WO2008152701A1 - キャリアテープから電子部品を取り出す方法 - Google Patents

キャリアテープから電子部品を取り出す方法 Download PDF

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Publication number
WO2008152701A1
WO2008152701A1 PCT/JP2007/061876 JP2007061876W WO2008152701A1 WO 2008152701 A1 WO2008152701 A1 WO 2008152701A1 JP 2007061876 W JP2007061876 W JP 2007061876W WO 2008152701 A1 WO2008152701 A1 WO 2008152701A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
carrier tape
taking out
out electronic
side wall
Prior art date
Application number
PCT/JP2007/061876
Other languages
English (en)
French (fr)
Inventor
Tomokazu Nakashima
Masako Okazaki
Masayuki Itoh
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to JP2009519096A priority Critical patent/JP5136552B2/ja
Priority to PCT/JP2007/061876 priority patent/WO2008152701A1/ja
Publication of WO2008152701A1 publication Critical patent/WO2008152701A1/ja
Priority to US12/654,116 priority patent/US8196278B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49822—Disassembling by applying force
    • Y10T29/49824—Disassembling by applying force to elastically deform work part or connector
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Abstract

　側壁（２２）と底面（２４）によって規定される凹部（２０）に電子部品（１）を収納するキャリアテープ（１０）から前記電子部品（１）を取り出す方法であって、前記側壁（２２）及び前記底面（２４）の前記側壁（２２）に隣接する部分の少なくとも一方に形成された貫通孔（２６、２８）の近傍において前記側壁（２２）を外側に広げて前記凹部（２０）による前記電子部品（１）の拘束力を弱めるステップ（１０１４）を有することを特徴とする方法を提供する。
PCT/JP2007/061876 2007-06-13 2007-06-13 キャリアテープから電子部品を取り出す方法 WO2008152701A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009519096A JP5136552B2 (ja) 2007-06-13 2007-06-13 キャリアテープから電子部品を取り出す方法
PCT/JP2007/061876 WO2008152701A1 (ja) 2007-06-13 2007-06-13 キャリアテープから電子部品を取り出す方法
US12/654,116 US8196278B2 (en) 2007-06-13 2009-12-10 Method for taking an electronic component out of a carrier tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/061876 WO2008152701A1 (ja) 2007-06-13 2007-06-13 キャリアテープから電子部品を取り出す方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/654,116 Continuation US8196278B2 (en) 2007-06-13 2009-12-10 Method for taking an electronic component out of a carrier tape

Publications (1)

Publication Number Publication Date
WO2008152701A1 true WO2008152701A1 (ja) 2008-12-18

Family

ID=40129318

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/061876 WO2008152701A1 (ja) 2007-06-13 2007-06-13 キャリアテープから電子部品を取り出す方法

Country Status (3)

Country Link
US (1) US8196278B2 (ja)
JP (1) JP5136552B2 (ja)
WO (1) WO2008152701A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008152701A1 (ja) * 2007-06-13 2010-08-26 富士通株式会社 キャリアテープから電子部品を取り出す方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3038443B1 (en) * 2013-08-21 2020-10-21 FUJI Corporation Feeder component type determination method and feeder component type determination device
US9969541B2 (en) 2016-05-14 2018-05-15 Qualcomm Incorporated Vented carrier tape
EP3621417B1 (en) * 2018-09-07 2023-01-11 Lumileds LLC Method for applying electronic components

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* Cited by examiner, † Cited by third party
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JPH06211389A (ja) * 1993-01-13 1994-08-02 Nec Kansai Ltd テーピング構体及びその移送方法
US6076681A (en) * 1998-03-02 2000-06-20 Advantek, Inc. Microchip carrier tape
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JP2006120890A (ja) * 2004-10-22 2006-05-11 Matsushita Electric Ind Co Ltd 部品実装装置、部品実装方法、及び部品吸着方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06211389A (ja) * 1993-01-13 1994-08-02 Nec Kansai Ltd テーピング構体及びその移送方法
US6076681A (en) * 1998-03-02 2000-06-20 Advantek, Inc. Microchip carrier tape
JP2000296876A (ja) * 1999-02-10 2000-10-24 Nitto Denko Corp 形状記憶性樹脂製構造体とキャリアテープおよびその使用方法
JP2006120890A (ja) * 2004-10-22 2006-05-11 Matsushita Electric Ind Co Ltd 部品実装装置、部品実装方法、及び部品吸着方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008152701A1 (ja) * 2007-06-13 2010-08-26 富士通株式会社 キャリアテープから電子部品を取り出す方法
JP5136552B2 (ja) * 2007-06-13 2013-02-06 富士通株式会社 キャリアテープから電子部品を取り出す方法

Also Published As

Publication number Publication date
US8196278B2 (en) 2012-06-12
JPWO2008152701A1 (ja) 2010-08-26
US20100132189A1 (en) 2010-06-03
JP5136552B2 (ja) 2013-02-06

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