SE9804150L - Förfarande för tillverkning av flerskiktigt tryckt kretskortt - Google Patents

Förfarande för tillverkning av flerskiktigt tryckt kretskortt

Info

Publication number
SE9804150L
SE9804150L SE9804150A SE9804150A SE9804150L SE 9804150 L SE9804150 L SE 9804150L SE 9804150 A SE9804150 A SE 9804150A SE 9804150 A SE9804150 A SE 9804150A SE 9804150 L SE9804150 L SE 9804150L
Authority
SE
Sweden
Prior art keywords
forming
printed circuit
layer
circuit board
hole
Prior art date
Application number
SE9804150A
Other languages
English (en)
Other versions
SE9804150D0 (sv
Inventor
Keon Yang Park
Byung Kook Sun
Jae Heun Joung
Dong Shin
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=19526261&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SE9804150(L) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of SE9804150D0 publication Critical patent/SE9804150D0/sv
Publication of SE9804150L publication Critical patent/SE9804150L/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
SE9804150A 1997-12-02 1998-12-01 Förfarande för tillverkning av flerskiktigt tryckt kretskortt SE9804150L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR19970065362 1997-12-02

Publications (2)

Publication Number Publication Date
SE9804150D0 SE9804150D0 (sv) 1998-12-01
SE9804150L true SE9804150L (sv) 1999-06-03

Family

ID=19526261

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9804150A SE9804150L (sv) 1997-12-02 1998-12-01 Förfarande för tillverkning av flerskiktigt tryckt kretskortt

Country Status (5)

Country Link
US (1) US6119335A (sv)
JP (1) JP3032753B2 (sv)
KR (1) KR100276270B1 (sv)
FI (1) FI982568A (sv)
SE (1) SE9804150L (sv)

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US6405431B1 (en) * 1996-06-27 2002-06-18 Samsung Electro-Mechanics Co., Ltd. Method for manufacturing build-up multi-layer printed circuit board by using yag laser
JP3629375B2 (ja) * 1998-11-27 2005-03-16 新光電気工業株式会社 多層回路基板の製造方法
US6711813B1 (en) 1999-11-05 2004-03-30 Interuniversitair Microelektronica Centrum Method for fabricating a thin film build-up structure on a sequentially laminated printed circuit board base
US6803528B1 (en) * 1999-11-05 2004-10-12 3M Innovative Properties Company Multi-layer double-sided wiring board and method of fabricating the same
WO2001033925A1 (en) * 1999-11-05 2001-05-10 Interuniversitair Microelektronica Centrum (Imec) Method fabricating a laminated printed circuit board
US6467160B1 (en) * 2000-03-28 2002-10-22 International Business Machines Corporation Fine pitch circuitization with unfilled plated through holes
US20030039106A1 (en) * 2000-04-14 2003-02-27 Tatsunori Koyanagi Double-sided wiring board and its manufacture method
JP4854834B2 (ja) * 2000-04-25 2012-01-18 三菱瓦斯化学株式会社 炭酸ガスレーザーによる銅張板への孔形成方法
JP3261119B2 (ja) * 2000-05-16 2002-02-25 三井金属鉱業株式会社 プリント配線板の製造方法
KR100370314B1 (ko) * 2000-06-02 2003-01-30 주식회사 비아텍 빌드업 다층 인쇄회로판 제조방법
KR20020009794A (ko) * 2000-07-27 2002-02-02 이형도 Ｂｌｉｎｄ ｖｉａ ｈｏｌｅ을 갖는 다층인쇄회로기판의제조방법
KR20020017254A (ko) * 2000-08-29 2002-03-07 이형도 기판의 홀 형성방법
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JP4791648B2 (ja) * 2001-04-26 2011-10-12 日本シイエムケイ株式会社 プリント配線板の非貫通孔加工方法
JP4034046B2 (ja) * 2001-06-07 2008-01-16 日本碍子株式会社 高精度な貫通孔を有する多層板、及び、回路基板
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KR100433828B1 (ko) * 2001-12-28 2004-05-31 삼성전기주식회사 빌드업 방식에 의한 ｐｃｂ 제조용 필름형태의 절연재
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CN103917049A (zh) * 2013-11-22 2014-07-09 大连太平洋电子有限公司 一种采用次外层芯材减铜的激光钻孔板加工方法
CN103997862B (zh) * 2014-06-05 2017-02-15 中国科学院微电子研究所 一种制作低应力低翘曲度超薄奇数层无芯板的方法
US9931714B2 (en) 2015-09-11 2018-04-03 Baker Hughes, A Ge Company, Llc Methods and systems for removing interstitial material from superabrasive materials of cutting elements using energy beams
JP2017123376A (ja) * 2016-01-05 2017-07-13 イビデン株式会社 プリント配線板
US10099422B2 (en) * 2016-09-15 2018-10-16 Io Tech Group Ltd. Method and system for additive-ablative fabrication
CN112118688A (zh) * 2019-06-21 2020-12-22 李家铭 背胶铜箔增层制程
JP2023514253A (ja) * 2020-02-13 2023-04-05 アヴェラテック・コーポレイション 触媒化金属箔およびその用途
US11877404B2 (en) * 2020-02-13 2024-01-16 Averatek Corporation Catalyzed metal foil and uses thereof
DE102020131954A1 (de) * 2020-12-02 2022-06-02 Auto-Kabel Management Gmbh Verfahren zur Folienbeschichtung mittels Laser
CN114449765A (zh) * 2022-01-18 2022-05-06 深圳恒宝士线路板有限公司 一种替代激光制作盲孔的hdi板制作方法
CN116390363B (zh) * 2023-06-02 2023-10-20 淄博芯材集成电路有限责任公司 基于镭射光圈直径及强度调整的hdi印刷电路板开窗方法

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Also Published As

Publication number Publication date
JP3032753B2 (ja) 2000-04-17
FI982568A (sv) 1999-06-03
FI982568A0 (sv) 1998-11-27
KR100276270B1 (ko) 2001-04-02
US6119335A (en) 2000-09-19
JPH11266084A (ja) 1999-09-28
SE9804150D0 (sv) 1998-12-01
KR19990062638A (ko) 1999-07-26

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