SE9804150D0 - Förfarande för tillverkning av tryckt kretskort med flera skikt - Google Patents

Förfarande för tillverkning av tryckt kretskort med flera skikt

Info

Publication number
SE9804150D0
SE9804150D0 SE9804150A SE9804150A SE9804150D0 SE 9804150 D0 SE9804150 D0 SE 9804150D0 SE 9804150 A SE9804150 A SE 9804150A SE 9804150 A SE9804150 A SE 9804150A SE 9804150 D0 SE9804150 D0 SE 9804150D0
Authority
SE
Sweden
Prior art keywords
forming
printed circuit
layer
hole
clad
Prior art date
Application number
SE9804150A
Other languages
English (en)
Other versions
SE9804150L (sv
Inventor
Keon Yang Park
Byung Kook Sun
Jae Heun Joung
Dong Shin
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=19526261&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SE9804150(D0) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of SE9804150D0 publication Critical patent/SE9804150D0/sv
Publication of SE9804150L publication Critical patent/SE9804150L/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
SE9804150A 1997-12-02 1998-12-01 Förfarande för tillverkning av flerskiktigt tryckt kretskortt SE9804150L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR19970065362 1997-12-02

Publications (2)

Publication Number Publication Date
SE9804150D0 true SE9804150D0 (sv) 1998-12-01
SE9804150L SE9804150L (sv) 1999-06-03

Family

ID=19526261

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9804150A SE9804150L (sv) 1997-12-02 1998-12-01 Förfarande för tillverkning av flerskiktigt tryckt kretskortt

Country Status (5)

Country Link
US (1) US6119335A (sv)
JP (1) JP3032753B2 (sv)
KR (1) KR100276270B1 (sv)
FI (1) FI982568A (sv)
SE (1) SE9804150L (sv)

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US6803528B1 (en) * 1999-11-05 2004-10-12 3M Innovative Properties Company Multi-layer double-sided wiring board and method of fabricating the same
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US20030039106A1 (en) * 2000-04-14 2003-02-27 Tatsunori Koyanagi Double-sided wiring board and its manufacture method
JP4854834B2 (ja) * 2000-04-25 2012-01-18 三菱瓦斯化学株式会社 炭酸ガスレーザーによる銅張板への孔形成方法
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CN112118688A (zh) * 2019-06-21 2020-12-22 李家铭 背胶铜箔增层制程
US11877404B2 (en) * 2020-02-13 2024-01-16 Averatek Corporation Catalyzed metal foil and uses thereof
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Also Published As

Publication number Publication date
SE9804150L (sv) 1999-06-03
US6119335A (en) 2000-09-19
JP3032753B2 (ja) 2000-04-17
FI982568A (sv) 1999-06-03
KR100276270B1 (ko) 2001-04-02
JPH11266084A (ja) 1999-09-28
FI982568A0 (sv) 1998-11-27
KR19990062638A (ko) 1999-07-26

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