JPH11251355A5 - - Google Patents

Info

Publication number
JPH11251355A5
JPH11251355A5 JP1998284810A JP28481098A JPH11251355A5 JP H11251355 A5 JPH11251355 A5 JP H11251355A5 JP 1998284810 A JP1998284810 A JP 1998284810A JP 28481098 A JP28481098 A JP 28481098A JP H11251355 A5 JPH11251355 A5 JP H11251355A5
Authority
JP
Japan
Prior art keywords
ball
wire
bond
package
location
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998284810A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11251355A (ja
Filing date
Publication date
Application filed filed Critical
Publication of JPH11251355A publication Critical patent/JPH11251355A/ja
Publication of JPH11251355A5 publication Critical patent/JPH11251355A5/ja
Pending legal-status Critical Current

Links

JP28481098A 1997-09-19 1998-09-21 集積回路用のワイヤーボンドされたパッケージの方法と装置 Pending JPH11251355A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5953997P 1997-09-19 1997-09-19
US60/059539 1997-09-19

Publications (2)

Publication Number Publication Date
JPH11251355A JPH11251355A (ja) 1999-09-17
JPH11251355A5 true JPH11251355A5 (enExample) 2005-10-27

Family

ID=22023622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28481098A Pending JPH11251355A (ja) 1997-09-19 1998-09-21 集積回路用のワイヤーボンドされたパッケージの方法と装置

Country Status (6)

Country Link
US (1) US6194786B1 (enExample)
EP (1) EP0903780A3 (enExample)
JP (1) JPH11251355A (enExample)
KR (1) KR19990029932A (enExample)
SG (1) SG68074A1 (enExample)
TW (1) TW436949B (enExample)

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US7270867B1 (en) 1998-06-10 2007-09-18 Asat Ltd. Leadless plastic chip carrier
US6933594B2 (en) * 1998-06-10 2005-08-23 Asat Ltd. Leadless plastic chip carrier with etch back pad singulation
US6989294B1 (en) 1998-06-10 2006-01-24 Asat, Ltd. Leadless plastic chip carrier with etch back pad singulation
US8330270B1 (en) 1998-06-10 2012-12-11 Utac Hong Kong Limited Integrated circuit package having a plurality of spaced apart pad portions
US7271032B1 (en) 1998-06-10 2007-09-18 Asat Ltd. Leadless plastic chip carrier with etch back pad singulation
US7226811B1 (en) 1998-06-10 2007-06-05 Asat Ltd. Process for fabricating a leadless plastic chip carrier
US6229200B1 (en) 1998-06-10 2001-05-08 Asat Limited Saw-singulated leadless plastic chip carrier
US6872661B1 (en) 1998-06-10 2005-03-29 Asat Ltd. Leadless plastic chip carrier with etch back pad singulation and die attach pad array
JP2000260809A (ja) * 1999-03-12 2000-09-22 Toshiba Corp 半導体装置のパッケージ
US6735651B1 (en) * 1999-07-30 2004-05-11 International Business Machines Corporation Multi-chip module having chips coupled in a ring
US6518663B1 (en) * 1999-08-30 2003-02-11 Texas Instruments Incorporated Constant impedance routing for high performance integrated circuit packaging
JP2001168223A (ja) * 1999-12-07 2001-06-22 Fujitsu Ltd 半導体装置
US6621280B1 (en) * 2000-06-27 2003-09-16 Agere Systems Inc. Method of testing an integrated circuit
US6525553B1 (en) * 2000-09-11 2003-02-25 St Assembly Test Services Ltd. Ground pin concept for singulated ball grid array
US6770963B1 (en) * 2001-01-04 2004-08-03 Broadcom Corporation Multi-power ring chip scale package for system level integration
DE10139985B4 (de) 2001-08-22 2005-10-27 Infineon Technologies Ag Elektronisches Bauteil mit einem Halbleiterchip sowie Verfahren zu seiner Herstellung
EP1442397A4 (en) * 2001-10-24 2006-11-15 Bea Systems Inc DATA SYNCHRONIZATION
US6674176B2 (en) * 2002-02-20 2004-01-06 Lsi Logic Corporation Wire bond package with core ring formed over I/O cells
US6777803B2 (en) * 2002-08-28 2004-08-17 Lsi Logic Corporation Solder mask on bonding ring
US7732914B1 (en) 2002-09-03 2010-06-08 Mclellan Neil Cavity-type integrated circuit package
EP1573812A1 (en) * 2002-12-10 2005-09-14 Koninklijke Philips Electronics N.V. High density package interconnect power and ground strap and method therefor
US6815836B2 (en) * 2003-03-24 2004-11-09 Texas Instruments Incorporated Wire bonding for thin semiconductor package
TWI242275B (en) * 2003-05-16 2005-10-21 Via Tech Inc Multi-column wire bonding structure and layout method for high-frequency IC
CN100336218C (zh) * 2003-08-25 2007-09-05 威盛电子股份有限公司 一种高频集成电路多排线打线结构及方法
CN1332445C (zh) * 2003-10-09 2007-08-15 威盛电子股份有限公司 一种高频集成电路多排线打线结构
US7009286B1 (en) 2004-01-15 2006-03-07 Asat Ltd. Thin leadless plastic chip carrier
US7411289B1 (en) 2004-06-14 2008-08-12 Asat Ltd. Integrated circuit package with partially exposed contact pads and process for fabricating the same
US7091581B1 (en) 2004-06-14 2006-08-15 Asat Limited Integrated circuit package and process for fabricating the same
US7595225B1 (en) 2004-10-05 2009-09-29 Chun Ho Fan Leadless plastic chip carrier with contact standoff
JP4964780B2 (ja) 2004-11-12 2012-07-04 スタッツ・チップパック・インコーポレイテッド ワイヤボンド相互接続、半導体パッケージ、および、ワイヤボンド相互接続の形成方法
US7868468B2 (en) * 2004-11-12 2011-01-11 Stats Chippac Ltd. Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates
US7358119B2 (en) * 2005-01-12 2008-04-15 Asat Ltd. Thin array plastic package without die attach pad and process for fabricating the same
JP4558539B2 (ja) * 2005-03-09 2010-10-06 日立協和エンジニアリング株式会社 電子回路用基板、電子回路、電子回路用基板の製造方法および電子回路の製造方法
US7348663B1 (en) 2005-07-15 2008-03-25 Asat Ltd. Integrated circuit package and method for fabricating same
US7410830B1 (en) 2005-09-26 2008-08-12 Asat Ltd Leadless plastic chip carrier and method of fabricating same
US7701049B2 (en) * 2007-08-03 2010-04-20 Stats Chippac Ltd. Integrated circuit packaging system for fine pitch substrates
US7911040B2 (en) * 2007-12-27 2011-03-22 Stats Chippac Ltd. Integrated circuit package with improved connections
US8106474B2 (en) * 2008-04-18 2012-01-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device

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JPH02184054A (ja) * 1989-01-11 1990-07-18 Toshiba Corp ハイブリッド型樹脂封止半導体装置
US5045151A (en) * 1989-10-17 1991-09-03 Massachusetts Institute Of Technology Micromachined bonding surfaces and method of forming the same
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US5578869A (en) * 1994-03-29 1996-11-26 Olin Corporation Components for housing an integrated circuit device
US5530287A (en) * 1994-09-14 1996-06-25 Unisys Corporation High density wire bond pattern for integratd circuit package
US5808872A (en) * 1994-11-15 1998-09-15 Nippon Steel Corporation Semiconductor package and method of mounting the same on circuit board
US5808354A (en) * 1994-11-21 1998-09-15 Samsung Electronics Co., Ltd. Lead frame for a semiconductor device comprising inner leads having a locking means for preventing the movement of molding compound against the inner lead surface
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US5736792A (en) * 1995-08-30 1998-04-07 Texas Instruments Incorporated Method of protecting bond wires during molding and handling
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JPH09199549A (ja) * 1996-01-22 1997-07-31 Denso Corp ワイヤボンディング方法
US6001724A (en) * 1996-01-29 1999-12-14 Micron Technology, Inc. Method for forming bumps on a semiconductor die using applied voltage pulses to an aluminum wire
US5764486A (en) * 1996-10-10 1998-06-09 Hewlett Packard Company Cost effective structure and method for interconnecting a flip chip with a substrate
US6098283A (en) * 1996-12-19 2000-08-08 Intel Corporation Method for filling vias in organic, multi-layer packages
US5976964A (en) * 1997-04-22 1999-11-02 Micron Technology, Inc. Method of improving interconnect of semiconductor device by utilizing a flattened ball bond
US5973397A (en) * 1997-10-22 1999-10-26 Lsi Logic Corporation Semiconductor device and fabrication method which advantageously combine wire bonding and tab techniques to increase integrated circuit I/O pad density

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