JPS61209199A - Conductive transfer foil - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field] The present invention provides a method for imparting conductivity to the surface of materials that do not have conductivity on their own, such as plastics, ceramics, and glass, or for printing. This invention relates to conductive transfer foils used to create electrical circuits.

[Prior Art] Conventionally, as a transfer foil whose surface is conductive after transfer, as in the invention described in JP-A No. 47-46108, conventionally, a release layer is attached to the transferred object after transfer. There was a transfer foil that remained attached to the substrate without adhering to the surface of the transfer material, but this foil did not have a film to protect the surface of the object, especially the metal layer, after transfer.
Although it has electrical conductivity, it has extremely low physical and chemical stability such as surface strength, acid resistance, and alkali resistance, so it has poor practicality.・This defect has been improved, and even though there is a release layer on the surface of the transferred object after transfer, there is a metal vapor deposited layer underneath, so that metal is exposed on the surface. Transfer foils have also been proposed whose peelable portions have approximately the same conductivity. However, since the mold release layer uses acrylic resin, cellulose acetate, cellulose butyrate, or other resins with mold release properties, stable conductivity cannot be obtained in practice, making it impossible to put it to practical use. Met.

[Object of the Invention] In view of the above conventional problems, the present invention provides a conductive transfer foil that has stable conductivity and extremely high physical, chemical, and stability properties such as surface strength, acid resistance, and alkali resistance. It is in.

[Constitution of the Invention] In other words, the present invention provides a coating resin layer containing conductive fine particles on a base film directly or via a release agent layer, a metal vapor deposition layer thereon, and, if necessary, a coating resin layer containing conductive fine particles. The present invention relates to a conductive transfer foil characterized by having an adhesive layer provided thereon.

The conductive transfer foil of the present invention is characterized in that a combination of a conductive fine particle-containing coating resin layer containing the above-mentioned specific conductive fine particles and a metal vapor deposition layer is used as a transfer layer.

That is, in the conductive transfer foil of the present invention, physical and chemical properties such as surface strength, acid resistance, and alkali resistance of the metal vapor deposited layer,
The disadvantage of extremely low stability is solved by providing the coating resin layer containing the conductive fine particles, and in addition, another conventionally proposed method is that after transfer, mold release ゛J∆ exists on the surface of the transferred object. Nevertheless, due to the presence of the metal vapor deposited layer underneath, the release layer of the transfer foil has almost the same conductivity as when the metal is exposed on the surface.Acrylic resin, acetic acid i Since fiber, butyric acid 1a fiber, and other resins with mold release properties are used, stable conductivity cannot actually be obtained. By providing a layer, we have completed a conductive transfer foil that has stable conductivity and extremely high physical, chemical, and stability properties such as surface strength, acid resistance, and alkali resistance.

That is, the present invention can be applied directly onto the base film (1) or on the release agent P! (2), a coating resin layer (3) containing conductive particles is provided, a metal vapor deposition layer (4) is provided on top of the coating resin layer (3), and an adhesive layer (5) is further provided thereon as required. The present invention makes it possible to provide a conductive transfer foil characterized by the following.

As the base film (1) in the conductive transfer foil of the present invention, any material can be used as long as it has sufficient self-retention properties, such as polyester, polyamide, polyamideimide, polyethylene, polypropylene, cellulose acetate, polycarbonate, polyester, etc. Resins such as vinyl chloride and fluororesin, film or sheet materials such as cellophane paper and glassine paper, film or sheet materials of stainless steel or other metals, release paper or release films, and the like are used as appropriate.

In particular, the base film (1) is a film-like material of the above-mentioned resins with a thickness of about 9 to 50 μm because it allows continuous mass production of conductive transfer foil without wrinkles or cracks. preferable. In addition, base film (1)
If the releasability from the conductive fine particle-containing coating resin layer (3) is not good, apply paraffin wax, silicone, fluororesin, surfactant, etc. to remove mold release agent N (
2) may be formed in advance.

As the conductive fine particle-containing coating resin layer (3) of the conductive transfer foil of the present invention, any material can be used as long as it has sufficient heat resistance, such as polyethylene, acrylic resin, vinyl chloride-vinyl acetate copolymer, etc. Polymers, nitrocellulose, epoxy resins, polyurethane resins, polysulfonic acid ether resins, polybonate resins, polyarylate resins, polystyrene resins, polyethylene terephthalate resins, polyimide resins and rubbers are used as appropriate. In particular, coating resin Jij containing conductive fine particles
As for (3), it is preferable to use a resin having a thickness of about 1 to 10 μm from the viewpoint of continuous mass production of conductive transfer foil without wrinkles or cracks.
If it is thinner than m, it has sufficiently stable conductivity and surface strength.
It is difficult to obtain a conductive transfer foil with high physical and chemical stability such as acid resistance and alkali resistance, and if it is thicker than 108 m, it becomes difficult to transfer and form delicate electric circuit patterns, which is not preferable.

Examples of the conductive fine particles dispersed in the conductive fine particle-containing coating resin layer (3) in the conductive transfer foil of the present invention include carbon books, conductive tin oxide fine particles,
Conductive fine particles having excellent physical, chemical, and stability properties such as acid resistance and alkali resistance such as gold fine particles can be used. In addition, commercially available conductive paints and conductive adhesives can also be used to form the coating resin layer containing conductive fine particles.

In the conductive transfer foil of the present invention, the content of the conductive fine particles dispersed in the conductive fine particle-containing coating resin N(3) is usually appropriately determined depending on how conductive the surface of the transferred object is ultimately made. Although the selection is determined, it is selected from the range of 20 to 100% (weight %, same hereinafter) of the coating resin. If the content of conductive fine particles dispersed in the coating resin is less than 20%, not only is it not possible to impart sufficient conductivity to the coating resin layer, but also the transfer material transferred using the conductive transfer foil of the present invention is This is undesirable because the surface of the object cannot be made to have stable conductivity. On the other hand, if it exceeds 100%, the film properties of the coating resin layer containing conductive fine particles become weak, and even though it has conductivity,
This is undesirable because surface strength such as friction resistance and crack resistance deteriorates.

The metal vapor deposited layer (4) of the conductive transfer foil of the present invention is applied to the conductive fine particle-containing coating resin layer by a conventional method such as metals such as aluminum, tin, zinc, copper, silver, gold, nickel, chromium, etc. It is formed by vapor-depositing an alloy, and its thickness is usually determined appropriately depending on how conductive the surface of the object to be transferred is ultimately made and the type of metal, but it is usually around 30 nm. The above is necessary.

If the thickness of the metal vapor deposition layer is less than 30 parts m, not only will the metal vapor deposition layer not have stable and sufficient conductivity, but the surface of the transferred object transferred using the conductive transfer foil of the present invention will not be stabilized. It is not preferable because it cannot be made conductive.

Examples of the adhesive N(5) for the conductive transfer foil of the present invention include polyester resin, polyamide resin, polyethylene, acrylic resin, vinyl chloride-vinyl acetate copolymer, nitrocellulose, epoxy resin, polyurethane resin, and polysulfonic acid ether resin. , polycarbonate resin, polyarylate resin, polystyrene resin, polyethylene terephthalate resin, polyimide resin, rubber, and the like can be used alone or in combination. The thickness of the adhesive layer 5) is selected depending on the surface condition of the object to be transferred, etc., but it is usually selected from a range of about 1 to IO μm, and the thickness of the adhesive layer 5) is selected depending on the surface condition of the object to be transferred. In such cases, it is sufficient to provide it either on the surface of the transferred object or on the conductive transfer foil.
When transferring to an object having an uneven surface, such as glass cloth, an adhesive layer may be provided on both the conductive transfer foil and the object.

Next, the present invention will be explained with reference to Examples.

[Example] Example 1 On a 30 μm thick polypropylene film, 100 parts of polyurethane resin (by weight, the same applies hereinafter) and 40 parts of carbon black were mixed with 45 parts of methyl isobutyl ketone, 45 parts of ethyl acetate, and 60 parts of toluene. A coach ink solution dissolved in a solvent is applied and dried to a thickness of 3
Forming a coating resin layer containing μm conductive fine particles,
On top of this, aluminum is deposited to a thickness of 160 parts by vacuum evaporation, and on top of that, 12 parts of vinyl acetate resin and 8 parts of coumaron resin are dissolved in a mixed solvent consisting of 24 parts of toluene and 56 parts of ethyl acetate. A coating solution was applied and dried to form an adhesive layer with a thickness of 2 μm to obtain a conductive transfer foil of the present invention.

Comparative Example 1 In the same manner as in Example 1, 100 parts of polyurethane resin (parts by weight, same hereinafter) and 40 parts of carbon black were placed on a 30 μm thick polypropylene film, and 45 parts of methyl isobutyl ketone, 45 parts of ethyl acetate and 6 parts of toluene were added.
A coating solution made by dissolving in a mixed solvent consisting of 0 parts is applied and dried to form a coating resin layer containing conductive fine particles with a thickness of 3 μm, and on top of this, 12 parts of vinyl acetate resin and 8 parts of Coumaron resin are mixed with 24 parts of toluene. A coating solution prepared by dissolving 56 parts of ethyl acetate in a mixed solvent was coated and dried to form an adhesive layer with a thickness of 2 μm to obtain a conductive transfer foil.

Comparative Example 2 Aluminum was deposited on a polypropylene film with a thickness of 30 μm to a thickness of 160 nm using a vacuum evaporation method, and a mixture of 12 parts of a vinyl acetate resin and 8 parts of a coumaron resin made of 24 parts of toluene and 56 parts of ethyl acetate was added thereto. A coating solution dissolved in a solvent was applied and dried to form an adhesive layer with a thickness of 2 μm to obtain a conductive transfer foil.

[Effect of the invention] Surface resistance and durability of the transfer film on the acrylic resin plate obtained by transferring the conductive transfer foils obtained in Example 1, Comparative Example 1, and Comparative Example 2 onto the acrylic resin plate. When compared in terms of properties, it was found to be more stable than the comparative example and to have extremely high conductivity.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram for explaining the conductive transfer foil of the present invention. (Symbols in drawings) (1): Base film <2>: M-type agent layer (3): Coating resin layer containing conductive fine particles (4):
Metal vapor deposition layer (5): adhesive layer

Claims (1)

[Claims] 1. A conductive transfer characterized by providing a coating resin layer containing conductive fine particles directly or through a release agent layer on a base film, and providing a metal vapor deposition layer thereon. foil. 2. The conductive transfer foil according to claim 1, comprising an adhesive layer provided on the metal vapor deposited layer.