JPH08502389A - シール幅を縮小した金属電子パッケージ - Google Patents

シール幅を縮小した金属電子パッケージ

Info

Publication number
JPH08502389A
JPH08502389A JP6510006A JP51000694A JPH08502389A JP H08502389 A JPH08502389 A JP H08502389A JP 6510006 A JP6510006 A JP 6510006A JP 51000694 A JP51000694 A JP 51000694A JP H08502389 A JPH08502389 A JP H08502389A
Authority
JP
Japan
Prior art keywords
package
adhesive
cavity
cover
electronic package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6510006A
Other languages
English (en)
Japanese (ja)
Inventor
イー． タイラー，デレク
マフリカー，ディーパック
エム． パスクアロニ，アンソニー
エス． ブラデン，ジェフリー
アール． ホフマン，ポール
Original Assignee
オリン コーポレイション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オリン コーポレイション filed Critical オリン コーポレイション
Publication of JPH08502389A publication Critical patent/JPH08502389A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W76/157—
    • H10W76/10—
    • H10W76/47—
    • H10W76/60—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W70/682—
    • H10W72/381—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP6510006A 1992-10-13 1993-09-22 シール幅を縮小した金属電子パッケージ Pending JPH08502389A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US959,571 1992-10-13
US07/959,571 US5324888A (en) 1992-10-13 1992-10-13 Metal electronic package with reduced seal width
PCT/US1993/008891 WO1994009512A1 (en) 1992-10-13 1993-09-22 Metal electronic package with reduced seal width

Publications (1)

Publication Number Publication Date
JPH08502389A true JPH08502389A (ja) 1996-03-12

Family

ID=25502156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6510006A Pending JPH08502389A (ja) 1992-10-13 1993-09-22 シール幅を縮小した金属電子パッケージ

Country Status (10)

Country Link
US (2) US5324888A (enExample)
EP (1) EP0664924A4 (enExample)
JP (1) JPH08502389A (enExample)
KR (1) KR950703795A (enExample)
AU (1) AU5132693A (enExample)
CA (1) CA2145076A1 (enExample)
MX (1) MX9306317A (enExample)
PH (1) PH31026A (enExample)
TW (1) TW241389B (enExample)
WO (1) WO1994009512A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002057182A (ja) * 2000-08-10 2002-02-22 Denso Corp 半導体装置
JP2022081337A (ja) * 2020-11-19 2022-05-31 富士電機株式会社 モジュール型半導体装置およびモジュール型半導体装置の製造方法
JP2023104971A (ja) * 2020-11-30 2023-07-28 華為技術有限公司 クロック発振器およびクロック発振器の生産方法

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5585600A (en) * 1993-09-02 1996-12-17 International Business Machines Corporation Encapsulated semiconductor chip module and method of forming the same
US5455456A (en) * 1993-09-15 1995-10-03 Lsi Logic Corporation Integrated circuit package lid
DE4405710A1 (de) * 1994-02-23 1995-08-24 Bosch Gmbh Robert Vorrichtung mit einer Trägerplatte und Verfahren zum Aufbringen eines Passivierungsgels
JPH09511617A (ja) * 1994-04-05 1997-11-18 オリン コーポレイション キャビティの充填がなされた金属製電子パッケージ
US6020219A (en) * 1994-06-16 2000-02-01 Lucent Technologies Inc. Method of packaging fragile devices with a gel medium confined by a rim member
US5629835A (en) * 1994-07-19 1997-05-13 Olin Corporation Metal ball grid array package with improved thermal conductivity
EP0734590A1 (en) * 1994-10-14 1996-10-02 National Semiconductor Corporation Integrated circuit package assembly including a window and methods of manufacturing
US5542175A (en) * 1994-12-20 1996-08-06 International Business Machines Corporation Method of laminating and circuitizing substrates having openings therein
JP3269745B2 (ja) 1995-01-17 2002-04-02 株式会社日立製作所 モジュール型半導体装置
US5844309A (en) * 1995-03-20 1998-12-01 Fujitsu Limited Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition
US5566448A (en) * 1995-06-06 1996-10-22 International Business Machines Corporation Method of construction for multi-tiered cavities used in laminate carriers
EP0778616A3 (en) * 1995-12-05 1999-03-31 Lucent Technologies Inc. Method of packaging devices with a gel medium confined by a rim member
US5767447A (en) * 1995-12-05 1998-06-16 Lucent Technologies Inc. Electronic device package enclosed by pliant medium laterally confined by a plastic rim member
US5939785A (en) * 1996-04-12 1999-08-17 Texas Instruments Incorporated Micromechanical device including time-release passivant
US5894167A (en) * 1996-05-08 1999-04-13 Micron Technology, Inc. Encapsulant dam standoff for shell-enclosed die assemblies
TW392315B (en) * 1996-12-03 2000-06-01 Nippon Electric Co Boards mounting with chips, mounting structure of chips, and manufacturing method for boards mounting with chips
US5898572A (en) * 1996-12-24 1999-04-27 Decibel Instruments, Inc. Method and apparatus for the mitigation of noise generated by personal computers
US6020628A (en) * 1997-07-21 2000-02-01 Olin Corporation Optical component package with a hermetic seal
US5990418A (en) * 1997-07-29 1999-11-23 International Business Machines Corporation Hermetic CBGA/CCGA structure with thermal paste cooling
JPH1197656A (ja) * 1997-09-22 1999-04-09 Fuji Electric Co Ltd 半導体光センサデバイス
US5929515A (en) * 1997-10-01 1999-07-27 The Charles Stark Draper Laboratory, Inc. Gettering enclosure for a semiconductor device
EP1038312A1 (en) * 1998-01-07 2000-09-27 Fed Corporation Assembly for and method of packaging integrated display devices
IL123207A0 (en) * 1998-02-06 1998-09-24 Shellcase Ltd Integrated circuit device
JP3846094B2 (ja) * 1998-03-17 2006-11-15 株式会社デンソー 半導体装置の製造方法
US6621173B1 (en) * 1998-07-23 2003-09-16 Dow Corning Toray Silicone Co., Ltd. Semiconductor device having an adhesive and a sealant
US6521989B2 (en) * 1998-10-08 2003-02-18 Honeywell Inc. Methods and apparatus for hermetically sealing electronic packages
US6753922B1 (en) 1998-10-13 2004-06-22 Intel Corporation Image sensor mounted by mass reflow
JP3395164B2 (ja) * 1998-11-05 2003-04-07 インターナショナル・ビジネス・マシーンズ・コーポレーション 半導体装置
JP2000228467A (ja) * 1998-12-02 2000-08-15 Toshiba Corp 半導体封止用樹脂組成物及び半導体装置とその製造方法
DE19958229B4 (de) * 1998-12-09 2007-05-31 Fuji Electric Co., Ltd., Kawasaki Optisches Halbleiter-Sensorbauelement
GB2359927B (en) * 1998-12-21 2003-11-26 Intel Corp Windowed non-ceramic package having embedded frame
US6369452B1 (en) * 1999-07-27 2002-04-09 International Business Machines Corporation Cap attach surface modification for improved adhesion
US7394153B2 (en) * 1999-12-17 2008-07-01 Osram Opto Semiconductors Gmbh Encapsulation of electronic devices
AU1904000A (en) * 1999-12-17 2001-06-25 Osram Opto Semiconductors Gmbh Encapsulation for organic led device
WO2002025087A1 (en) * 2000-09-22 2002-03-28 Aisin Aw Co., Ltd. Drive device with electronic circuit
US6512183B2 (en) * 2000-10-10 2003-01-28 Matsushita Electric Industrial Co., Ltd. Electronic component mounted member and repair method thereof
JP4130527B2 (ja) * 2000-12-13 2008-08-06 三菱電機株式会社 半導体装置
JP2002198664A (ja) * 2000-12-26 2002-07-12 Seiko Instruments Inc 携帯電子機器
KR20030001039A (ko) * 2001-06-28 2003-01-06 동부전자 주식회사 반도체 캡슐화 구조
US6683250B2 (en) * 2001-07-25 2004-01-27 Visteon Global Technologies, Inc. Protected electronic assembly
US6933537B2 (en) * 2001-09-28 2005-08-23 Osram Opto Semiconductors Gmbh Sealing for OLED devices
JP3788760B2 (ja) * 2001-11-09 2006-06-21 三菱電機株式会社 半導体装置
US6590269B1 (en) * 2002-04-01 2003-07-08 Kingpak Technology Inc. Package structure for a photosensitive chip
JP3566957B2 (ja) * 2002-12-24 2004-09-15 沖電気工業株式会社 半導体装置及びその製造方法
DE10313835A1 (de) * 2003-03-21 2004-09-30 Tyco Electronics Pretema Gmbh & Co.Kg Baueinheit und Verfahren zur Herstellung einer solchen Baueinheit
JP4223851B2 (ja) * 2003-03-31 2009-02-12 ミツミ電機株式会社 小型カメラモジュール
JP2004363380A (ja) * 2003-06-05 2004-12-24 Sanyo Electric Co Ltd 光半導体装置およびその製造方法
US20050012197A1 (en) * 2003-07-15 2005-01-20 Smith Mark A. Fluidic MEMS device
TW593127B (en) * 2003-08-18 2004-06-21 Prime View Int Co Ltd Interference display plate and manufacturing method thereof
JP4594237B2 (ja) * 2003-09-04 2010-12-08 パナソニック株式会社 半導体装置
US8124434B2 (en) * 2004-09-27 2012-02-28 Qualcomm Mems Technologies, Inc. Method and system for packaging a display
US7424198B2 (en) 2004-09-27 2008-09-09 Idc, Llc Method and device for packaging a substrate
US20060270106A1 (en) * 2005-05-31 2006-11-30 Tz-Cheng Chiu System and method for polymer encapsulated solder lid attach
US20070012481A1 (en) * 2005-07-18 2007-01-18 Helmut Prager Circuit board/envelope compound structure
JP4818654B2 (ja) * 2005-07-25 2011-11-16 ソニーケミカル＆インフォメーションデバイス株式会社 発光素子の封止方法
US7417307B2 (en) * 2005-07-29 2008-08-26 Hewlett-Packard Development Company, L.P. System and method for direct-bonding of substrates
US7781697B2 (en) * 2006-04-10 2010-08-24 Hewlett-Packard Development Company, L.P. Micro-display and methods
US7700414B1 (en) 2007-02-22 2010-04-20 Unisem (Mauritius) Holdings Limited Method of making flip-chip package with underfill
JP2008270518A (ja) * 2007-04-20 2008-11-06 Nec Saitama Ltd ノイズシールドケースおよび電子部品のシールド構造
US9070679B2 (en) * 2009-11-24 2015-06-30 Marvell World Trade Ltd. Semiconductor package with a semiconductor die embedded within substrates
DE102011088495A1 (de) * 2011-12-14 2013-06-20 Endress + Hauser Flowtec Ag Gehäusedeckel für ein Elektronik-Gehäuse bzw. damit gebildetes Elektronik-Gehäuse
JP5956783B2 (ja) * 2012-03-02 2016-07-27 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
EP3127148A4 (en) * 2014-03-31 2017-11-15 Multerra Bio, Inc. Low-cost packaging for fluidic and device co-integration
DE102014217351A1 (de) * 2014-08-29 2016-03-03 Robert Bosch Gmbh Modulanordnung sowie Getriebesteuermodul
ES2909452T3 (es) * 2014-10-14 2022-05-06 Carel Ind Spa Dispositivo de control para sistemas de refrigeración y acondicionamiento
CN110572975B (zh) * 2018-06-05 2020-12-15 台达电子工业股份有限公司 具有定位内部电路基板功能的电源供应器及其制作方法
DE102019219381A1 (de) * 2019-12-11 2021-06-17 Zf Friedrichshafen Ag Steckeranordnung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6351542B2 (enExample) * 1982-02-05 1988-10-14 Hitachi Ltd
JPH0249373B2 (enExample) * 1985-09-17 1990-10-30 Kawasaki Steel Co
JPH03163227A (ja) * 1990-10-29 1991-07-15 Mitsubishi Electric Corp 電磁連結装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
JPS5637656A (en) * 1979-09-04 1981-04-11 Nec Corp Airtight container with light transmission opening
JPS6150351A (ja) * 1984-08-20 1986-03-12 Oki Electric Ind Co Ltd Ｅｐｒｏｍ装置
US4709301A (en) * 1985-09-05 1987-11-24 Nec Corporation Package
JPS62145748A (ja) * 1985-12-19 1987-06-29 Mitsubishi Electric Corp 半導体装置
US4965227A (en) * 1987-05-21 1990-10-23 Olin Corporation Process for manufacturing plastic pin grid arrays and the product produced thereby
US4961106A (en) * 1987-03-27 1990-10-02 Olin Corporation Metal packages having improved thermal dissipation
US4897508A (en) * 1988-02-10 1990-01-30 Olin Corporation Metal electronic package
US5019892A (en) * 1988-02-18 1991-05-28 Amp Incorporated Chip carrier with accumulator
US4939316A (en) * 1988-10-05 1990-07-03 Olin Corporation Aluminum alloy semiconductor packages
US5023398A (en) * 1988-10-05 1991-06-11 Olin Corporation Aluminum alloy semiconductor packages
US5060114A (en) * 1990-06-06 1991-10-22 Zenith Electronics Corporation Conformable pad with thermally conductive additive for heat dissipation
US5066368A (en) * 1990-08-17 1991-11-19 Olin Corporation Process for producing black integrally colored anodized aluminum components
NO911774D0 (no) * 1991-05-06 1991-05-06 Sensonor As Anordning ved innkapsling av et funksjonsorgan, samt fremgangsmaate for fremstilling av samme.

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6351542B2 (enExample) * 1982-02-05 1988-10-14 Hitachi Ltd
JPH0249373B2 (enExample) * 1985-09-17 1990-10-30 Kawasaki Steel Co
JPH03163227A (ja) * 1990-10-29 1991-07-15 Mitsubishi Electric Corp 電磁連結装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002057182A (ja) * 2000-08-10 2002-02-22 Denso Corp 半導体装置
JP2022081337A (ja) * 2020-11-19 2022-05-31 富士電機株式会社 モジュール型半導体装置およびモジュール型半導体装置の製造方法
JP2023104971A (ja) * 2020-11-30 2023-07-28 華為技術有限公司 クロック発振器およびクロック発振器の生産方法

Also Published As

Publication number Publication date
US5399805A (en) 1995-03-21
EP0664924A1 (en) 1995-08-02
US5324888A (en) 1994-06-28
PH31026A (en) 1997-12-29
CA2145076A1 (en) 1994-04-28
KR950703795A (ko) 1995-09-20
WO1994009512A1 (en) 1994-04-28
MX9306317A (es) 1994-04-29
EP0664924A4 (en) 1995-08-30
AU5132693A (en) 1994-05-09
TW241389B (enExample) 1995-02-21

Similar Documents

Publication Publication Date Title
JPH08502389A (ja) シール幅を縮小した金属電子パッケージ
US5458716A (en) Methods for manufacturing a thermally enhanced molded cavity package having a parallel lid
US4897508A (en) Metal electronic package
US8039945B2 (en) Plastic electronic component package
KR100806479B1 (ko) 반도체 장치 및 그 제조 방법
US5663106A (en) Method of encapsulating die and chip carrier
TW468257B (en) Exposed heat spreader with seal ring
US5122858A (en) Lead frame having polymer coated surface portions
WO1993018546A1 (en) Molded ring integrated circuit package
JP6797951B2 (ja) パワー半導体モジュール装置及びその製造方法
JPH065742A (ja) 半導体装置、その封止に用いられる樹脂および半導体装置の製造方法
JPH09511617A (ja) キャビティの充填がなされた金属製電子パッケージ
US6355881B1 (en) Means for sealing an electronic or optical component within an enclosure housing
US20100078796A1 (en) Semiconductor Device
US20130094163A1 (en) Surface Mount Electronic Component
JP4359076B2 (ja) 樹脂製中空パッケージ及びそれを用いた半導体装置
EP4241349B1 (en) Semiconductor side emitting laser on board package and method forming same
JP3070929B2 (ja) パッケージの組立方法とパッケージ
JPH0846093A (ja) 半導体装置とその製法
CN115692335A (zh) 芯片封装结构及其制作方法
JPS62252154A (ja) 半導体装置
JPH06342962A (ja) 半導体レーザ装置
JPH08148645A (ja) 樹脂封止型半導体装置
JPH08330344A (ja) 半導体装置
JPH06224326A (ja) 放熱器及びこの放熱器を用いた半導体パッケージ