WO2009054456A1 - プリント配線板の製造方法 - Google Patents

プリント配線板の製造方法 Download PDF

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Publication number
WO2009054456A1
WO2009054456A1 PCT/JP2008/069238 JP2008069238W WO2009054456A1 WO 2009054456 A1 WO2009054456 A1 WO 2009054456A1 JP 2008069238 W JP2008069238 W JP 2008069238W WO 2009054456 A1 WO2009054456 A1 WO 2009054456A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
printed wiring
metal layer
insulating resin
manufacturing printed
Prior art date
Application number
PCT/JP2008/069238
Other languages
English (en)
French (fr)
Inventor
Keita Bamba
Tadahiro Yokozawa
Hideaki Watanabe
Original Assignee
Ube Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries, Ltd. filed Critical Ube Industries, Ltd.
Priority to CN200880120561.8A priority Critical patent/CN101897246B/zh
Priority to US12/739,369 priority patent/US20100230142A1/en
Priority to JP2009538251A priority patent/JPWO2009054456A1/ja
Publication of WO2009054456A1 publication Critical patent/WO2009054456A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1388—Temporary protective conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)

Abstract

　寸法安定性が高いプリント配線板を生産性よく製造する方法が提供される。この製造方法は、内側金属層部分と保護層部分を有する金属層が、絶縁樹脂層の少なくとも片面に前記内側金属層部分が前記絶縁樹脂層側となるように積層された金属積層体を用意する工程と、前記金属層と前記絶縁樹脂層にビアを形成する工程と、ビア形成後、ブラスト処理する工程と、ブラスト処理後、前記保護層部分を除去する工程とを有する。
PCT/JP2008/069238 2007-10-23 2008-10-23 プリント配線板の製造方法 WO2009054456A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880120561.8A CN101897246B (zh) 2007-10-23 2008-10-23 一种制造印刷布线板的方法
US12/739,369 US20100230142A1 (en) 2007-10-23 2008-10-23 Method for manufacturing printed wiring board
JP2009538251A JPWO2009054456A1 (ja) 2007-10-23 2008-10-23 プリント配線板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-275402 2007-10-23
JP2007275402 2007-10-23

Publications (1)

Publication Number Publication Date
WO2009054456A1 true WO2009054456A1 (ja) 2009-04-30

Family

ID=40579558

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069238 WO2009054456A1 (ja) 2007-10-23 2008-10-23 プリント配線板の製造方法

Country Status (6)

Country Link
US (1) US20100230142A1 (ja)
JP (1) JPWO2009054456A1 (ja)
KR (1) KR20100092937A (ja)
CN (1) CN101897246B (ja)
TW (1) TWI455671B (ja)
WO (1) WO2009054456A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010012593A (ja) * 2008-06-05 2010-01-21 Jsr Corp 回路基板の製造に用いる化学機械研磨用水系分散体、回路基板の製造方法、回路基板および多層回路基板
JP2015025106A (ja) * 2013-07-25 2015-02-05 Jx日鉱日石金属株式会社 基材、金属箔または金属板、及び積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
KR20150052051A (ko) * 2012-09-05 2015-05-13 미쓰이금속광업주식회사 프린트 배선판의 제조 방법 및 프린트 배선판
JP2015517213A (ja) * 2012-04-05 2015-06-18 タイコ エレクトロニクス アンプ コリア リミテッド 印刷回路基板及びその製造方法
CN105357884A (zh) * 2015-11-30 2016-02-24 珠海方正科技多层电路板有限公司 一种在pcb板上形成槽的方法及pcb板的制备方法
JP2016213446A (ja) * 2015-05-12 2016-12-15 サムソン エレクトロ−メカニックス カンパニーリミテッド． 銅張積層板及びこれを用いたプリント回路基板の製造方法
JP2017220563A (ja) * 2016-06-08 2017-12-14 エア・ウォーター株式会社 処理方法および積層体の製造方法
JP2018011013A (ja) * 2016-07-15 2018-01-18 群寶科技股▲ふん▼有限公司 セミアディティブ法によりプリント回路基板を作成する方法

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EP2453041B1 (en) * 2010-11-10 2014-02-12 Atotech Deutschland GmbH Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound
JP6322885B2 (ja) * 2012-11-01 2018-05-16 味の素株式会社 プリント配線板の製造方法
JP6234132B2 (ja) * 2013-09-19 2017-11-22 新光電気工業株式会社 配線基板の製造方法
JP5874720B2 (ja) * 2013-12-20 2016-03-02 ウシオ電機株式会社 配線基板材料のデスミア処理方法、配線基板材料の製造方法および複合絶縁層形成材料
KR102421569B1 (ko) * 2015-09-25 2022-07-15 에스케이이노베이션 주식회사 폴리머 필름의 제조방법
KR102421570B1 (ko) * 2015-10-02 2022-07-15 에스케이이노베이션 주식회사 폴리머 필름의 제조방법
CN105517351A (zh) * 2015-11-27 2016-04-20 北大方正集团有限公司 一种在pcb板上形成孔的方法及pcb板的制备方法
EP3276655A1 (en) * 2016-07-26 2018-01-31 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Method and system for bonding a chip to a substrate
JP6880723B2 (ja) * 2016-12-27 2021-06-02 住友金属鉱山株式会社 両面金属積層板、両面金属積層板の製造方法、及びパターンの画像転写方法
KR102521460B1 (ko) * 2017-12-04 2023-04-19 주식회사 넥스플렉스 연성금속박적층체, 이를 포함하는 연성인쇄회로기판 및 폴리이미드 전구체 조성물
CN108718485B (zh) * 2018-06-07 2021-02-02 珠海元盛电子科技股份有限公司 一种制造细线厚铜双面fpc的半加成法技术
KR102571588B1 (ko) * 2018-07-04 2023-08-29 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN109202546A (zh) * 2018-09-29 2019-01-15 信利半导体有限公司 改善柔性基板切割毛刺的方法
CN113130334B (zh) * 2019-12-31 2024-06-18 盛合晶微半导体(江阴)有限公司 提高底部金属与焊垫辨识度的方法
CN111615268A (zh) * 2020-06-01 2020-09-01 珠海市联决电子有限公司 一种新型的柔性电路板局部镀铜方法
KR20220026152A (ko) * 2020-08-25 2022-03-04 현대자동차주식회사 복합 필름 및 이의 제조 방법
CN112105160B (zh) * 2020-09-30 2021-10-01 生益电子股份有限公司 一种混压pcb的除胶方法
CN115190697B (zh) * 2022-07-19 2023-08-08 常州海弘电子有限公司 一种印制电路板通孔与盲孔快速金属化工艺

Citations (4)

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JPH09321432A (ja) * 1996-05-28 1997-12-12 Matsushita Electric Works Ltd 多層プリント配線板の製造方法
JP2003318519A (ja) * 2002-04-24 2003-11-07 Ube Ind Ltd フレキシブル両面基板およびビアめっきの前処理方法
JP2004055618A (ja) * 2002-07-16 2004-02-19 Kanegafuchi Chem Ind Co Ltd 多層プリント配線板の製造方法
JP2007109706A (ja) * 2005-10-11 2007-04-26 Matsushita Electric Ind Co Ltd 多層プリント配線板の製造方法

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JPS62200796A (ja) * 1986-02-27 1987-09-04 イビデン株式会社 極薄銅張積層板の製造方法
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ATE303712T1 (de) * 1998-04-01 2005-09-15 Mitsui Mining & Smelting Co Verfahren zur herstellung einer mehrschichtigen gedruckten leiterplatte
JP2000022337A (ja) * 1998-06-30 2000-01-21 Matsushita Electric Works Ltd 多層配線板及びその製造方法
JP2000269645A (ja) * 1999-03-15 2000-09-29 Matsushita Electric Works Ltd 多層プリント配線板の製造方法
US20040233637A1 (en) * 2003-05-20 2004-11-25 Kuang-Hsiung Chen Slim type packaging structure with high heat dissipation

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09321432A (ja) * 1996-05-28 1997-12-12 Matsushita Electric Works Ltd 多層プリント配線板の製造方法
JP2003318519A (ja) * 2002-04-24 2003-11-07 Ube Ind Ltd フレキシブル両面基板およびビアめっきの前処理方法
JP2004055618A (ja) * 2002-07-16 2004-02-19 Kanegafuchi Chem Ind Co Ltd 多層プリント配線板の製造方法
JP2007109706A (ja) * 2005-10-11 2007-04-26 Matsushita Electric Ind Co Ltd 多層プリント配線板の製造方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010012593A (ja) * 2008-06-05 2010-01-21 Jsr Corp 回路基板の製造に用いる化学機械研磨用水系分散体、回路基板の製造方法、回路基板および多層回路基板
JP2015517213A (ja) * 2012-04-05 2015-06-18 タイコ エレクトロニクス アンプ コリア リミテッド 印刷回路基板及びその製造方法
KR20150052051A (ko) * 2012-09-05 2015-05-13 미쓰이금속광업주식회사 프린트 배선판의 제조 방법 및 프린트 배선판
KR20180108880A (ko) * 2012-09-05 2018-10-04 미쓰이금속광업주식회사 프린트 배선판의 제조 방법 및 프린트 배선판
KR102046738B1 (ko) * 2012-09-05 2019-11-19 미쓰이금속광업주식회사 프린트 배선판의 제조 방법 및 프린트 배선판
KR102090353B1 (ko) * 2012-09-05 2020-03-17 미쓰이금속광업주식회사 프린트 배선판의 제조 방법 및 프린트 배선판
JP2015025106A (ja) * 2013-07-25 2015-02-05 Jx日鉱日石金属株式会社 基材、金属箔または金属板、及び積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP2016213446A (ja) * 2015-05-12 2016-12-15 サムソン エレクトロ−メカニックス カンパニーリミテッド． 銅張積層板及びこれを用いたプリント回路基板の製造方法
US10952329B2 (en) 2015-05-12 2021-03-16 Samsung Electro-Mechanics Co., Ltd. Copper clad laminates and method for manufacturing a printed circuit board using the same
CN105357884A (zh) * 2015-11-30 2016-02-24 珠海方正科技多层电路板有限公司 一种在pcb板上形成槽的方法及pcb板的制备方法
JP2017220563A (ja) * 2016-06-08 2017-12-14 エア・ウォーター株式会社 処理方法および積層体の製造方法
JP2018011013A (ja) * 2016-07-15 2018-01-18 群寶科技股▲ふん▼有限公司 セミアディティブ法によりプリント回路基板を作成する方法

Also Published As

Publication number Publication date
US20100230142A1 (en) 2010-09-16
JPWO2009054456A1 (ja) 2011-03-10
CN101897246B (zh) 2013-02-13
CN101897246A (zh) 2010-11-24
KR20100092937A (ko) 2010-08-23
TWI455671B (zh) 2014-10-01
TW200938037A (en) 2009-09-01

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