JPH0310670Y2 - - Google Patents
Info
- Publication number
- JPH0310670Y2 JPH0310670Y2 JP1986104810U JP10481086U JPH0310670Y2 JP H0310670 Y2 JPH0310670 Y2 JP H0310670Y2 JP 1986104810 U JP1986104810 U JP 1986104810U JP 10481086 U JP10481086 U JP 10481086U JP H0310670 Y2 JPH0310670 Y2 JP H0310670Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- resin plate
- bonding
- metal wire
- thin metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/884—
-
- H10W90/734—
-
- H10W90/754—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986104810U JPH0310670Y2 (enExample) | 1986-07-08 | 1986-07-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986104810U JPH0310670Y2 (enExample) | 1986-07-08 | 1986-07-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6310552U JPS6310552U (enExample) | 1988-01-23 |
| JPH0310670Y2 true JPH0310670Y2 (enExample) | 1991-03-15 |
Family
ID=30978646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986104810U Expired JPH0310670Y2 (enExample) | 1986-07-08 | 1986-07-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310670Y2 (enExample) |
-
1986
- 1986-07-08 JP JP1986104810U patent/JPH0310670Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6310552U (enExample) | 1988-01-23 |
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