JPS6446998A - Conductive transfer sheet - Google Patents

Conductive transfer sheet

Info

Publication number
JPS6446998A
JPS6446998A JP20485187A JP20485187A JPS6446998A JP S6446998 A JPS6446998 A JP S6446998A JP 20485187 A JP20485187 A JP 20485187A JP 20485187 A JP20485187 A JP 20485187A JP S6446998 A JPS6446998 A JP S6446998A
Authority
JP
Japan
Prior art keywords
vapor
conductive
deposited metal
metal layer
conducting properties
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20485187A
Other languages
Japanese (ja)
Other versions
JPH0435920B2 (en
Inventor
Nobuo Kuwabara
Harumichi Oda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Reiko Co Ltd
Original Assignee
Reiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Reiko Co Ltd filed Critical Reiko Co Ltd
Priority to JP20485187A priority Critical patent/JPS6446998A/en
Publication of JPS6446998A publication Critical patent/JPS6446998A/en
Publication of JPH0435920B2 publication Critical patent/JPH0435920B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Decoration By Transfer Pictures (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To provide a conductive transfer sheet presenting a relatively low surface resistance value after it is transferred, having excellent conducting properties and capable of keeping its conducting properties even in overlapped parts and giving practically effective electromagnetic wave shielding effect to moldings of plastic or the like, by depositing a conductive protecting layer, a vapor-deposited metal layer and a conductive adhesive layer on the surface of a substrate having mold releasing properties. CONSTITUTION:A transfer foil formed on the surface of a substrate 1 having mold releasing properties is composed of three layers: a conductive protecting layer 2, a vapor-deposited metal layer 3 and a conductive adhesive layer 4. Thus, a conductive transfer sheet is provided with the transfer foil produced by forming resin thin films having resonable conducting properties on the top and rear faces of a vapor-deposited metal layer 3 having good conducting properties. When such transfer sheet is transferred to an object material, the surface of the material can be provided with a continuous good-conducting coat film by the vapor-deposited metal layer 3. Further, since the adhesive layer 4 and the protecting layers 2 also have conducting properties, the good-conducting properties given by the vapor-deposited metal layer 3 are kept effective even in the places where the transfer foils overlap each other. Thus, a practical shielding effect to electromagnetic waves can be obtained.
JP20485187A 1987-08-17 1987-08-17 Conductive transfer sheet Granted JPS6446998A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20485187A JPS6446998A (en) 1987-08-17 1987-08-17 Conductive transfer sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20485187A JPS6446998A (en) 1987-08-17 1987-08-17 Conductive transfer sheet

Publications (2)

Publication Number Publication Date
JPS6446998A true JPS6446998A (en) 1989-02-21
JPH0435920B2 JPH0435920B2 (en) 1992-06-12

Family

ID=16497447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20485187A Granted JPS6446998A (en) 1987-08-17 1987-08-17 Conductive transfer sheet

Country Status (1)

Country Link
JP (1) JPS6446998A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000042830A1 (en) * 1999-01-14 2000-07-20 Schaefer Hans Juergen Method and device for producing copper foil which is coated with polymers on both sides and which is laminated onto printed circuit boards
JP2006297714A (en) * 2005-04-19 2006-11-02 Seiren Co Ltd Metal thin film sheet for transfer
JP2006297642A (en) * 2005-04-18 2006-11-02 Asahi Kasei Chemicals Corp Transfer film for in-mold molding and in-mold molded product having electromagnetic wave shielding properties
JP2014221522A (en) * 2013-05-13 2014-11-27 尾池工業株式会社 Transfer film, and method for producing transparent electroconductive laminate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61209199A (en) * 1985-03-12 1986-09-17 尾池工業株式会社 Conductive transfer foil

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61209199A (en) * 1985-03-12 1986-09-17 尾池工業株式会社 Conductive transfer foil

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000042830A1 (en) * 1999-01-14 2000-07-20 Schaefer Hans Juergen Method and device for producing copper foil which is coated with polymers on both sides and which is laminated onto printed circuit boards
JP2006297642A (en) * 2005-04-18 2006-11-02 Asahi Kasei Chemicals Corp Transfer film for in-mold molding and in-mold molded product having electromagnetic wave shielding properties
JP2006297714A (en) * 2005-04-19 2006-11-02 Seiren Co Ltd Metal thin film sheet for transfer
JP2014221522A (en) * 2013-05-13 2014-11-27 尾池工業株式会社 Transfer film, and method for producing transparent electroconductive laminate

Also Published As

Publication number Publication date
JPH0435920B2 (en) 1992-06-12

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Legal Events

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