JPH11307782A5 - - Google Patents

Info

Publication number
JPH11307782A5
JPH11307782A5 JP1998131448A JP13144898A JPH11307782A5 JP H11307782 A5 JPH11307782 A5 JP H11307782A5 JP 1998131448 A JP1998131448 A JP 1998131448A JP 13144898 A JP13144898 A JP 13144898A JP H11307782 A5 JPH11307782 A5 JP H11307782A5
Authority
JP
Japan
Prior art keywords
film
diamond
interlayer insulating
forming
carbon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1998131448A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11307782A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP10131448A priority Critical patent/JPH11307782A/ja
Priority claimed from JP10131448A external-priority patent/JPH11307782A/ja
Priority to US09/296,042 priority patent/US6621535B1/en
Publication of JPH11307782A publication Critical patent/JPH11307782A/ja
Priority to US10/656,263 priority patent/US7508033B2/en
Publication of JPH11307782A5 publication Critical patent/JPH11307782A5/ja
Withdrawn legal-status Critical Current

Links

JP10131448A 1998-04-24 1998-04-24 半導体装置およびその作製方法 Withdrawn JPH11307782A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP10131448A JPH11307782A (ja) 1998-04-24 1998-04-24 半導体装置およびその作製方法
US09/296,042 US6621535B1 (en) 1998-04-24 1999-04-21 Semiconductor device and method of manufacturing the same
US10/656,263 US7508033B2 (en) 1998-04-24 2003-09-08 Semiconductor device with diamond-like carbon film on backside of substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10131448A JPH11307782A (ja) 1998-04-24 1998-04-24 半導体装置およびその作製方法

Publications (2)

Publication Number Publication Date
JPH11307782A JPH11307782A (ja) 1999-11-05
JPH11307782A5 true JPH11307782A5 (enExample) 2005-07-14

Family

ID=15058204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10131448A Withdrawn JPH11307782A (ja) 1998-04-24 1998-04-24 半導体装置およびその作製方法

Country Status (2)

Country Link
US (2) US6621535B1 (enExample)
JP (1) JPH11307782A (enExample)

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KR101643758B1 (ko) 2009-11-23 2016-08-01 삼성전자주식회사 분자빔 에피탁시 방법을 이용한 카본 절연층 제조방법 및 이를 이용한 전계효과 트랜지스터 제조방법

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