AU2105300A - Method and device for producing copper foil which is coated with polymers on both sides and which is laminated onto printed circuit boards - Google Patents
Method and device for producing copper foil which is coated with polymers on both sides and which is laminated onto printed circuit boardsInfo
- Publication number
- AU2105300A AU2105300A AU21053/00A AU2105300A AU2105300A AU 2105300 A AU2105300 A AU 2105300A AU 21053/00 A AU21053/00 A AU 21053/00A AU 2105300 A AU2105300 A AU 2105300A AU 2105300 A AU2105300 A AU 2105300A
- Authority
- AU
- Australia
- Prior art keywords
- polymers
- coated
- sides
- printed circuit
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19901153 | 1999-01-14 | ||
DE19901153 | 1999-01-14 | ||
DE19931692 | 1999-07-08 | ||
DE19931692A DE19931692A1 (en) | 1999-01-14 | 1999-07-08 | Method and device for producing dielectric-coated copper foil, which is laminated on printed circuit boards |
PCT/EP2000/000022 WO2000042830A1 (en) | 1999-01-14 | 2000-01-04 | Method and device for producing copper foil which is coated with polymers on both sides and which is laminated onto printed circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2105300A true AU2105300A (en) | 2000-08-01 |
Family
ID=26051325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU21053/00A Abandoned AU2105300A (en) | 1999-01-14 | 2000-01-04 | Method and device for producing copper foil which is coated with polymers on both sides and which is laminated onto printed circuit boards |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2105300A (en) |
WO (1) | WO2000042830A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BRPI0811751A2 (en) * | 2007-05-24 | 2014-11-11 | Basf Se | PROCESSES TO MAKE POLYMER COATED METAL SHEETS, AND TO PRODUCE A METAL COATED SUPPORT, AND USING THE POLYMER COATED METAL SHEET |
CN107159515B (en) * | 2017-05-31 | 2019-06-28 | 浙江凯澳新材料有限公司 | A kind of glass-fiber-fabric feeding drying composite integrated machine |
CN117468061B (en) * | 2023-11-02 | 2024-05-31 | 河北海伟电子新材料科技股份有限公司 | Composite copper foil, preparation method and lithium ion battery |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1403976A (en) * | 1971-08-30 | 1975-08-28 | Perstorp Ab | Method for producing printed circuit boards |
BE788117A (en) * | 1971-08-30 | 1973-02-28 | Perstorp Ab | PROCESS FOR THE PRODUCTION OF ELEMENTS FOR PRINTED CIRCUITS |
GB1583544A (en) * | 1977-07-25 | 1981-01-28 | Uop Inc | Metal-clad laminates |
DE3620601A1 (en) * | 1986-06-19 | 1987-12-23 | Akzo Gmbh | METHOD FOR PRODUCING POLYIMIDE METAL LAMINATES |
JPS6446998A (en) * | 1987-08-17 | 1989-02-21 | Reiko Kk | Conductive transfer sheet |
JP2556897B2 (en) * | 1989-02-23 | 1996-11-27 | ファナック株式会社 | Outer layer material for multilayer printed wiring board and manufacturing method |
SE470277B (en) * | 1992-11-06 | 1993-12-20 | Metfoils Ab | Process for the production of printed circuit boards and their use |
DE59407140D1 (en) * | 1993-05-12 | 1998-11-26 | Ciba Geigy Ag | METHOD AND DEVICE FOR COATING PCBS |
US5362534A (en) * | 1993-08-23 | 1994-11-08 | Parlex Corporation | Multiple layer printed circuit boards and method of manufacture |
DE19516193A1 (en) * | 1994-05-13 | 1995-11-16 | Schaefer Hans Juergen | Coating circuit boards |
JP3084352B2 (en) * | 1995-08-28 | 2000-09-04 | 太陽インキ製造株式会社 | Insulating resin composition for copper foil lamination type build-up and method for producing multilayer printed wiring board using the same |
-
2000
- 2000-01-04 AU AU21053/00A patent/AU2105300A/en not_active Abandoned
- 2000-01-04 WO PCT/EP2000/000022 patent/WO2000042830A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2000042830A1 (en) | 2000-07-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1699279B8 (en) | Multilayer printed wiring board and method for producing the same | |
AU2002221097A1 (en) | Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polyimide film, film for tab, and prepreg | |
AU2002355051A1 (en) | Method of laminating circuit board and method of forming insulation layer, multilayer printed wiring board and production method therefor and adhesion film for multilayer printed wiring board | |
HUP0200426A2 (en) | Method for manufacturing a multilayer printed circuit board and composite foil for use therein | |
EP1109430A3 (en) | Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board | |
AU1926900A (en) | Printed circuit boards with integrated passive components and method for making same | |
AU2003211704A1 (en) | Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof | |
HK1023256A1 (en) | Liquid crystal polymer film, laminate, method of making them and multilayered parts mounted circuit board | |
AU5308100A (en) | A method and apparatus for interconnecting multiple devices on a circuit board | |
AU2372697A (en) | High-density mounting method and structure for electronic circuit board | |
AU5856800A (en) | An arrangement for mounting chips in multilayer printed circuit boards | |
AU2002214241A1 (en) | Multi-layer printed circuit board fabrication system and method | |
AU4316700A (en) | Sheet for printed wiring board, method of forming via, resin sheet having filledvia, printed wiring board and method of manufacturing the same | |
AU5484296A (en) | Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture | |
AU2002215173A1 (en) | System and method for fabricating printed circuit boards | |
HK1042325A1 (en) | Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil | |
AU2074001A (en) | Electronics circuit board assembly apparatus and method | |
SG71716A1 (en) | Multilayer printed circuit boards | |
SG74116A1 (en) | Composite copper foil process for preparing the same and copper-clad laminate and printed wiring board using the same | |
AU5612600A (en) | Apparatus and method for cooling a processor circuit board | |
AU4237197A (en) | Pattern plating method for fabricating printed circuit boards | |
GB2361714B (en) | Copper foil for printed circuit boards and its surface treatment method | |
AU2105300A (en) | Method and device for producing copper foil which is coated with polymers on both sides and which is laminated onto printed circuit boards | |
AU2399001A (en) | Multilayer printed wiring board and method of manufacturing the same | |
AU2001290429A1 (en) | An arrangement mounted on a printed circuit board and method of producing such an arrangement |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |