JPH0454221B2 - - Google Patents
Info
- Publication number
- JPH0454221B2 JPH0454221B2 JP57109102A JP10910282A JPH0454221B2 JP H0454221 B2 JPH0454221 B2 JP H0454221B2 JP 57109102 A JP57109102 A JP 57109102A JP 10910282 A JP10910282 A JP 10910282A JP H0454221 B2 JPH0454221 B2 JP H0454221B2
- Authority
- JP
- Japan
- Prior art keywords
- cresol
- weight
- mixture
- para
- photoresist composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000203 mixture Substances 0.000 claims description 142
- 229920003986 novolac Polymers 0.000 claims description 94
- 229920002120 photoresistant polymer Polymers 0.000 claims description 86
- 229920005989 resin Polymers 0.000 claims description 63
- 239000011347 resin Substances 0.000 claims description 63
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 58
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 claims description 34
- 229930003836 cresol Natural products 0.000 claims description 33
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 31
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 claims description 31
- 150000001896 cresols Chemical class 0.000 claims description 27
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 claims description 21
- 229940100630 metacresol Drugs 0.000 claims description 14
- -1 naphthoquinone diazide sulfonyl ester Chemical class 0.000 claims description 12
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims description 8
- ZRYCRPNCXLQHPN-UHFFFAOYSA-N 3-hydroxy-2-methylbenzaldehyde Chemical compound CC1=C(O)C=CC=C1C=O ZRYCRPNCXLQHPN-UHFFFAOYSA-N 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 2
- 239000007859 condensation product Substances 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 38
- 238000000576 coating method Methods 0.000 description 36
- 238000011161 development Methods 0.000 description 35
- 230000005855 radiation Effects 0.000 description 35
- 239000000243 solution Substances 0.000 description 35
- 239000011248 coating agent Substances 0.000 description 32
- 238000000034 method Methods 0.000 description 19
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 18
- QVEIBLDXZNGPHR-UHFFFAOYSA-N naphthalene-1,4-dione;diazide Chemical compound [N-]=[N+]=[N-].[N-]=[N+]=[N-].C1=CC=C2C(=O)C=CC(=O)C2=C1 QVEIBLDXZNGPHR-UHFFFAOYSA-N 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 14
- 235000012431 wafers Nutrition 0.000 description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 238000010521 absorption reaction Methods 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 10
- 239000011541 reaction mixture Substances 0.000 description 10
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 9
- 239000010408 film Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 239000007864 aqueous solution Substances 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- 238000004090 dissolution Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 238000010992 reflux Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000004821 distillation Methods 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 229920001568 phenolic resin Polymers 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 230000001235 sensitizing effect Effects 0.000 description 5
- 239000011877 solvent mixture Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 4
- 125000000853 cresyl group Chemical group C1(=CC=C(C=C1)C)* 0.000 description 4
- 239000003112 inhibitor Substances 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 3
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 239000012670 alkaline solution Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000004061 bleaching Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 238000001471 micro-filtration Methods 0.000 description 3
- 235000006408 oxalic acid Nutrition 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- HTQNYBBTZSBWKL-UHFFFAOYSA-N 2,3,4-trihydroxbenzophenone Chemical compound OC1=C(O)C(O)=CC=C1C(=O)C1=CC=CC=C1 HTQNYBBTZSBWKL-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 229930192627 Naphthoquinone Natural products 0.000 description 2
- PVNIIMVLHYAWGP-UHFFFAOYSA-N Niacin Chemical compound OC(=O)C1=CC=CN=C1 PVNIIMVLHYAWGP-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 238000013019 agitation Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- FHIVAFMUCKRCQO-UHFFFAOYSA-N diazinon Chemical compound CCOP(=S)(OCC)OC1=CC(C)=NC(C(C)C)=N1 FHIVAFMUCKRCQO-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- MYWUZJCMWCOHBA-VIFPVBQESA-N methamphetamine Chemical compound CN[C@@H](C)CC1=CC=CC=C1 MYWUZJCMWCOHBA-VIFPVBQESA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000004570 mortar (masonry) Substances 0.000 description 2
- 150000002791 naphthoquinones Chemical class 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 229920003987 resole Polymers 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000009987 spinning Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- DSSYKIVIOFKYAU-XCBNKYQSSA-N (R)-camphor Chemical compound C1C[C@@]2(C)C(=O)C[C@@H]1C2(C)C DSSYKIVIOFKYAU-XCBNKYQSSA-N 0.000 description 1
- VEVMYTDOWUQLGI-UHFFFAOYSA-N 2-[(tert-butylamino)methyl]-4-[(7-chloroquinolin-4-yl)amino]-5,6,7,8-tetrahydronaphthalen-1-ol Chemical compound C1CCCC2=C(O)C(CNC(C)(C)C)=CC(NC=3C4=CC=C(Cl)C=C4N=CC=3)=C21 VEVMYTDOWUQLGI-UHFFFAOYSA-N 0.000 description 1
- YVLNDCLPPGIRCP-UHFFFAOYSA-N 2-nitro-3-phenylprop-2-enoic acid Chemical compound OC(=O)C([N+]([O-])=O)=CC1=CC=CC=C1 YVLNDCLPPGIRCP-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- WWKGVZASJYXZKN-UHFFFAOYSA-N Methyl violet 2B Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC(N)=CC=1)=C1C=CC(=[N+](C)C)C=C1 WWKGVZASJYXZKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000011260 aqueous acid Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 239000008098 formaldehyde solution Substances 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- FDZZZRQASAIRJF-UHFFFAOYSA-M malachite green Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC=CC=1)=C1C=CC(=[N+](C)C)C=C1 FDZZZRQASAIRJF-UHFFFAOYSA-M 0.000 description 1
- 229940107698 malachite green Drugs 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- YTCQFLFGFXZUSN-BAQGIRSFSA-N microline Chemical compound OC12OC3(C)COC2(O)C(C(/Cl)=C/C)=CC(=O)C21C3C2 YTCQFLFGFXZUSN-BAQGIRSFSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- SYSQUGFVNFXIIT-UHFFFAOYSA-N n-[4-(1,3-benzoxazol-2-yl)phenyl]-4-nitrobenzenesulfonamide Chemical class C1=CC([N+](=O)[O-])=CC=C1S(=O)(=O)NC1=CC=C(C=2OC3=CC=CC=C3N=2)C=C1 SYSQUGFVNFXIIT-UHFFFAOYSA-N 0.000 description 1
- YPKJPFXVPWGYJL-UHFFFAOYSA-N naphthalene-1,4-dione;sulfuryl dichloride;diazide Chemical compound [N-]=[N+]=[N-].[N-]=[N+]=[N-].ClS(Cl)(=O)=O.C1=CC=C2C(=O)C=CC(=O)C2=C1 YPKJPFXVPWGYJL-UHFFFAOYSA-N 0.000 description 1
- 229940091170 naphthoquine Drugs 0.000 description 1
- PGSADBUBUOPOJS-UHFFFAOYSA-N neutral red Chemical compound Cl.C1=C(C)C(N)=CC2=NC3=CC(N(C)C)=CC=C3N=C21 PGSADBUBUOPOJS-UHFFFAOYSA-N 0.000 description 1
- 229960003512 nicotinic acid Drugs 0.000 description 1
- 235000001968 nicotinic acid Nutrition 0.000 description 1
- 239000011664 nicotinic acid Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000003791 organic solvent mixture Substances 0.000 description 1
- GEVPUGOOGXGPIO-UHFFFAOYSA-N oxalic acid;dihydrate Chemical compound O.O.OC(=O)C(O)=O GEVPUGOOGXGPIO-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- UDGOJXRHZJGCDY-UHFFFAOYSA-N trichloro-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](Cl)(Cl)Cl)CCC2OC21 UDGOJXRHZJGCDY-UHFFFAOYSA-N 0.000 description 1
- 150000005691 triesters Chemical class 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
- LLWJPGAKXJBKKA-UHFFFAOYSA-N victoria blue B Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC(=CC=1)N(C)C)=C(C=C1)C2=CC=CC=C2C1=[NH+]C1=CC=CC=C1 LLWJPGAKXJBKKA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Phenolic Resins Or Amino Resins (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US27570781A | 1981-06-22 | 1981-06-22 | |
| US275883 | 1981-06-22 | ||
| US275707 | 1981-06-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5817112A JPS5817112A (ja) | 1983-02-01 |
| JPH0454221B2 true JPH0454221B2 (da) | 1992-08-28 |
Family
ID=23053465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10910282A Granted JPS5817112A (ja) | 1981-06-22 | 1982-06-22 | ポジ型ノボラツクホトレジスト組成物及びその調製物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5817112A (da) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59165053A (ja) * | 1983-03-11 | 1984-09-18 | Japan Synthetic Rubber Co Ltd | ポジ型感光性樹脂組成物 |
| JPS59163260A (ja) * | 1983-03-02 | 1984-09-14 | Ishikawajima Harima Heavy Ind Co Ltd | 線条体の巻取装置 |
| JPS60159846A (ja) * | 1984-01-31 | 1985-08-21 | Sumitomo Chem Co Ltd | ポジ型フオトレジスト組成物 |
| JPS59162542A (ja) * | 1983-03-04 | 1984-09-13 | Sumitomo Chem Co Ltd | ポジ型フオトレジスト組成物 |
| JPH0658529B2 (ja) * | 1983-08-17 | 1994-08-03 | 三菱化成株式会社 | ポジ型クレゾ−ルノボラツクフオトレジスト組成物 |
| JPS60125841A (ja) * | 1983-12-12 | 1985-07-05 | Mitsubishi Chem Ind Ltd | ポジ型フオトレジスト組成物 |
| JPS60133446A (ja) * | 1983-12-22 | 1985-07-16 | Fuji Photo Film Co Ltd | 感光性組成物 |
| JPH0648381B2 (ja) * | 1984-01-26 | 1994-06-22 | 三菱化成株式会社 | ポジ型フオトレジスト組成物 |
| JPS60189739A (ja) * | 1984-03-09 | 1985-09-27 | Japan Synthetic Rubber Co Ltd | ポジ型感光性樹脂組成物 |
| JPS61118744A (ja) * | 1984-11-15 | 1986-06-06 | Tokyo Ohka Kogyo Co Ltd | ポジ型ホトレジスト組成物 |
| JPS61141441A (ja) * | 1984-12-14 | 1986-06-28 | Tokyo Ohka Kogyo Co Ltd | ポジ型ホトレジスト組成物 |
| JPS61144644A (ja) * | 1984-12-19 | 1986-07-02 | Japan Synthetic Rubber Co Ltd | ポジ型感放射線樹脂組成物 |
| JPH0650395B2 (ja) * | 1985-08-09 | 1994-06-29 | 東京応化工業株式会社 | ポジ型ホトレジスト用組成物 |
| JPH0654384B2 (ja) * | 1985-08-09 | 1994-07-20 | 東京応化工業株式会社 | ポジ型ホトレジスト組成物 |
| JPH0650396B2 (ja) * | 1985-08-09 | 1994-06-29 | 東京応化工業株式会社 | ポジ型ホトレジスト組成物 |
| JPH0690441B2 (ja) * | 1985-12-10 | 1994-11-14 | 三菱化成株式会社 | ポジ型フォトレジスト組成物 |
| JPH0654381B2 (ja) * | 1985-12-24 | 1994-07-20 | 日本合成ゴム株式会社 | 集積回路作製用ポジ型レジスト |
| JPS62161146A (ja) * | 1986-01-10 | 1987-07-17 | Mitsubishi Petrochem Co Ltd | ホトレジスト組成物 |
| JP2626655B2 (ja) * | 1986-01-24 | 1997-07-02 | 住友化学工業株式会社 | ポジ型フォトレジスト用ノボラック樹脂の製造法 |
| JPH0654389B2 (ja) * | 1986-06-23 | 1994-07-20 | 日本合成ゴム株式会社 | ポジ型感放射線性樹脂組成物 |
| JPH0654386B2 (ja) * | 1986-03-28 | 1994-07-20 | 日本合成ゴム株式会社 | ポジ型感放射線性樹脂組成物 |
| JPS62280843A (ja) * | 1986-05-30 | 1987-12-05 | Nec Corp | 感光剤 |
| JPH0820730B2 (ja) * | 1986-10-30 | 1996-03-04 | 日本合成ゴム株式会社 | ポジ型感放射線性樹脂組成物 |
| JP2551943B2 (ja) * | 1987-03-12 | 1996-11-06 | 三菱化学株式会社 | 感光性平版印刷版 |
| JP2625743B2 (ja) * | 1987-07-31 | 1997-07-02 | 三菱化学株式会社 | 感光性平版印刷版 |
| NO891062L (no) * | 1988-03-31 | 1989-10-02 | Thiokol Morton Inc | Positiv fotofoelsom sammensetning. |
| JPH0658530B2 (ja) * | 1988-04-22 | 1994-08-03 | 東京応化工業株式会社 | ポジ型感光性組成物 |
| JP2800186B2 (ja) * | 1988-07-07 | 1998-09-21 | 住友化学工業株式会社 | 集積回路製作用ポジ型レジスト組成物の製造方法 |
| JPH0743534B2 (ja) * | 1989-04-21 | 1995-05-15 | 東京応化工業株式会社 | 半導体デバイス用レジストパターンの製造方法 |
| JPH0656488B2 (ja) * | 1990-05-01 | 1994-07-27 | 日本合成ゴム株式会社 | ポジ型感光性樹脂組成物 |
| JP2626468B2 (ja) * | 1993-04-30 | 1997-07-02 | 日本合成ゴム株式会社 | ポジ型感放射線性樹脂組成物 |
| JP2626467B2 (ja) * | 1993-04-30 | 1997-07-02 | 日本合成ゴム株式会社 | １，２−キノンジアジドスルホン酸エステルの製造方法 |
| DE69431570T2 (de) * | 1994-12-28 | 2003-06-12 | Nippon Zeon Co | Positivarbeitende resistzusammensetzung |
| JP3562673B2 (ja) | 1996-01-22 | 2004-09-08 | 富士写真フイルム株式会社 | ポジ型フォトレジスト組成物 |
| JP2790132B2 (ja) * | 1996-10-18 | 1998-08-27 | 住友化学工業株式会社 | 集積回路製作用ポジ型レジストパターンの形成方法 |
| UA107101C2 (xx) * | 2012-07-04 | 2014-11-25 | Інсектицидна шашка (варіанти) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2616992A1 (de) * | 1976-04-17 | 1977-11-03 | Agfa Gevaert Ag | Lichtempfindliches material zur herstellung von druckformen und aetzresistagen |
-
1982
- 1982-06-22 JP JP10910282A patent/JPS5817112A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2616992A1 (de) * | 1976-04-17 | 1977-11-03 | Agfa Gevaert Ag | Lichtempfindliches material zur herstellung von druckformen und aetzresistagen |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5817112A (ja) | 1983-02-01 |
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