JPH06295803A - チップ型サーミスタ及びその製造方法 - Google Patents
チップ型サーミスタ及びその製造方法Info
- Publication number
- JPH06295803A JPH06295803A JP5080471A JP8047193A JPH06295803A JP H06295803 A JPH06295803 A JP H06295803A JP 5080471 A JP5080471 A JP 5080471A JP 8047193 A JP8047193 A JP 8047193A JP H06295803 A JPH06295803 A JP H06295803A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- thermistor
- element body
- inorganic
- thermistor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000007747 plating Methods 0.000 claims abstract description 42
- 239000000843 powder Substances 0.000 claims abstract description 19
- 238000002844 melting Methods 0.000 claims abstract description 17
- 230000008018 melting Effects 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 17
- 229910010272 inorganic material Inorganic materials 0.000 claims description 38
- 239000011147 inorganic material Substances 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 38
- 239000011230 binding agent Substances 0.000 claims description 27
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 22
- 239000011521 glass Substances 0.000 claims description 19
- 238000010304 firing Methods 0.000 claims description 13
- 239000002002 slurry Substances 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 238000002156 mixing Methods 0.000 claims description 7
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 6
- 239000010419 fine particle Substances 0.000 claims description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 238000005240 physical vapour deposition Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 2
- -1 B 2 O 3 Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 description 13
- 239000010408 film Substances 0.000 description 12
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 229910052709 silver Inorganic materials 0.000 description 9
- 238000004544 sputter deposition Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 238000007598 dipping method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910052763 palladium Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- 238000007606 doctor blade method Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- GABQNAFEZZDSCM-RMKNXTFCSA-N Cinnamyl anthranilate Chemical compound NC1=CC=CC=C1C(=O)OC\C=C\C1=CC=CC=C1 GABQNAFEZZDSCM-RMKNXTFCSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004110 Zinc silicate Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000005385 borate glass Substances 0.000 description 2
- 238000001354 calcination Methods 0.000 description 2
- 229910021446 cobalt carbonate Inorganic materials 0.000 description 2
- ZOTKGJBKKKVBJZ-UHFFFAOYSA-L cobalt(2+);carbonate Chemical compound [Co+2].[O-]C([O-])=O ZOTKGJBKKKVBJZ-UHFFFAOYSA-L 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- JQJCSZOEVBFDKO-UHFFFAOYSA-N lead zinc Chemical compound [Zn].[Pb] JQJCSZOEVBFDKO-UHFFFAOYSA-N 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 229940093474 manganese carbonate Drugs 0.000 description 2
- 235000006748 manganese carbonate Nutrition 0.000 description 2
- 239000011656 manganese carbonate Substances 0.000 description 2
- 229910000016 manganese(II) carbonate Inorganic materials 0.000 description 2
- XMWCXZJXESXBBY-UHFFFAOYSA-L manganese(ii) carbonate Chemical compound [Mn+2].[O-]C([O-])=O XMWCXZJXESXBBY-UHFFFAOYSA-L 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910000008 nickel(II) carbonate Inorganic materials 0.000 description 2
- ZULUUIKRFGGGTL-UHFFFAOYSA-L nickel(ii) carbonate Chemical compound [Ni+2].[O-]C([O-])=O ZULUUIKRFGGGTL-UHFFFAOYSA-L 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 235000019352 zinc silicate Nutrition 0.000 description 2
- GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Thermistors And Varistors (AREA)
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5080471A JPH06295803A (ja) | 1993-04-07 | 1993-04-07 | チップ型サーミスタ及びその製造方法 |
| KR1019930010430A KR100204255B1 (ko) | 1992-12-18 | 1993-06-09 | 도전성 칩형 세라믹소자 및 그 제조방법 |
| US08/079,347 US5339068A (en) | 1992-12-18 | 1993-06-18 | Conductive chip-type ceramic element and method of manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5080471A JPH06295803A (ja) | 1993-04-07 | 1993-04-07 | チップ型サーミスタ及びその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06295803A true JPH06295803A (ja) | 1994-10-21 |
Family
ID=13719184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5080471A Withdrawn JPH06295803A (ja) | 1992-12-18 | 1993-04-07 | チップ型サーミスタ及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH06295803A (ko) |
| KR (1) | KR100204255B1 (ko) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997027598A1 (fr) * | 1996-01-24 | 1997-07-31 | Matsushita Electric Industrial Co., Ltd. | Pieces electroniques et leur procede de fabrication |
| US6100110A (en) * | 1996-10-09 | 2000-08-08 | Murata Manufacturing Co., Ltd. | Methods of making thermistor chips |
| JP2004172367A (ja) * | 2002-11-20 | 2004-06-17 | Matsushita Electric Ind Co Ltd | 積層型セラミック電子部品およびその製造方法 |
| JP2010258482A (ja) * | 2001-12-04 | 2010-11-11 | Epcos Ag | 負の温度係数を有する電気デバイス |
| JP2017199797A (ja) * | 2016-04-27 | 2017-11-02 | Tdk株式会社 | 電子部品 |
| JP2019220677A (ja) * | 2018-06-15 | 2019-12-26 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | キャパシタ部品 |
| US10541078B2 (en) | 2016-04-21 | 2020-01-21 | Tdk Corporation | Electronic component |
| WO2020166439A1 (ja) * | 2019-02-15 | 2020-08-20 | 三菱マテリアル株式会社 | サーミスタの製造方法、及び、サーミスタ |
| WO2020170757A1 (ja) * | 2019-02-22 | 2020-08-27 | 三菱マテリアル株式会社 | サーミスタの製造方法 |
| CN112530698A (zh) * | 2019-09-18 | 2021-03-19 | 三星电机株式会社 | 多层电子组件 |
| WO2024018781A1 (ja) * | 2022-07-22 | 2024-01-25 | 太陽誘電株式会社 | 全固体電池およびその製造方法 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100361380B1 (ko) * | 2000-09-29 | 2002-11-22 | 파츠닉(주) | 탄탈 칩 콘덴서의 제작 방법 |
| KR20020026672A (ko) * | 2000-10-02 | 2002-04-12 | 전형구 | 탄탈 칩 콘덴서의 제조 방법 |
| KR20030046668A (ko) * | 2001-12-06 | 2003-06-18 | 주식회사 해광 | 도전성 및 저온 소성의 세라믹스재료 |
| KR101703195B1 (ko) * | 2014-11-27 | 2017-02-17 | 홍익대학교 산학협력단 | 나노 박막층을 구비하는 적층 세라믹 칩 부품 및 이의 제조 방법 |
| KR101825696B1 (ko) * | 2016-07-01 | 2018-02-05 | 주식회사 모다이노칩 | 칩 부품 및 그 제조 방법 |
| KR101981466B1 (ko) | 2016-09-08 | 2019-05-24 | 주식회사 모다이노칩 | 파워 인덕터 |
| KR101939083B1 (ko) * | 2017-03-29 | 2019-01-16 | 삼성전기 주식회사 | 적층형 커패시터 및 그 제조방법 |
| KR102076153B1 (ko) | 2018-05-02 | 2020-02-11 | 삼성전기주식회사 | 적층형 커패시터 |
| KR102068805B1 (ko) * | 2018-09-06 | 2020-01-22 | 삼성전기주식회사 | 세라믹 전자 부품 |
| KR102276514B1 (ko) | 2019-08-28 | 2021-07-14 | 삼성전기주식회사 | 적층형 전자 부품 |
-
1993
- 1993-04-07 JP JP5080471A patent/JPH06295803A/ja not_active Withdrawn
- 1993-06-09 KR KR1019930010430A patent/KR100204255B1/ko not_active IP Right Cessation
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997027598A1 (fr) * | 1996-01-24 | 1997-07-31 | Matsushita Electric Industrial Co., Ltd. | Pieces electroniques et leur procede de fabrication |
| US6171644B1 (en) | 1996-01-24 | 2001-01-09 | Matsushita Electric Industrial Co., Ltd. | Electronic component and method of manufacture therefor |
| KR100281244B1 (ko) * | 1996-01-24 | 2001-02-01 | 모리시타 요이찌 | 전자부품과 그 제조방법 |
| US6400253B1 (en) | 1996-01-24 | 2002-06-04 | Matsushita Electric Industrial Co., Ltd. | Electronic component and method of manufacture therefor |
| US6100110A (en) * | 1996-10-09 | 2000-08-08 | Murata Manufacturing Co., Ltd. | Methods of making thermistor chips |
| KR100271573B1 (ko) * | 1996-10-09 | 2000-11-15 | 무라타 야스타카 | 칩형써미스터및그의제조방법 |
| JP2010258482A (ja) * | 2001-12-04 | 2010-11-11 | Epcos Ag | 負の温度係数を有する電気デバイス |
| JP2004172367A (ja) * | 2002-11-20 | 2004-06-17 | Matsushita Electric Ind Co Ltd | 積層型セラミック電子部品およびその製造方法 |
| US10541078B2 (en) | 2016-04-21 | 2020-01-21 | Tdk Corporation | Electronic component |
| US11482371B2 (en) | 2016-04-21 | 2022-10-25 | Tdk Corporation | Electronic component |
| JP2017199797A (ja) * | 2016-04-27 | 2017-11-02 | Tdk株式会社 | 電子部品 |
| JP2019220677A (ja) * | 2018-06-15 | 2019-12-26 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | キャパシタ部品 |
| CN113424277A (zh) * | 2019-02-15 | 2021-09-21 | 三菱综合材料株式会社 | 热敏电阻的制造方法及热敏电阻 |
| WO2020166439A1 (ja) * | 2019-02-15 | 2020-08-20 | 三菱マテリアル株式会社 | サーミスタの製造方法、及び、サーミスタ |
| JP2020136384A (ja) * | 2019-02-15 | 2020-08-31 | 三菱マテリアル株式会社 | サーミスタの製造方法、及び、サーミスタ |
| WO2020170757A1 (ja) * | 2019-02-22 | 2020-08-27 | 三菱マテリアル株式会社 | サーミスタの製造方法 |
| CN113454736A (zh) * | 2019-02-22 | 2021-09-28 | 三菱综合材料株式会社 | 热敏电阻的制造方法 |
| JP2020136570A (ja) * | 2019-02-22 | 2020-08-31 | 三菱マテリアル株式会社 | サーミスタの製造方法 |
| CN113454736B (zh) * | 2019-02-22 | 2023-02-17 | 三菱综合材料株式会社 | 热敏电阻的制造方法 |
| US11763967B2 (en) | 2019-02-22 | 2023-09-19 | Mitsubishi Materials Corporation | Method of manufacturing thermistor |
| CN112530698A (zh) * | 2019-09-18 | 2021-03-19 | 三星电机株式会社 | 多层电子组件 |
| CN112530698B (zh) * | 2019-09-18 | 2022-11-15 | 三星电机株式会社 | 多层电子组件 |
| WO2024018781A1 (ja) * | 2022-07-22 | 2024-01-25 | 太陽誘電株式会社 | 全固体電池およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR940016309A (ko) | 1994-07-23 |
| KR100204255B1 (ko) | 1999-06-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20000704 |