ATE303712T1 - Verfahren zur herstellung einer mehrschichtigen gedruckten leiterplatte - Google Patents

Verfahren zur herstellung einer mehrschichtigen gedruckten leiterplatte

Info

Publication number
ATE303712T1
ATE303712T1 AT99106532T AT99106532T ATE303712T1 AT E303712 T1 ATE303712 T1 AT E303712T1 AT 99106532 T AT99106532 T AT 99106532T AT 99106532 T AT99106532 T AT 99106532T AT E303712 T1 ATE303712 T1 AT E303712T1
Authority
AT
Austria
Prior art keywords
copper foil
producing
layer
thickness
circuit board
Prior art date
Application number
AT99106532T
Other languages
English (en)
Inventor
Tsutomu Asai
Fujio Kuwako
Shinichi Obata
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Application granted granted Critical
Publication of ATE303712T1 publication Critical patent/ATE303712T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AT99106532T 1998-04-01 1999-03-30 Verfahren zur herstellung einer mehrschichtigen gedruckten leiterplatte ATE303712T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10421698 1998-04-01

Publications (1)

Publication Number Publication Date
ATE303712T1 true ATE303712T1 (de) 2005-09-15

Family

ID=14374775

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99106532T ATE303712T1 (de) 1998-04-01 1999-03-30 Verfahren zur herstellung einer mehrschichtigen gedruckten leiterplatte

Country Status (9)

Country Link
US (1) US6240636B1 (de)
EP (1) EP0948247B1 (de)
KR (1) KR100610234B1 (de)
CN (1) CN1333623C (de)
AT (1) ATE303712T1 (de)
DE (1) DE69926939T2 (de)
MY (1) MY122378A (de)
SG (1) SG78343A1 (de)
TW (1) TW411745B (de)

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EP1170983B1 (de) * 1999-12-15 2009-11-18 Panasonic Corporation Leiterplatte und herstellungsverfahren der leiterplatte
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TWI347151B (en) * 2004-03-19 2011-08-11 Panasonic Corp Flexible substrate having interlaminar junctions, and process for producing the same
KR100601465B1 (ko) * 2004-10-05 2006-07-18 삼성전기주식회사 인쇄회로기판 및 그 제조방법
US7297285B2 (en) * 2005-08-05 2007-11-20 Roger Chang Manufacturing process of emboss type flexible or rigid printed circuit board
US7892412B2 (en) * 2005-08-05 2011-02-22 Mutual-Tek Industries Co., Ltd. Manufacturing process of embedded type flexible or rigid printed circuit board
US20070210420A1 (en) * 2006-03-11 2007-09-13 Nelson Curt L Laser delamination of thin metal film using sacrificial polymer layer
JP2008166736A (ja) * 2006-12-06 2008-07-17 Hitachi Via Mechanics Ltd プリント基板の製造方法およびプリント基板加工機
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JP5073395B2 (ja) * 2007-07-19 2012-11-14 日本メクトロン株式会社 多層プリント配線板の製造方法
JP5094323B2 (ja) * 2007-10-15 2012-12-12 新光電気工業株式会社 配線基板の製造方法
TWI455671B (zh) * 2007-10-23 2014-10-01 Ube Industries 印刷電路板之製造方法
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TWI392425B (zh) * 2009-08-25 2013-04-01 Unimicron Technology Corp 內埋式線路板及其製造方法
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JP6144003B2 (ja) * 2011-08-29 2017-06-07 富士通株式会社 配線構造及びその製造方法並びに電子装置及びその製造方法
CN104160792B (zh) * 2012-03-09 2017-05-17 三井金属矿业株式会社 印刷布线板的制造方法及激光加工用铜箔
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WO2014091869A1 (ja) * 2012-12-11 2014-06-19 日本特殊陶業株式会社 配線基板およびその製造方法
CN104519670B (zh) * 2014-12-18 2019-11-29 深圳市五株科技股份有限公司 曲面电路板制作工艺
KR102412000B1 (ko) * 2015-05-12 2022-06-22 삼성전기주식회사 동박적층판 및 이를 이용한 인쇄회로기판의 제조방법
CN104923918A (zh) * 2015-06-30 2015-09-23 开平太平洋绝缘材料有限公司 一种半固化片的激光裁边装置
CN107926121B (zh) * 2015-08-11 2021-04-30 昭和电工材料株式会社 多层印刷布线板的制造方法、带粘接层的金属箔、覆金属的层叠板、多层印刷布线板
CN105405770A (zh) * 2015-12-14 2016-03-16 深圳崇达多层线路板有限公司 一种超小尺寸的绑定焊盘的制作方法
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JP6777023B2 (ja) * 2017-06-20 2020-10-28 トヨタ自動車株式会社 積層金属箔の溶接方法
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CN113747669A (zh) * 2021-09-02 2021-12-03 大同共聚(西安)科技有限公司 一种布线板间通孔的制造方法

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Also Published As

Publication number Publication date
DE69926939D1 (de) 2005-10-06
TW411745B (en) 2000-11-11
CN1237873A (zh) 1999-12-08
MY122378A (en) 2006-04-29
EP0948247A1 (de) 1999-10-06
KR100610234B1 (ko) 2006-08-09
EP0948247B1 (de) 2005-08-31
SG78343A1 (en) 2001-02-20
DE69926939T2 (de) 2006-07-13
KR19990082814A (ko) 1999-11-25
US6240636B1 (en) 2001-06-05
CN1333623C (zh) 2007-08-22

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