B2 (en) 1998-05-28 2004-10-26 Entegris, Inc. Process for fabricating composite substrate carrier
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US20020090282A1 (en) * 2001-01-05 2002-07-11 Applied Materials, Inc. Actuatable loadport system
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US7252199B2 (en) * 2004-03-26 2007-08-07 Entegris, Inc. Disk cassette system
US7528936B2 (en) * 2005-02-27 2009-05-05 Entegris, Inc. Substrate container with pressure equalization
US7422107B2 (en) * 2006-01-25 2008-09-09 Entegris, Inc. Kinematic coupling with textured contact surfaces
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US20080157455A1 (en) * 2006-12-29 2008-07-03 Applied Materials, Inc. Compliant substrate holding assembly
TWM336941U (en) * 2007-11-15 2008-07-21 Gudeng Prec Ind Co Ltd Storage apparatus for storing semiconductor element or reticle
CN102939254A (zh) 2010-02-19 2013-02-20 信越聚合物株式会社 基板收纳容器
KR20140035377A (ko) 2011-05-03 2014-03-21 인티그리스, 인코포레이티드 입자 쉴드를 가지는 웨이퍼 용기
JP6329252B2 (ja) 2013-04-26 2018-05-23 インテグリス・インコーポレーテッド ウエハ容器、ウエハ容器のドアラッチ機構及びドアラッチ機構を組み立てる方法
NL2022185B1 (nl) * 2018-12-12 2020-07-02 Suss Microtec Lithography Gmbh Substratkassette

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Also Published As

Publication number Publication date
KR100428827B1 (ko) 2005-04-20
EP0857150B1 (en) 2002-03-27
US5944194A (en) 1999-08-31
EP0857150A1 (en) 1998-08-12
WO1997013710A1 (en) 1997-04-17
USRE41231E1 (en) 2010-04-20
JPH11513347A (ja) 1999-11-16
CA2218260C (en) 2006-05-23
JP3483573B2 (ja) 2004-01-06
KR19980703789A (ko) 1998-12-05
DE69526126D1 (de) 2002-05-02
EP0857150A4 (en) 1999-04-14
DE69526126T2 (de) 2002-11-07
USRE38221E1 (en) 2003-08-19
HK1017325A1 (en) 1999-11-19
CA2218260A1 (en) 1997-04-17
USRE42402E1 (en) 2011-05-31

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees