AU2002215173A1 - System and method for fabricating printed circuit boards - Google Patents

System and method for fabricating printed circuit boards

Info

Publication number
AU2002215173A1
AU2002215173A1 AU2002215173A AU1517302A AU2002215173A1 AU 2002215173 A1 AU2002215173 A1 AU 2002215173A1 AU 2002215173 A AU2002215173 A AU 2002215173A AU 1517302 A AU1517302 A AU 1517302A AU 2002215173 A1 AU2002215173 A1 AU 2002215173A1
Authority
AU
Australia
Prior art keywords
printed circuit
circuit boards
fabricating printed
fabricating
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002215173A
Inventor
Dan Alon
Barry Ben-Ezra
Amnon Ganot
Hanan Gino
Abraham Gross
Zeev Kantor
Boris Kling
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Orbotech Ltd
Original Assignee
Orbotech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/708,160 external-priority patent/US6819789B1/en
Application filed by Orbotech Ltd filed Critical Orbotech Ltd
Publication of AU2002215173A1 publication Critical patent/AU2002215173A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37275—Laser, interferometer
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37563—Ccd, tv camera
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45035—Printed circuit boards, also holes to be drilled in a plate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
AU2002215173A 2000-11-08 2001-11-06 System and method for fabricating printed circuit boards Abandoned AU2002215173A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/708,160 2000-11-08
US09/708,160 US6819789B1 (en) 2000-11-08 2000-11-08 Scaling and registration calibration especially in printed circuit board fabrication
US09/792,498 US6701197B2 (en) 2000-11-08 2001-02-23 System and method for side to side registration in a printed circuit imager
US09/792,498 2001-02-23
PCT/IL2001/001028 WO2002039794A2 (en) 2000-11-08 2001-11-06 System and method for fabricating printed circuit boards

Publications (1)

Publication Number Publication Date
AU2002215173A1 true AU2002215173A1 (en) 2002-05-21

Family

ID=27108026

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002215173A Abandoned AU2002215173A1 (en) 2000-11-08 2001-11-06 System and method for fabricating printed circuit boards

Country Status (4)

Country Link
US (1) US6701197B2 (en)
AU (1) AU2002215173A1 (en)
IL (2) IL142354A (en)
WO (1) WO2002039794A2 (en)

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WO2003015482A2 (en) * 2001-08-09 2003-02-20 Orbotech Ltd. A system and method for unveiling targets embedded in a multi-layered electrical circuit
US7508515B2 (en) * 2002-05-02 2009-03-24 Orbotech Ltd System and method for manufacturing printed circuit boards employing non-uniformly modified images
TWI282047B (en) * 2003-07-23 2007-06-01 Murata Machinery Ltd Carrying vehicle system and carrying vehicle
TWI290272B (en) * 2004-03-12 2007-11-21 Murata Machinery Ltd Moving body system
US7389152B2 (en) * 2004-06-04 2008-06-17 Scan-Optics Inc. High speed image scanner
TW200704146A (en) * 2005-02-21 2007-01-16 Fuji Photo Film Co Ltd Plotting method, plotting device, plotting system and correction method
TW200641564A (en) * 2005-02-24 2006-12-01 Fuji Photo Film Co Ltd The correction method of plotting device
TW200912804A (en) * 2007-06-15 2009-03-16 Camtek Ltd Method and system for evaluating local distortions
JP4369504B2 (en) 2007-09-03 2009-11-25 日立ビアメカニクス株式会社 Laser direct drawing apparatus and drawing method
US7847938B2 (en) * 2007-10-01 2010-12-07 Maskless Lithography, Inc. Alignment system for optical lithography
US8482732B2 (en) * 2007-10-01 2013-07-09 Maskless Lithography, Inc. Alignment system for various materials and material flows
IL188825A0 (en) * 2008-01-16 2008-11-03 Orbotech Ltd Inspection of a substrate using multiple cameras
JP5050953B2 (en) * 2008-03-25 2012-10-17 富士通株式会社 Wiring work support device
JP5452889B2 (en) * 2008-06-04 2014-03-26 株式会社オーク製作所 Drawing device
IL194967A0 (en) * 2008-10-28 2009-08-03 Orbotech Ltd Producing electrical circuit patterns using multi-population transformation
EP2491395B1 (en) 2009-10-21 2015-09-16 The Scripps Research Institute Method of using non-rare cells to detect rare cells
US9035673B2 (en) * 2010-01-25 2015-05-19 Palo Alto Research Center Incorporated Method of in-process intralayer yield detection, interlayer shunt detection and correction
KR101948923B1 (en) * 2010-02-26 2019-02-15 마이크로닉 아베 Method and apparatus for performing pattern alignment
JP5813555B2 (en) * 2012-03-30 2015-11-17 株式会社アドテックエンジニアリング Exposure drawing apparatus and exposure drawing method
JP5961429B2 (en) * 2012-03-30 2016-08-02 株式会社アドテックエンジニアリング Exposure drawing apparatus and exposure drawing method
TWI489223B (en) * 2013-07-19 2015-06-21 Au Optronics Corp Patterning method for substrate
US10527624B2 (en) 2014-01-27 2020-01-07 Epic Sciences, Inc. Circulating tumor cell diagnostics for prostate cancer biomarkers
JP6723648B2 (en) * 2016-07-27 2020-07-15 住友重機械工業株式会社 Position detection device and position detection method
JP7045890B2 (en) 2018-03-20 2022-04-01 株式会社Ｓｃｒｅｅｎホールディングス Pattern drawing device and pattern drawing method
CN110341328B (en) * 2019-07-17 2020-11-10 深圳市汉森软件有限公司 Multi-PCB character splicing printing method and device, medium and flat printing equipment

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US4566038A (en) * 1981-10-26 1986-01-21 Excellon Industries Scan line generator
JPS61213612A (en) * 1985-03-19 1986-09-22 Hitachi Ltd Inspecting instrument for pattern of printed board
EP0236738A3 (en) * 1986-02-05 1988-12-21 OMRON Corporation Input method for reference printed circuit board assembly data to an image processing printed circuit board assembly automatic inspection apparatus
US5156772A (en) 1988-05-11 1992-10-20 Ariel Electronics, Inc. Circuit writer materials
JPH0786466B2 (en) * 1990-07-18 1995-09-20 大日本スクリーン製造株式会社 Printed circuit board pattern inspection device
DE69225659T2 (en) 1991-09-24 1998-09-24 Raphael L Levien Alignment marks
US5403684A (en) 1993-08-11 1995-04-04 Cray Research, Inc. PCB tooling apparatus and method for forming patterns in registration on both sides of a substrate
JP3030749B2 (en) 1994-03-31 2000-04-10 セイコープレシジョン株式会社 Drilling method and apparatus for printed circuit board
DE4416882C2 (en) 1994-05-13 1999-03-18 Multiline International Europa Method of aligning a film and a circuit board
US5856844A (en) 1995-09-21 1999-01-05 Omniplanar, Inc. Method and apparatus for determining position and orientation
US5768443A (en) 1995-12-19 1998-06-16 Cognex Corporation Method for coordinating multiple fields of view in multi-camera
JPH09323180A (en) 1996-06-04 1997-12-16 Asahi Optical Co Ltd Laser beam plotting device having scaling correcting function
US6246789B1 (en) 1997-08-29 2001-06-12 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus and method
US6072898A (en) 1998-01-16 2000-06-06 Beaty; Elwin M. Method and apparatus for three dimensional inspection of electronic components
JP2982000B1 (en) 1998-07-03 1999-11-22 株式会社新川 Bonding method and apparatus
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US6205364B1 (en) 1999-02-02 2001-03-20 Creo Ltd. Method and apparatus for registration control during processing of a workpiece particularly during producing images on substrates in preparing printed circuit boards
US6165658A (en) * 1999-07-06 2000-12-26 Creo Ltd. Nonlinear image distortion correction in printed circuit board manufacturing

Also Published As

Publication number Publication date
US20020055789A1 (en) 2002-05-09
WO2002039794A2 (en) 2002-05-16
IL142354A (en) 2008-06-05
WO2002039794A9 (en) 2011-08-11
WO2002039794A3 (en) 2002-08-29
US6701197B2 (en) 2004-03-02
IL142354A0 (en) 2002-03-10
IL155452A0 (en) 2003-11-23

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