SE9203327L - Förfarande vid mönsterkortstillverkning samt användning därvid - Google Patents
Förfarande vid mönsterkortstillverkning samt användning därvidInfo
- Publication number
- SE9203327L SE9203327L SE9203327A SE9203327A SE9203327L SE 9203327 L SE9203327 L SE 9203327L SE 9203327 A SE9203327 A SE 9203327A SE 9203327 A SE9203327 A SE 9203327A SE 9203327 L SE9203327 L SE 9203327L
- Authority
- SE
- Sweden
- Prior art keywords
- copper
- foil
- pct
- layers
- lamination
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1536—Temporarily stacked PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- General Factory Administration (AREA)
- Reinforced Plastic Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9203327A SE470277B (sv) | 1992-11-06 | 1992-11-06 | Förfarande vid mönsterkortstillverkning samt användning därvid |
JP6511508A JPH08503174A (ja) | 1992-11-06 | 1993-09-30 | プリント回路基板の製造法およびその使用部材 |
DE69330253T DE69330253D1 (de) | 1992-11-06 | 1993-09-30 | Verfahren und anwendung zur herstellung von leiterplatten |
AT93924845T ATE201549T1 (de) | 1992-11-06 | 1993-09-30 | Verfahren und anwendung zur herstellung von leiterplatten |
US08/424,378 US5617629A (en) | 1992-11-06 | 1993-09-30 | Process for production of printed circuit boards and use thereby |
EP93924845A EP0672334B1 (en) | 1992-11-06 | 1993-09-30 | Process for production of printed circuit boards and use thereby |
PCT/SE1993/000786 WO1994012008A1 (en) | 1992-11-06 | 1993-09-30 | Process for production of printed circuit boards and use thereby |
AU54353/94A AU5435394A (en) | 1992-11-06 | 1993-09-30 | Process for production of printed circuit boards and use thereby |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9203327A SE470277B (sv) | 1992-11-06 | 1992-11-06 | Förfarande vid mönsterkortstillverkning samt användning därvid |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9203327D0 SE9203327D0 (sv) | 1992-11-06 |
SE9203327L true SE9203327L (sv) | 1993-12-20 |
SE470277B SE470277B (sv) | 1993-12-20 |
Family
ID=20387737
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9203327A SE470277B (sv) | 1992-11-06 | 1992-11-06 | Förfarande vid mönsterkortstillverkning samt användning därvid |
Country Status (8)
Country | Link |
---|---|
US (1) | US5617629A (sv) |
EP (1) | EP0672334B1 (sv) |
JP (1) | JPH08503174A (sv) |
AT (1) | ATE201549T1 (sv) |
AU (1) | AU5435394A (sv) |
DE (1) | DE69330253D1 (sv) |
SE (1) | SE470277B (sv) |
WO (1) | WO1994012008A1 (sv) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6085414A (en) * | 1996-08-15 | 2000-07-11 | Packard Hughes Interconnect Company | Method of making a flexible circuit with raised features protruding from two surfaces and products therefrom |
EP0948247B1 (en) * | 1998-04-01 | 2005-08-31 | Mitsui Mining & Smelting Co., Ltd. | Method For Making A Multi-Layer Printed Wiring Board |
JP3612594B2 (ja) * | 1998-05-29 | 2005-01-19 | 三井金属鉱業株式会社 | 樹脂付複合箔およびその製造方法並びに該複合箔を用いた多層銅張り積層板および多層プリント配線板の製造方法 |
US6183880B1 (en) | 1998-08-07 | 2001-02-06 | Mitsui Mining & Smelting Co., Ltd. | Composite foil of aluminum and copper |
WO2000042830A1 (de) * | 1999-01-14 | 2000-07-20 | Schaefer Hans Juergen | Verfahren und vorrichtung zur herstellung von kupferfolie, die beidseitig mit polymeren beschichtet ist und die auf leiterplatten laminiert wird |
US6356002B1 (en) * | 1999-02-08 | 2002-03-12 | Northrop Grumman Corporation | Electrical slip ring having a higher circuit density |
US6569543B2 (en) | 2001-02-15 | 2003-05-27 | Olin Corporation | Copper foil with low profile bond enahncement |
US6379487B1 (en) * | 2000-05-05 | 2002-04-30 | Ga-Tek Inc. | Component of printed circuit board |
US6467138B1 (en) * | 2000-05-24 | 2002-10-22 | Vermon | Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same |
US6454878B1 (en) * | 2000-11-01 | 2002-09-24 | Visteon Global Technologies, Inc. | Cladded material construction for etched-tri-metal circuits |
US6588099B2 (en) * | 2001-01-22 | 2003-07-08 | Sankyo Kasei Kabushiki Kaisha | Process for manufacturing molded circuit board |
US6893742B2 (en) * | 2001-02-15 | 2005-05-17 | Olin Corporation | Copper foil with low profile bond enhancement |
US6984915B2 (en) | 2002-01-22 | 2006-01-10 | Electro-Tec Corp. | Electrical slip ring platter multilayer printed circuit board and method for making same |
US7132158B2 (en) * | 2003-10-22 | 2006-11-07 | Olin Corporation | Support layer for thin copper foil |
JP3972895B2 (ja) * | 2003-12-10 | 2007-09-05 | 松下電器産業株式会社 | 回路基板の製造方法 |
JP4570070B2 (ja) * | 2004-03-16 | 2010-10-27 | 三井金属鉱業株式会社 | 絶縁層形成用の樹脂層を備えたキャリア箔付電解銅箔、銅張積層板、プリント配線板、多層銅張積層板の製造方法及びプリント配線板の製造方法 |
US8861167B2 (en) | 2011-05-12 | 2014-10-14 | Global Plasma Solutions, Llc | Bipolar ionization device |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE788117A (fr) * | 1971-08-30 | 1973-02-28 | Perstorp Ab | Procede de production d'elements pour circuits imprimes |
USRE29820E (en) * | 1971-08-30 | 1978-10-31 | Perstorp, Ab | Method for the production of material for printed circuits |
US3936548A (en) * | 1973-02-28 | 1976-02-03 | Perstorp Ab | Method for the production of material for printed circuits and material for printed circuits |
DE2413932C2 (de) | 1973-04-25 | 1984-08-30 | Yates Industries, Inc., Bordentown, N.J. | Verfahren zum Herstellen einer Verbundfolie für die Ausbildung gedruckter Schaltkreise |
US4073699A (en) * | 1976-03-01 | 1978-02-14 | Hutkin Irving J | Method for making copper foil |
US4088544A (en) * | 1976-04-19 | 1978-05-09 | Hutkin Irving J | Composite and method for making thin copper foil |
US4401521A (en) * | 1980-11-28 | 1983-08-30 | Asahi Kasei Kogyo Kabushiki Kaisha | Method for manufacturing a fine-patterned thick film conductor structure |
US4394419A (en) * | 1981-06-12 | 1983-07-19 | Oak Industries Inc. | Printed circuit material |
US4503112A (en) * | 1981-06-12 | 1985-03-05 | Oak Industries Inc. | Printed circuit material |
US4421608A (en) * | 1982-03-01 | 1983-12-20 | International Business Machines Corporation | Method for stripping peel apart conductive structures |
GB8333753D0 (en) * | 1983-12-19 | 1984-01-25 | Thorpe J E | Dielectric boards |
US5049434A (en) * | 1984-04-30 | 1991-09-17 | National Starch And Chemical Investment Holding Corporation | Pre-patterned device substrate device-attach adhesive transfer system |
JPS63103075A (ja) * | 1986-10-14 | 1988-05-07 | エドワ−ド アドラ− | マイクロ樹枝状体配列を介して結合された金属層で被覆可能とされる表面を有する樹脂製品並びに該金属層被覆樹脂製品 |
-
1992
- 1992-11-06 SE SE9203327A patent/SE470277B/sv not_active IP Right Cessation
-
1993
- 1993-09-30 AT AT93924845T patent/ATE201549T1/de not_active IP Right Cessation
- 1993-09-30 DE DE69330253T patent/DE69330253D1/de not_active Expired - Lifetime
- 1993-09-30 US US08/424,378 patent/US5617629A/en not_active Expired - Fee Related
- 1993-09-30 EP EP93924845A patent/EP0672334B1/en not_active Expired - Lifetime
- 1993-09-30 WO PCT/SE1993/000786 patent/WO1994012008A1/en active IP Right Grant
- 1993-09-30 JP JP6511508A patent/JPH08503174A/ja active Pending
- 1993-09-30 AU AU54353/94A patent/AU5435394A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO1994012008A1 (en) | 1994-05-26 |
SE9203327D0 (sv) | 1992-11-06 |
AU5435394A (en) | 1994-06-08 |
JPH08503174A (ja) | 1996-04-09 |
EP0672334B1 (en) | 2001-05-23 |
SE470277B (sv) | 1993-12-20 |
ATE201549T1 (de) | 2001-06-15 |
US5617629A (en) | 1997-04-08 |
EP0672334A1 (en) | 1995-09-20 |
DE69330253D1 (de) | 2001-06-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAL | Patent in force |
Ref document number: 9203327-3 Format of ref document f/p: F |
|
NUG | Patent has lapsed |