JPH0157519B2 - - Google Patents

Info

Publication number
JPH0157519B2
JPH0157519B2 JP57130543A JP13054382A JPH0157519B2 JP H0157519 B2 JPH0157519 B2 JP H0157519B2 JP 57130543 A JP57130543 A JP 57130543A JP 13054382 A JP13054382 A JP 13054382A JP H0157519 B2 JPH0157519 B2 JP H0157519B2
Authority
JP
Japan
Prior art keywords
tape
feeding
transfer
channel
rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57130543A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5827399A (ja
Inventor
Yohannesu Kutsupensu Berunarudasu
Korunerisu Warudenaaru Hendoriku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of JPS5827399A publication Critical patent/JPS5827399A/ja
Publication of JPH0157519B2 publication Critical patent/JPH0157519B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H10P72/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier
    • Y10T156/1707—Discrete spaced laminae on adhered carrier
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Specific Conveyance Elements (AREA)
JP57130543A 1981-07-29 1982-07-28 素子送給方法及び装置 Granted JPS5827399A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8103573A NL8103573A (nl) 1981-07-29 1981-07-29 Inrichting voor het tegelijkertijd toevoeren van meerdere in banden verpakte electrische en/of electronische onderdelen aan een bepaalde positie.
NL8103573 1981-07-29

Publications (2)

Publication Number Publication Date
JPS5827399A JPS5827399A (ja) 1983-02-18
JPH0157519B2 true JPH0157519B2 (enExample) 1989-12-06

Family

ID=19837865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57130543A Granted JPS5827399A (ja) 1981-07-29 1982-07-28 素子送給方法及び装置

Country Status (8)

Country Link
US (1) US4494902A (enExample)
EP (1) EP0071302B1 (enExample)
JP (1) JPS5827399A (enExample)
KR (1) KR880002050B1 (enExample)
CA (1) CA1194051A (enExample)
DE (1) DE3267682D1 (enExample)
HK (1) HK58686A (enExample)
NL (1) NL8103573A (enExample)

Families Citing this family (76)

* Cited by examiner, † Cited by third party
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JPS59132700U (ja) * 1983-02-25 1984-09-05 シ−ケ−デイ株式会社 チツプ部品の供給装置
JPS59145098U (ja) * 1983-03-17 1984-09-28 日本電気ホームエレクトロニクス株式会社 テ−ピング収納ワ−クの供給装置
NL8303816A (nl) * 1983-11-05 1985-06-03 Philips Nv Inrichting voor het toevoeren van in band verpakte electronische onderdelen naar een opneempositie.
US4770599A (en) * 1984-01-23 1988-09-13 Dynapert Precima Limited Pick-up head for handling electric components
JPS60189297A (ja) * 1984-03-08 1985-09-26 株式会社新川 テ−プからチツプを取り出す方法
US4627787A (en) * 1984-03-22 1986-12-09 Thomson Components-Mostek Corporation Chip selection in automatic assembly of integrated circuit
US4915565A (en) * 1984-03-22 1990-04-10 Sgs-Thomson Microelectronics, Inc. Manipulation and handling of integrated circuit dice
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JPS6140000U (ja) * 1984-08-14 1986-03-13 ティーディーケイ株式会社 チツプ状電子部品の押上げピン
DE3532500C2 (de) * 1984-09-17 1996-03-14 Tdk Corp Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette
JPS61264788A (ja) * 1985-05-20 1986-11-22 ティーディーケイ株式会社 チツプ部品装着機
BR8507030A (pt) * 1984-11-05 1987-01-06 Schlaepfer & Co Ag Aperfeicoamentos em e relativos a producao de decalques
JPS61135197A (ja) * 1984-12-05 1986-06-23 松下電器産業株式会社 電子部品供給装置
JPS62111825A (ja) * 1985-11-06 1987-05-22 Fuji Kikai Seizo Kk キヤリヤテ−プから電子部品を取り出す方法
GB8530561D0 (en) * 1985-12-12 1986-01-22 Schlaepfer & Co Ag Transferring & placing decorative articles
US4735341A (en) * 1986-05-12 1988-04-05 Universal Instruments Corporation Feeder for electrical component supply tapes
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JPH0770858B2 (ja) * 1987-01-19 1995-07-31 三洋電機株式会社 部品供給装置
JPH0787277B2 (ja) * 1987-03-25 1995-09-20 ティーディーケイ株式会社 表面実装部品の基板搭載方法
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US6536427B2 (en) 1990-03-02 2003-03-25 Glaxo Group Limited Inhalation device
HU213221B (en) 1990-03-02 1997-03-28 Glaxo Group Ltd Inhalation device and medicine packet for device
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DE59408870D1 (de) * 1993-04-23 1999-12-09 Roche Diagnostics Gmbh System zur Bevorratung und Zurverfügungstellung von Testelementen
JPH077292A (ja) * 1993-06-18 1995-01-10 Toshiba Corp 部品供給装置
US5449265A (en) * 1994-02-15 1995-09-12 Zierick Manufacturing Corporation Feeder and method of supplying a continuous strip of surface mount contacts to pick-and-place machine
US5605430A (en) * 1994-02-15 1997-02-25 Zierick Manufacturing Corporation Feeder and method of supplying a continuous strip of surface mount contacts to surface mounting equipment
KR0146216B1 (ko) * 1995-04-24 1998-11-02 정문술 반도체 소자검사기의 소자로딩,언로딩장치
JPH09186487A (ja) * 1995-12-28 1997-07-15 Matsushita Electric Ind Co Ltd 部品供給装置
JPH09293995A (ja) * 1996-02-26 1997-11-11 Matsushita Electric Ind Co Ltd 部品吸着方法
JPH10116842A (ja) * 1996-10-14 1998-05-06 Fujitsu Ltd 半導体収容装置及び半導体デバイスの挿入及び取り出し方法
US5800777A (en) * 1996-11-13 1998-09-01 Eastman Kodak Company Method and apparatus for automatic sample preparation and handling
US5782515A (en) * 1996-11-13 1998-07-21 Eastman Kodak Company Rotatable arm mechanism for assembling and disassembling samples
US5837556A (en) * 1997-01-06 1998-11-17 Sundstrand Corporation Method of removing a component from a substrate
US6230393B1 (en) * 1997-07-07 2001-05-15 Matsushita Electric Industrial Co., Ltd. Method and device for mounting electronic component
US6135291A (en) 1998-01-16 2000-10-24 Micron Electronics, Inc. Vertical magazine method for integrated circuit device dispensing, receiving, storing, testing or binning
US6112940A (en) * 1998-01-16 2000-09-05 Micron Electronics, Inc. Vertical magazine apparatus for integrated circuit device dispensing, receiving or storing
JP2002504759A (ja) * 1998-02-17 2002-02-12 データコン・セミコンダクター・イクウィップメント・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング 箔上に配置された電子回路の位置決め装置
WO1999049714A1 (de) * 1998-03-26 1999-09-30 Siemens Aktiengesellschaft Zuführmodul für elektrische bauelemente zu einem bestückautomaten
SG102538A1 (en) * 1998-04-24 2004-03-26 Roche Diagnostics Gmbh Storage container for analytical devices
US5966903A (en) * 1998-05-27 1999-10-19 Lucent Technologies Inc. High speed flip-chip dispensing
US6205745B1 (en) * 1998-05-27 2001-03-27 Lucent Technologies Inc. High speed flip-chip dispensing
JP3504543B2 (ja) * 1999-03-03 2004-03-08 株式会社日立製作所 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法
US6151864A (en) * 1999-04-28 2000-11-28 Semiconductor Technologies & Instruments System and method for transferring components between packing media
TW451372B (en) * 1999-06-17 2001-08-21 Shinkawa Kk Die-holding mechanism, die-packing device and die-bonding device
JP3772954B2 (ja) * 1999-10-15 2006-05-10 株式会社村田製作所 チップ状部品の取扱方法
US7112305B2 (en) * 2001-01-31 2006-09-26 Agilent Technologies, Inc. Automation-optimized microarray package
DE10148038A1 (de) * 2001-09-28 2003-04-17 Grenzebach Maschb Gmbh Einrichtung zur Plattenübergabe von einem Plattenförderer auf ein Stapelgestell oder dergleichen
US6772509B2 (en) * 2002-01-28 2004-08-10 Motorola, Inc. Method of separating and handling a thin semiconductor die on a wafer
JP2003341782A (ja) * 2002-05-27 2003-12-03 Oki Electric Ind Co Ltd 電子デバイス収容体、電子デバイスの搬送方法、電子デバイスの実装方法、電子デバイスの収容方法
AU2003264230A1 (en) * 2002-11-04 2004-06-07 Ismeca Semiconductor Holding Sa Device for extracting electronic components
US20040105750A1 (en) * 2002-11-29 2004-06-03 Esec Trading Sa, A Swiss Corporation Method for picking semiconductor chips from a foil
US6981312B2 (en) * 2003-03-31 2006-01-03 Intel Corporation System for handling microelectronic dies having a non-piercing die ejector
TWI236321B (en) * 2003-04-10 2005-07-11 Protec Co Ltd Tape feeder for chip mounters
US7028396B2 (en) * 2003-04-14 2006-04-18 Texas Instruments Incorporated Semiconductor chip pick and place process and equipment
CN2736833Y (zh) * 2004-09-06 2005-10-26 鸿富锦精密工业（深圳）有限公司 中央处理器拆装治具
US7407359B2 (en) * 2005-05-27 2008-08-05 Danville Automation Holdings Llc Funnel plate
ITFI20050232A1 (it) * 2005-11-14 2007-05-15 Lcm S R L Caricatore multiplo lineare per macchine di posizionamento automatico di componenti elettronici smd
WO2008152701A1 (ja) * 2007-06-13 2008-12-18 Fujitsu Limited キャリアテープから電子部品を取り出す方法
US7895734B2 (en) * 2008-11-07 2011-03-01 Research In Motion Limited Camera module insertion machine with gripper
US8205766B2 (en) * 2009-05-20 2012-06-26 The Bergquist Company Method for packaging thermal interface materials
US8430264B2 (en) * 2009-05-20 2013-04-30 The Bergquist Company Method for packaging thermal interface materials
JP5989471B2 (ja) * 2012-09-14 2016-09-07 日本発條株式会社 圧電素子供給方法
EP3313161B1 (en) * 2015-06-18 2020-02-05 FUJI Corporation Tape cutting processing device and processing method
US10322444B2 (en) * 2017-01-17 2019-06-18 Honda Motor Co., Ltd. Apparatus, system, and method for manipulation of nested stamped parts
KR102284457B1 (ko) * 2019-08-27 2021-07-30 세메스 주식회사 다이 픽업 모듈 및 이를 포함하는 다이 본딩 장치
WO2021038713A1 (ja) * 2019-08-27 2021-03-04 ヤマハ発動機株式会社 部品実装機、テープフィーダ、テープセットユニット
DE102020100614B4 (de) * 2020-01-14 2021-10-07 Asm Assembly Systems Gmbh & Co. Kg Bauteilkassette mit passivem Bauteilausgabeantrieb, Annahmevorrichtung und System aus Bauteilkassette und Annahmevorrichtung

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JPS55163900A (en) * 1979-06-08 1980-12-20 Sanyo Electric Co Electronic part series and method of automatically supplying same
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Also Published As

Publication number Publication date
HK58686A (en) 1986-08-15
JPS5827399A (ja) 1983-02-18
US4494902A (en) 1985-01-22
KR880002050B1 (ko) 1988-10-13
EP0071302A1 (en) 1983-02-09
EP0071302B1 (en) 1985-11-27
KR840001050A (ko) 1984-03-26
NL8103573A (nl) 1983-02-16
DE3267682D1 (en) 1986-01-09
CA1194051A (en) 1985-09-24

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