AU4237197A - Pattern plating method for fabricating printed circuit boards - Google Patents

Pattern plating method for fabricating printed circuit boards

Info

Publication number
AU4237197A
AU4237197A AU42371/97A AU4237197A AU4237197A AU 4237197 A AU4237197 A AU 4237197A AU 42371/97 A AU42371/97 A AU 42371/97A AU 4237197 A AU4237197 A AU 4237197A AU 4237197 A AU4237197 A AU 4237197A
Authority
AU
Australia
Prior art keywords
printed circuit
circuit boards
plating method
pattern plating
fabricating printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU42371/97A
Inventor
John W. Conway
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conway John W Jr
Original Assignee
Conway John W Jr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conway John W Jr filed Critical Conway John W Jr
Publication of AU4237197A publication Critical patent/AU4237197A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
AU42371/97A 1996-08-27 1997-08-27 Pattern plating method for fabricating printed circuit boards Abandoned AU4237197A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US703849 1985-02-21
US08/703,849 US5733468A (en) 1996-08-27 1996-08-27 Pattern plating method for fabricating printed circuit boards
PCT/US1997/015070 WO1998009485A1 (en) 1996-08-27 1997-08-27 Pattern plating method for fabricating printed circuit boards

Publications (1)

Publication Number Publication Date
AU4237197A true AU4237197A (en) 1998-03-19

Family

ID=24827003

Family Applications (1)

Application Number Title Priority Date Filing Date
AU42371/97A Abandoned AU4237197A (en) 1996-08-27 1997-08-27 Pattern plating method for fabricating printed circuit boards

Country Status (3)

Country Link
US (1) US5733468A (en)
AU (1) AU4237197A (en)
WO (1) WO1998009485A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070086860A (en) * 1998-09-03 2007-08-27 이비덴 가부시키가이샤 Multilayer printed wiring board and method for manufacturing the same
US6461680B2 (en) 1999-12-23 2002-10-08 Nikon Corporation Simplified fabrication method of toroidal charged particle deflector vanes
US6360434B1 (en) 2000-02-23 2002-03-26 Telaxis Communications Corporation Circuit fabrication
DE10042228C2 (en) * 2000-08-28 2002-10-17 Epcos Ag Process for coating a large number of identical base bodies and use of the process
US6685477B1 (en) * 2000-09-28 2004-02-03 Eta/Cuisenaire, A Division Of A. Daigger & Company Method and apparatus for teaching and learning reading
US6458696B1 (en) * 2001-04-11 2002-10-01 Agere Systems Guardian Corp Plated through hole interconnections
JP4683769B2 (en) * 2001-05-31 2011-05-18 三井金属鉱業株式会社 Copper-clad laminate with copper-plated circuit layer and method for producing printed wiring board using copper-clad laminate with copper-plated circuit layer
JP3967239B2 (en) * 2001-09-20 2007-08-29 株式会社フジクラ Method for producing member with filled metal part and member with filled metal part
TWI246379B (en) * 2004-05-12 2005-12-21 Advanced Semiconductor Eng Method for forming printed circuit board
TWI504322B (en) * 2012-03-29 2015-10-11 Taiwan Green Point Entpr Co Double-sided circuit board and method for preparing the same
CN102651946B (en) * 2012-04-05 2014-06-25 深圳崇达多层线路板有限公司 Manufacturing process for step circuit of PCB (Printed Circuit Board)
US20140046473A1 (en) * 2012-08-08 2014-02-13 Makerbot Industries, Llc Automated model customization

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE788117A (en) * 1971-08-30 1973-02-28 Perstorp Ab PROCESS FOR THE PRODUCTION OF ELEMENTS FOR PRINTED CIRCUITS
US5262247A (en) * 1989-05-17 1993-11-16 Fukuda Kinzoku Hakufun Kogyo Kabushiki Kaisha Thin copper foil for printed wiring board
JP2636537B2 (en) * 1991-04-08 1997-07-30 日本電気株式会社 Manufacturing method of printed wiring board
US5246732A (en) * 1991-07-16 1993-09-21 U.S. Philips Corporation Method of providing a copper pattern on a dielectric substrate
US5209817A (en) * 1991-08-22 1993-05-11 International Business Machines Corporation Selective plating method for forming integral via and wiring layers

Also Published As

Publication number Publication date
WO1998009485A1 (en) 1998-03-05
US5733468A (en) 1998-03-31

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