TW241389B - - Google Patents

Info

Publication number
TW241389B
TW241389B TW082108438A TW82108438A TW241389B TW 241389 B TW241389 B TW 241389B TW 082108438 A TW082108438 A TW 082108438A TW 82108438 A TW82108438 A TW 82108438A TW 241389 B TW241389 B TW 241389B
Authority
TW
Taiwan
Application number
TW082108438A
Other languages
Chinese (zh)
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Application granted granted Critical
Publication of TW241389B publication Critical patent/TW241389B/zh

Links

Classifications

    • H10W76/157—
    • H10W76/10—
    • H10W76/47—
    • H10W76/60—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W70/682—
    • H10W72/381—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—
TW082108438A 1992-10-13 1993-10-12 TW241389B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/959,571 US5324888A (en) 1992-10-13 1992-10-13 Metal electronic package with reduced seal width

Publications (1)

Publication Number Publication Date
TW241389B true TW241389B (enExample) 1995-02-21

Family

ID=25502156

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082108438A TW241389B (enExample) 1992-10-13 1993-10-12

Country Status (10)

Country Link
US (2) US5324888A (enExample)
EP (1) EP0664924A4 (enExample)
JP (1) JPH08502389A (enExample)
KR (1) KR950703795A (enExample)
AU (1) AU5132693A (enExample)
CA (1) CA2145076A1 (enExample)
MX (1) MX9306317A (enExample)
PH (1) PH31026A (enExample)
TW (1) TW241389B (enExample)
WO (1) WO1994009512A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104081167A (zh) * 2011-12-14 2014-10-01 恩德斯+豪斯流量技术股份有限公司 用于电子器件壳体的壳体盖或以此形成的电子器件壳体

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JP4151207B2 (ja) * 2000-08-10 2008-09-17 株式会社デンソー 半導体装置
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JP2002198664A (ja) * 2000-12-26 2002-07-12 Seiko Instruments Inc 携帯電子機器
KR20030001039A (ko) * 2001-06-28 2003-01-06 동부전자 주식회사 반도체 캡슐화 구조
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JP3566957B2 (ja) * 2002-12-24 2004-09-15 沖電気工業株式会社 半導体装置及びその製造方法
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JP4223851B2 (ja) * 2003-03-31 2009-02-12 ミツミ電機株式会社 小型カメラモジュール
JP2004363380A (ja) * 2003-06-05 2004-12-24 Sanyo Electric Co Ltd 光半導体装置およびその製造方法
US20050012197A1 (en) * 2003-07-15 2005-01-20 Smith Mark A. Fluidic MEMS device
TW593127B (en) * 2003-08-18 2004-06-21 Prime View Int Co Ltd Interference display plate and manufacturing method thereof
JP4594237B2 (ja) * 2003-09-04 2010-12-08 パナソニック株式会社 半導体装置
US8124434B2 (en) * 2004-09-27 2012-02-28 Qualcomm Mems Technologies, Inc. Method and system for packaging a display
US7424198B2 (en) 2004-09-27 2008-09-09 Idc, Llc Method and device for packaging a substrate
US20060270106A1 (en) * 2005-05-31 2006-11-30 Tz-Cheng Chiu System and method for polymer encapsulated solder lid attach
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JP4818654B2 (ja) * 2005-07-25 2011-11-16 ソニーケミカル＆インフォメーションデバイス株式会社 発光素子の封止方法
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JP2008270518A (ja) * 2007-04-20 2008-11-06 Nec Saitama Ltd ノイズシールドケースおよび電子部品のシールド構造
US9070679B2 (en) * 2009-11-24 2015-06-30 Marvell World Trade Ltd. Semiconductor package with a semiconductor die embedded within substrates
JP5956783B2 (ja) * 2012-03-02 2016-07-27 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
EP3127148A4 (en) * 2014-03-31 2017-11-15 Multerra Bio, Inc. Low-cost packaging for fluidic and device co-integration
DE102014217351A1 (de) * 2014-08-29 2016-03-03 Robert Bosch Gmbh Modulanordnung sowie Getriebesteuermodul
ES2909452T3 (es) * 2014-10-14 2022-05-06 Carel Ind Spa Dispositivo de control para sistemas de refrigeración y acondicionamiento
CN110572975B (zh) * 2018-06-05 2020-12-15 台达电子工业股份有限公司 具有定位内部电路基板功能的电源供应器及其制作方法
DE102019219381A1 (de) * 2019-12-11 2021-06-17 Zf Friedrichshafen Ag Steckeranordnung
JP7574620B2 (ja) * 2020-11-19 2024-10-29 富士電機株式会社 モジュール型半導体装置およびモジュール型半導体装置の製造方法
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104081167A (zh) * 2011-12-14 2014-10-01 恩德斯+豪斯流量技术股份有限公司 用于电子器件壳体的壳体盖或以此形成的电子器件壳体
CN104081167B (zh) * 2011-12-14 2016-12-14 恩德斯+豪斯流量技术股份有限公司 用于电子器件壳体的壳体盖或以此形成的电子器件壳体

Also Published As

Publication number Publication date
US5399805A (en) 1995-03-21
EP0664924A1 (en) 1995-08-02
US5324888A (en) 1994-06-28
PH31026A (en) 1997-12-29
CA2145076A1 (en) 1994-04-28
KR950703795A (ko) 1995-09-20
WO1994009512A1 (en) 1994-04-28
MX9306317A (es) 1994-04-29
EP0664924A4 (en) 1995-08-30
JPH08502389A (ja) 1996-03-12
AU5132693A (en) 1994-05-09

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