JPH11251355A - 集積回路用のワイヤーボンドされたパッケージの方法と装置 - Google Patents

集積回路用のワイヤーボンドされたパッケージの方法と装置

Info

Publication number
JPH11251355A
JPH11251355A JP28481098A JP28481098A JPH11251355A JP H11251355 A JPH11251355 A JP H11251355A JP 28481098 A JP28481098 A JP 28481098A JP 28481098 A JP28481098 A JP 28481098A JP H11251355 A JPH11251355 A JP H11251355A
Authority
JP
Japan
Prior art keywords
bond
wire
ball
integrated circuit
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28481098A
Other languages
English (en)
Inventor
John W Orcutt
ダブリュー オーカット ジョン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of JPH11251355A publication Critical patent/JPH11251355A/ja
Pending legal-status Critical Current

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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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Abstract

(57)【要約】 【課題】 信頼性ある集積回路ワイヤー内部結線を得
る。 【解決手段】 パッケージは、接地リング(13)と電力リ
ング(16)と、両リングを横切るボンドワイヤー(19)を有
し、ボンドワイヤーは信号トレース(20)に接続する。基
板のダイ空洞内に半導体集積回路(17)を設ける。基板(1
1)の表面上に信号トレースを形成する。ダイ空洞を囲ん
で少なくとも１つの導電性リング（接地(13)リング又は
電力リング(16)）が形成される。ボンドワイヤーでダイ
ボンドパッド(21)を信号トレースに接続する。ボンドワ
イヤーの少なくとも何本かは信号トレースに接続し、導
電性リングを横切る必要がある。信号トレースの内端部
にスペーサー（ボンドボール)(24）を形成することによ
り、ボンドワイヤーは電力又は接地リングから間隔をあ
け、短絡を防止することができる。

Description

【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は、一般にボンドワイ
ヤーが他の構造と間隙を保ちつつその構造を横切るよう
な配置に、ワイヤーボンド技術を利用する集積回路の製
作に関し、典型的には基板上に設けられた導電性信号ト
レースに接続するボンドワイヤーを有する集積回路の製
作に関する。信号トレースは、基板上に形成されたボー
ルまたは他の接触機構をはんだづけするための相互連結
部である。一般的には、集積回路は、セラミックまたは
プラスチックのパッケージ内に設けられる。はんだボー
ル又は他の接触物は基板上に設けられ、エンドユーザー
のボード又はシステムとの接触を与える。
【０００２】
【従来の技術】半導体の製造において、パッケージの１
つの好適な形は、ボールグリッドアレーパッケージ即ち
BGAパッケージである。ボールグリッドアレーパッケー
ジでは、集積回路ダイが設けられる。集積回路ダイの入
力と出力パッドを基板に接続するため、ボンドワイヤー
を使用する。基板は、セラミック、プラスチック、BT樹
脂即ちいわゆる「グリーンボード」、ファイバーガラ
ス、テープ、絶縁挿入物、フィルム又は他の好適な絶縁
材料等の色々の材料で作ることができる。集積回路のボ
ンドパッドに接続するボンドワイヤーを受ける導電材料
のトレース、通常は銅又は金又は導電性合金のトレース
を、基板が支持する。トレースは次にボンドワイヤーか
らの信号をはんだボールに結合する。はんだボールは、
あるBGAパッケージでは、基板の集積回路ダイを支持す
る側と反対側上に形成される。基板の集積回路側上のト
レースを反対側に形成されたはんだボールに接続するの
に、しばしば貫通孔即ち管型結線が使用される。はんだ
ボールは、基板上の信号トレースに接続し、パッケージ
の外部から集積回路への電気接続を与える。集積回路を
含む空洞は、通常ポッティング材料で満たすか又は、通
常の熱硬化性又は熱可塑性モールド化合物即ち樹脂を使
用してモールドプレスでモールドされる。
【０００３】この配置の代替としては、ピングリッドア
レー即ちPGA パッケージと、集積回路を基板又は材料に
接続するボンドワイヤーを有する他の同様のパッケージ
の型がある。基板とエンドユーザーのボード又はシステ
ムの間を接続する１つの材料選択として、はんだボール
を使用できるが、基板とエンドユーザーのボードの間の
直接物理的接触、導電性エポキシ樹脂、導電性テープ、
はんだ浸漬リード線等の他の配置を使用することもでき
る。改善したパッケージの形では、「下側空洞(ｃａｖ
ｉｔｙ down）」パッケージを使用することができる。
図１は、このようなパッケージの断面図である。基板11
は底面に空洞12を有する。集積回路ダイ17が空洞内に逆
さに置かれ、集積回路ダイ17の底面が基板11と物理的接
触をし、ダイ17のボンドパッドは出来上がったパッケー
ジの底面に向かって下方を指すように向いている。次
に、ボンドワイヤー19を使用して、集積回路17の入力と
出力のボンドパッドを基板11の底面に形成された金、ア
ルミニウム、銅又は他の導電体の導電性トレース20に接
続する。信号トレース20は、基板11上のボール受容パッ
ド（見えない）に導き、そこにはんだボール15が付けら
れる。次に、ポッティング材料23でダイ空洞を覆い、集
積回路17とボンドワイヤー19と信号トレースを、汚染、
微粒子、湿度から保護する。
【０００４】図１の下側空洞パッケージは、上述の従来
技術のパッケージと比較していくつかの利点がある。ト
レースとはんだボールは物理的に基板の底面に配置され
るので、貫通孔結線をなくすことができる。基板はダイ
の底面と熱接触するので、基板に良い熱導伝体を使用す
れば、パッケージは優れた熱的性能を与える。熱的性能
をさらによくするため、パッケージの上に熱シンク又は
フィンを組み込むこともできる。これらが集積回路の他
の型と比べて、コストと性能の利点である。下側空洞の
集積回路パッケージの製造上の問題は、ボンドワイヤー
とポッティング材料のために得られる空間が制限される
ことである。パッケージの下に得られる垂直間隔（図１
の「t 」）は、はんだボールの直径で制限される。ワイ
ヤーが、集積回路のボンドパッドから基板の信号トレー
スへ配線されるとき、ワイヤー彎曲部の高さがはんだボ
ールが付けられたとき得られる間隔である垂直領域
「t」内に配置されるようにする。ボンドワイヤーの高
さは、彎曲部の頂点が基板表面より非常に高くなること
はできず、そのためワイヤーが基板表面に殆ど平行又は
少なくとも非常に近くなければならない。
【０００５】高性能集積回路をパッケージする場合、基
板回路を簡単にし、基板を変更することなく必要に応じ
てダイへの電力と接地接続を追加できるようにするた
め、導電性の電力と接地リングを設けることが好まし
い。こうすると空洞の周り全てで電力と接地接続が得ら
れるので、異なる基板を使用せずにパッケージに異なる
ダイを使用することができる。電力と接地リングは、図
２に示すように集積回路ダイと基板信号トレースの間の
集積回路ダイの周りに置かれ、これについては以下に詳
述する。電力と接地リングは、集積回路を全ての側面で
囲む。ボンドワイヤーは、基板の信号トレースに到達す
るのにリングを越えて行く必要がある。
【０００６】
【発明が解決しようとする課題】しかし、ボンドワイヤ
ーがほとんど基板と平行でなければならないパッケージ
では、従来技術の電力と接地リングを使用することはで
きない。ボンドワイヤーが電力と接地リングに非常に近
接して越え、実際に電力と接地リングと短絡する場合が
あるからである。この問題は、例えば図１の下側空洞パ
ッケージに電力と接地リングを使用してピングリッドア
レー（「PGA 」）、パッケージとボールグリッドアレー
（「BGA 」）パッケージを作るときに起こる。従って、
間隙の問題があるが、ボンドワイヤーに信頼できるワイ
ヤー間隙を与える方法と装置の必要性がある。また、ワ
イヤーの内部結線とリングの間の間隙の問題がある電力
と接地リングを有するパッケージにおいて、信頼性ある
集積回路ワイヤー内部結線の必要性がある。
【０００７】
【課題を解決するための手段】一般に本発明の１態様と
して、障害物に物理的又は電気的に接触せずに導電性ト
レース又は他の障害物を越えなければならないボンドワ
イヤーのためにわずかな間隙を作る装置と方法が提供さ
れる。本発明の用途では、下側空洞のパッケージ内に集
積回路が設けられ、パッケージの基板表面に殆ど平行な
ボンドワイヤーを使用し、集積回路に電力又は接地電圧
を与えるために少なくとも１つの広い電力リングを有す
る。その後、完成した集積回路用のパッケージを形成す
る方法と装置が提供される。
【０００８】
【発明の実施の形態及び実施例】図２は、接地と電力リ
ングを備える従来の下側空洞BGA 集積回路パッケージの
底面図を示す。図２で、基板11は内部にダイ空洞12が形
成されている。接地と電力リング13と16は、導電体でで
きていて、一般には銅又は銅合金トレース又は金又は金
合金又は他の導電性合金等の他の従来の導電体から形成
されたトレースが、基板11の表面に形成されダイ空洞12
を囲む。接地リング13は、さらに完成した集積回路の接
地ピンとして示されるはんだボール15に接続する。この
接続は、ボンドワイヤーで又は好適には基板上のトレー
スを使用して行うことができるが、リング16と13を短絡
させずに第２の電力リング16を横切らなければならな
い。電力リング16は接地リング13を囲んで設けられ、集
積回路の電力を与えるのに電力供給と接地電圧リングが
使用される。電力リング16ははんだボール14に接続さ
れ、該はんだボールは、基板11上に形成された他のトレ
ースを使用するパッケージされた集積回路用の電力ピン
として示される。例えば集積回路業界で知られているよ
うに、スイッチ回路電源を他の電源から分離することに
より、抵抗を下げノイズをなくすため別の電力と接地リ
ングを設けることもできる。また、ある集積回路例えば
あるメモリー又はDRAMデバイスは、異なる電圧の複数電
源又は接地源を必要とする。本発明は、少なくとも１つ
又必要数だけのダイ空洞を囲む電力リングを使用する。
【０００９】集積回路ダイ17がダイ空洞12内に置かれ、
ダイ取付けエポキシ樹脂、熱伝導性テープ、又は他の従
来の集積回路ダイ取付け技術を使用して基板に取り付け
られる。集積回路ダイ17上のボンドパッド21が、ボンド
ワイヤー19により基板11上の信号トレース20に接続され
る。ボンドワイヤー19は、金、アルミニウム、銀、又は
銀／金等の他の導電性合金でできていて、従来のボール
ボンディング技術を使用してボンドパッドに取り付けら
れる。ワイヤーボンディングステーションがボンドパッ
ド上にボールを置き、これをボンドパッド21上に電気的
物理的に付ける。ボンドワイヤー19は、各ボンドパッド
を基板上の信号トレース20に接続する。ボンドワイヤー
は、ステッチボンド又は他の従来のボンドワイヤー用の
接合を使用して信号トレースに取り付けられる。ボンド
ワイヤー19は、意図的にどちらかのリングに接続される
ボンドワイヤーを除いて、接地リング13と電力リング16
を横切り、これらと電気的に絶縁されていなければなら
ない。
【００１０】集積回路ダイは、多数の機能の何れを有し
ていても良い。例えば、DRAM、SRAM、EPROM 、同期DRAM
又は他のメモリー等のメモリーデバイス、デジタル信号
プロセッサー(DSP）、マイクロプロセッサー、又はASI
C、半注文IC、プログラム可能なゲートアレー、他のプ
ログラム可能な又は注文集積回路等のユーザーが特定す
る機能等である。図３は、好適ではない実施例を示し、
従来公知のワイヤーボンディング技術を使用して、図２
の下側空洞パッケージを製造たとき得られる結果を示
す。図３において、基板11は内部にダイ空洞12が形成さ
れている。集積回路ダイ17は空洞内に置かれ、ダイ取付
けエポキシ又はテープを使用して取り付けられる。ボン
ドパッド21は、ボール型ワイヤーボンドを使用してボン
ドパッドに取り付けられたボンドワイヤー19と共に示さ
れる。ボンドワイヤー19は、接地と電力リング13と16を
横切って信号トレース20に接続される。はんだボール15
は、基板11に取り付けられ、電気的物理的に信号トレー
ス20に接続される。
【００１１】図３の好適でない配置は、本発明の解決す
る問題を示すため使用される。図３において、ボンドワ
イヤー19は、接地と電力リング13と16を横切る。ボンド
ワイヤー19と接地と電力リング13と16の間に得られる垂
直間隙は十分でないことが分かる。この配置を有する製
造された集積回路パッケージでは、ボンドワイヤー19と
電力リングの間に適正な間隙がないので、ボンドワイヤ
ー19と電力リングの１つとの間に電気的短絡が生じ、望
ましくない。図４は、図３の断面図の一部の拡大図であ
り、ボール15を省略してあるが、パッケージの一部であ
り図３に示す問題を更に例示する。また、ボンドワイヤ
ー19は、接地リング13と電力リング16を横切り（この例
の場合。他の例では１つの接地リングもある）、基板11
上に形成された信号トレース20を集積回路のボンドパッ
ド21に接続する。ボンドワイヤー19は、接地と電力リン
グ13と16に近すぎ、ボンドワイヤー19と電力リングの間
の意図しない接続と電気的短絡を防止するために十分な
間隙を与えることができない。また、実際に接触しなく
ても、ボンドワイヤーと電力リングの間が非常に狭いの
でこれらの間に混信が起こる場合がある。
【００１２】他の従来のパッケージでも図４の配置は、
同様の問題を示す。例えば、ピングリッドアレーパッケ
ージで、ICを基板に接続するのにワイヤーボンディング
を使用し、図2,3,4 に示す電力と接地リングを使用する
ものでは、ボンドワイヤーは電力と接地リングを横切ら
なければならず、従って短絡の問題が起こる可能性があ
る。本発明は、BGA 、PGA 、及び他のパッケージ配置に
使用することができ、これらの配置では、ボンドワイヤ
ーが電力と接地リング又は他の構造を接触せずに横切ら
なければならず、ボンドワイヤーの間隙の問題が起こ
る。図５は、図２の底面図に示すパッケージに本発明の
方法と装置を使用した好適な実施例の断面図である。図
５において、基板11は集積回路ダイ17を含むダイ空洞12
と共に部分断面で示す。図３に示すようなボール15は図
示しないが設けることができる。ボンドワイヤー19は、
ボンドパッド21を信号トレース20に接続する。ボンドワ
イヤー19は、ボンドパッド21にボール型ワイヤーボンド
を有する。ボンドワイヤー19は、電力リング13と16を横
切って行き、信号トレース20の内端部上又はその近くに
置かれたボールボンド24にステッチボンドされる。ボー
ルボンド24は、従来のボールを作るボールボンディング
技術を使用して作られ、次に通常の彎曲とステッチボン
ドの手順を省略し、次にボール上でのワイヤー破断に直
接行き、信号トレース20の内端部にボールが残るように
する。この作業は、ボンドパッド21の信号トレース20へ
のワイヤーボンディングの前に行われる。ワイヤーボン
ディング作業は、いくつかの方法で行うことができ、例
えば初めに基板の各信号トレース20上にボールボンド24
を形成し、次にダイパッド21上にボール型ワイヤーボン
ドし、次にボールボンド24の頂部にワイヤーのステッチ
ボンドを形成することにより、ボールとステッチ接続を
使用して、各ダイパッド21を対応する信号トレース20に
接続することができる。又は、従来のワイヤーボンダー
を設置し、初めに特定の信号トレース20上にボールボン
ドを形成し、次に対応するボンドパッド21に移動し、第
２のボールボンドを形成し、ボンドワイヤー19を信号ト
レース20へ引き、ボール24の頂部にステッチボンドする
ことにより、各接続部を順に形成することができる。こ
の配置の利点は、電力リング13と16を横切るボンドワイ
ヤー19の間の間隙が、ボールボンド24の高さにより増加
することである。このように間隔が大きくなると、ボン
ドワイヤー19と電力リング13と16の間で短絡する可能性
がなくなる。
【００１３】図５に示す本発明の例は、ダイ空洞を囲む
２つのリング13と16を示す。より簡単な例では、１つの
リングのみが使用される。また、電力リング16に接続す
る必要があるボンドパッドの場合には、図５の２つのリ
ングの例では、接地リング13を横切るのに必要な間隙を
作るため、ボンドワイヤーと電力リング16の間にスペー
サーとなるボンドワイヤーボールが必要であろう。追加
のリングを使用することもでき、この場合どのような数
のリングを横切るどのワイヤーボンドも、それとリング
又はそれが接続する信号トレースの間に、本発明のスペ
ーサーとなるボンドボールが配置される。図６を参照す
ると、図２のような図が示されるが、２つのリング13と
16に近い信号トレース20の部分上にボール24が形成さ
れ、図５に示すように２つのリングの近くでワイヤー19
を上昇させる。ボール24は、基板の下側上の最も高い点
と同じ高さを有するのが好ましいが、この高さは必須で
はなく、最も高い点より高くても低くてもよい。ボール
24が高ければ、ワイヤー19が２つのリング13と16に向か
ってたわむ可能性はそれだけ低くなる。しかし、ボール
24の高さは、パッケージの最終的な厚さに影響する。従
って、ボールの高さと最終的なパッケージの厚さの間の
兼ね合いがある。ワイヤー19は、ステッチボンドにより
ボール24に接続されるのが好ましい。
【００１４】ボンドワイヤーが他の構造に接触せずに横
切る必要があるときは、間隙の許容度を大きくするの
に、本発明の方法と装置を使用することができる。例と
しては、電力と接地リングを有するPGA パッケージ、又
はボンドワイヤーが基板トレース又は材料に接触せずに
横切る型の他のボンドパッケージがある。図７は、図５
の好適な実施例を作るのに必要なボンディングのステッ
プを１つの好適な方法で示す。ワイヤーボンダーが、必
要な作業を幾つかの異なる順序で行うことができること
が、当業者には分かり、そのそれぞれが本発明の範囲と
開示される好適な実施例に入る。図７に示す方法は、本
発明のBAG パッケージを製造する例示の一連のステップ
を示すが、本発明の範囲をこの特定のステップの順序に
限定する意味ではない。
【００１５】図７において、ワイヤーボンダーのボンド
ヘッドは、ボンドワイヤーの連続供給源からボンドワイ
ヤーを受け取る。ステップ61で、ボンダーのヘッド上で
ワイヤーの端部にボールボンドを形成するのに、ワイヤ
ーボンディング技術で公知の従来の「フレームオフ(fla
me off)」技術を使用する。ステップ63で、ボンダーの
ヘッドはボールボンドを信号トレース20の内端部にボー
ルボンドを置く。ステップ65で、ボンディング技術で公
知のようにボンドワイヤーをボールから引っ張る。こう
すると、ボールボンド24は信号トレース20の端部に残
る。ステップ67は、ステップ61の繰り返しであり、従来
の「フレームオフ」技術を使用してボンドワイヤーの端
部にボールを形成する。ステップ69で、ボンダーのヘッ
ドは、上から対応するボンドパッド21に近づく。ボンド
ワイヤーの端部は再度ボール型になる。ステップ69で、
このボールがボンドパッド上に置かれる。ボンドパッド
にボンディングする従来の技術、例えば超音波エネルギ
ー、振動、圧力を使用してボンドパッドへの物理的電気
的接合を改善する。ステップ71で、ボンドヘッドはボン
ドパッド21から離れるが、この時ワイヤーは切断され
ず、ボンドパッド21に接続したままである。ボンドワイ
ヤー19は、ボンドパッド21から伸ばされる。
【００１６】ステップ73で、ボンドヘッドは前に形成し
たボールボンド24に近づき、ボンドパッド21からボンド
ワイヤーを延ばす。ボンドワイヤーは、ダイ空洞を横切
り、電力リング13と16を横切って延ばされる。次にワイ
ヤーボンダーは、ボール24上にステッチ型ワイヤーボン
ドを形成する。最後に、ワイヤーのステッチボンドを使
用してボンドワイヤー19の端部をボールボンド25上に置
き、ワイヤーを切断して、ワイヤーボンドが完成する。
次のボールボンド製作のため、フレームオフを使用して
他のボールを形成する。次に、ステップ75で、ボンダー
のヘッドは、基板上の次の信号トレース上に位置する。
ステップ77は、プロセスの繰り返し製作ステップを示
す。パッケージの各ボンドパッドと信号トレースのた
め、図７のステップを繰り返す。ワイヤーの彎曲の少な
いボンドワイヤーは、各信号のため、各ボンドパッドか
ら信号トレースへ延び、電力リングを横切って配線され
る。
【００１７】図７に示すステップは、図５の装置を作る
のに使用する１つの可能な順番に過ぎない。他の方法
は、基板11の信号トレースの内端部に全てのボンドワイ
ヤーボールを形成し、次にICボンドパッドを対応するボ
ンドワイヤーボールに順に結合することである。接地リ
ングに加えて、Vdd 等の他の供給電圧のため追加のリン
グを設けることが好ましい。これらのリングもまた空洞
を囲み、接地リングの内側にも外側にも作ることができ
る。これらもまた、ボンドワイヤーで典型的なICの１つ
以上のボンドパッドに接続することができる。もし、こ
れらのリングが第１接地リングの外側にあれば間隙の問
題があり、電力リングをICのボンドパッドにボンディン
グする前に、ボンドワイヤーボールを設け、ワイヤーは
短絡又は間隙の問題なく内側リングを横切ることができ
るようにしなければならない。
【００１８】本発明を例示の実施例で述べてきたが、こ
の詳細な説明は発明を限定する意味ではない。多様な変
更、例示の実施例の組み合わせ、本発明の他の実施例
も、発明の詳細な説明を参照すれば、当業者には明らか
であろう。それゆえ、特許請求の範囲は、このような偏
向と実施例を包含するものである。以上の記載に関連し
て、以下の各項を開示する。 1. 集積回路用パッケージにおいて、(a) 上面と下面を
有する基板、(b) 前記基板の前記上面と下面の１方に配
置され、上にボンドパッドを持つ集積回路ダイを受ける
ダイ空洞、(c) 前記基板上に配置された信号トレース、
(d) 前記信号トレースから絶縁され、少なくとも前記信
号トレースと少なくとも前記ボンドパッドの間に配置さ
れた、前記基板上の少なくとも１つの電気的領域、(e)
前記信号トレース上に配置され上に延びる導電性のスペ
ーサー、及び、（ｆ) 前記集積回路ダイと、前記信号ト
レースから離れた前記スペーサーの一部の間の少なくと
も１つのボンドワイヤー接続、を備え、前記ボンドワイ
ヤーは前記電気的領域から絶縁されて前記電気的領域を
横切ることを特徴とするパッケージ。 2. 前記スペーサーはボールである請求項１のパッケー
ジ。 3. 前記ボールは、前記信号トレースへのボールボンド
である請求項２のパッケージ。 4. 前記スペーサーへの前記ボンドワイヤー接続は、ス
テッチボンドである請求項１のパッケージ。 5. 前記スペーサーへの前記ボンドワイヤー接続は、ス
テッチボンドである請求項２のパッケージ。 6. 所定の間隙をおいて避ける必要のある障害物の反対
側上の１対の位置の間に接合を形成する方法において、
(a) ワイヤーの反対側端部を接合する第１、第２位置を
設け、前記位置はワイヤーが避けるべき障害物の反対面
上に配置され、(b) 前記第１位置上に前記障害物上に延
びるボールを形成し、(c) 前記第２位置にワイヤーをボ
ンディングし、(d) 次に前記第１位置から離れた前記ボ
ールの一部に前記ワイヤーを延ばしてボンディングす
る、ステップを備えることを特徴とする方法。 7. 前記第１位置は基板上に配置された信号トレースで
あり、前記第２位置は集積回路のダイパッドである請求
項６の方法。 8. キャピラリからワイヤーを延ばし、前記延ばしたワ
イヤーでボールを形成し、前記ボールを前記第１位置に
置き、前記ボール上で前記ワイヤーを破断するステップ
により、ボールが形成される請求項６の方法。 9. キャピラリからワイヤーを延ばし、前記延ばしたワ
イヤーでボールを形成し、前記ボールを前記第１位置に
置き、前記ボール上で前記ワイヤーを破断するステップ
により、ボールが形成される請求項７の方法。 10. 前記位置への前記ボンドは第２ボールボンドであ
り、前記ボールへの前記ボンドはステッチボンドである
請求項６の方法。 11. 接地リング(13)と電力リング(16)と、両リングを横
切るボンドワイヤー(19)を有し、ボンドワイヤーは信号
トレース(20)に接続する集積回路用パッケージ。基板の
ダイ空洞内に半導体集積回路(17)を設ける。基板(11)の
表面上に少なくとも１つの導電性リングと絶縁した信号
トレースを形成する。ダイ空洞を囲んで少なくとも１つ
の導電性領域が形成される。ボンドワイヤーでダイボン
ドパッド(21)を信号トレースに接続する。ボンドワイヤ
ーの少なくとも何本かは信号トレースに接続し、導電性
リングを横切る必要がある。信号トレースの内端部にス
ペーサー(24)を形成することにより、ボンドワイヤーは
電力又は接地リングから間隔をあける。信号トレース上
に形成されたスぺーサーによる間隔ができるので、パワ
ーリングを横切るワイヤーの短絡を防止できる。
【図面の簡単な説明】
【図１】 集積回路用の従来のBGA パッケージの断面
図。
【図２】 導電性の電力と接地リングを有する従来の下
側空洞パッケージの底面図。
【図３】 本発明で扱う問題を示す好適でない実施例の
断面図。
【図４】 図３の好適でない実施例の断面図の拡大図。
【図５】 本発明の装置と方法を使用して形成されたパ
ッケージの拡大断面図。
【図６】 本発明の好適な実施例を示す図２と同様の底
面図。
【図７】 図５に示すパッケージのワイヤーボンドを形
成する一連のステップの例。
【符号の説明】
11 基板 12 ダイ空洞 13 接地リング 15 はんだボール 16 電力リング 17 集積回路ダイ 19 ボンドワイヤー 20 信号トレース 21 ボンドパッド 24 ボールボンド

Claims (2)

    【特許請求の範囲】
  1. 【請求項１】 集積回路用パッケージにおいて、 (a) 上面と下面を有する基板、 (b) 前記基板の前記上面と下面の１方に配置され、上に
    ボンドパッドを持つ集積回路ダイを受けるダイ空洞、 (c) 前記基板上に配置された信号トレース、 (d) 前記信号トレースから絶縁され、少なくとも前記信
    号トレースと少なくとも前記ボンドパッドの間に配置さ
    れた、前記基板上の少なくとも１つの電気的領域、 (e) 前記信号トレース上に配置され上に延びる導電性の
    スペーサー、及び、 (f) 前記集積回路ダイと、前記信号トレースから離れた
    前記スペーサーの一部の間の少なくとも１つのボンドワ
    イヤー接続、を備え、前記ボンドワイヤーは前記電気的
    領域から絶縁されて前記電気的領域を横切ることを特徴
    とするパッケージ。
  2. 【請求項２】 所定の間隙をおいて避ける必要のある障
    害物の反対側上の１対の位置の間に接合を形成する方法
    において、 (a) ワイヤーの反対側端部を接合する第１、第２位置を
    設け、前記位置はワイヤーが避けるべき障害物の反対側
    上に配置され、 (b) 前記第１位置上に前記障害物上に延びるボールを形
    成し、 (c) 前記第２位置にワイヤーをボンディングし、 (d) 次に前記第１位置から離れた前記ボールの一部に前
    記ワイヤーを延ばしてボンディングする、ステップを備
    えることを特徴とする方法。
JP28481098A 1997-09-19 1998-09-21 集積回路用のワイヤーボンドされたパッケージの方法と装置 Pending JPH11251355A (ja)

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US60/059539 1997-09-19

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EP (1) EP0903780A3 (ja)
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SG (1) SG68074A1 (ja)
TW (1) TW436949B (ja)

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US6194786B1 (en) 2001-02-27
EP0903780A2 (en) 1999-03-24
SG68074A1 (en) 1999-10-19
TW436949B (en) 2001-05-28
EP0903780A3 (en) 1999-08-25
KR19990029932A (ko) 1999-04-26

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