ATE322807T1 - Verfahren zur herstellung der mehrschichtigen leiterplatte - Google Patents

Verfahren zur herstellung der mehrschichtigen leiterplatte

Info

Publication number
ATE322807T1
ATE322807T1 AT99100516T AT99100516T ATE322807T1 AT E322807 T1 ATE322807 T1 AT E322807T1 AT 99100516 T AT99100516 T AT 99100516T AT 99100516 T AT99100516 T AT 99100516T AT E322807 T1 ATE322807 T1 AT E322807T1
Authority
AT
Austria
Prior art keywords
copper foil
alkaline
refractory metal
producing
circuit board
Prior art date
Application number
AT99100516T
Other languages
English (en)
Inventor
Fujio Kuwako
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Application granted granted Critical
Publication of ATE322807T1 publication Critical patent/ATE322807T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0376—Etching temporary metallic carrier substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0384—Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AT99100516T 1998-01-14 1999-01-12 Verfahren zur herstellung der mehrschichtigen leiterplatte ATE322807T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1778498 1998-01-14

Publications (1)

Publication Number Publication Date
ATE322807T1 true ATE322807T1 (de) 2006-04-15

Family

ID=11953353

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99100516T ATE322807T1 (de) 1998-01-14 1999-01-12 Verfahren zur herstellung der mehrschichtigen leiterplatte

Country Status (7)

Country Link
US (1) US6107003A (de)
EP (1) EP0935407B1 (de)
KR (1) KR100535770B1 (de)
CN (1) CN1162060C (de)
AT (1) ATE322807T1 (de)
DE (1) DE69930686T2 (de)
TW (1) TW469228B (de)

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US6631558B2 (en) * 1996-06-05 2003-10-14 Laservia Corporation Blind via laser drilling system
US7062845B2 (en) 1996-06-05 2006-06-20 Laservia Corporation Conveyorized blind microvia laser drilling system
WO1997046349A1 (en) * 1996-06-05 1997-12-11 Burgess Larry W Blind via laser drilling system
EP1843649A3 (de) * 1998-09-03 2007-10-31 Ibiden Co., Ltd. Mehrschichtige Leiterplatte und Verfahren zu deren Herstellung
JP3142259B2 (ja) * 1998-11-30 2001-03-07 三井金属鉱業株式会社 耐薬品性および耐熱性に優れたプリント配線板用銅箔およびその製造方法
CA2364918C (en) * 1999-03-23 2009-04-14 Circuit Foil Luxembourg Trading S.A.R.L. Method for manufacturing a multilayer printed circuit board and composite foil for use therein
JP4486196B2 (ja) * 1999-12-08 2010-06-23 イビデン株式会社 多層プリント配線板用片面回路基板およびその製造方法
JP3628585B2 (ja) * 2000-04-05 2005-03-16 株式会社日鉱マテリアルズ 銅張り積層板及び銅張り積層板のレーザーによる穴開け方法
US6713587B2 (en) 2001-03-08 2004-03-30 Ppg Industries Ohio, Inc. Electrodepositable dielectric coating compositions and methods related thereto
US7000313B2 (en) * 2001-03-08 2006-02-21 Ppg Industries Ohio, Inc. Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions
US6951707B2 (en) * 2001-03-08 2005-10-04 Ppg Industries Ohio, Inc. Process for creating vias for circuit assemblies
US6730857B2 (en) 2001-03-13 2004-05-04 International Business Machines Corporation Structure having laser ablated features and method of fabricating
DE10296376T5 (de) * 2001-04-05 2004-04-15 Mitsubishi Denki K.K. Kohlenstoffdioxidlaser-Bearbeitungsverfahren von Mehrschichtmaterial
US6815709B2 (en) 2001-05-23 2004-11-09 International Business Machines Corporation Structure having flush circuitry features and method of making
US6663786B2 (en) 2001-06-14 2003-12-16 International Business Machines Corporation Structure having embedded flush circuitry features and method of fabricating
US20030155328A1 (en) * 2002-02-15 2003-08-21 Huth Mark C. Laser micromachining and methods and systems of same
US20060213685A1 (en) * 2002-06-27 2006-09-28 Wang Alan E Single or multi-layer printed circuit board with improved edge via design
EP1520454B1 (de) * 2002-06-27 2012-01-25 PPG Industries Ohio, Inc. Ein- oder mehrschichtige leiterplatte mit vorstehenden sollbruch-laschen und verfahren zu deren herstellung
TW200507218A (en) * 2003-03-31 2005-02-16 North Corp Layout circuit substrate, manufacturing method of layout circuit substrate, and circuit module
JP2006179822A (ja) * 2004-12-24 2006-07-06 Cmk Corp プリント配線板とその製造方法
US20080136041A1 (en) * 2006-01-24 2008-06-12 Tessera Interconnect Materials, Inc. Structure and method of making interconnect element having metal traces embedded in surface of dielectric
JP2006229115A (ja) * 2005-02-21 2006-08-31 North:Kk 配線基板製造用金属部材と、それを用いた配線基板の製造方法
KR100722742B1 (ko) * 2005-12-12 2007-05-30 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR100850243B1 (ko) * 2007-07-26 2008-08-04 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN101466199B (zh) * 2007-12-21 2012-01-25 欣兴电子股份有限公司 利用激光形成电路板的盲孔的方法
KR100990576B1 (ko) * 2008-05-26 2010-10-29 삼성전기주식회사 미세 최외층 회로패턴을 갖는 인쇄회로기판 및 그 제조방법
TWI372007B (en) 2008-08-07 2012-09-01 Unimicron Technology Corp Method for fabricating blind via structure of substrate
CN101677066B (zh) * 2008-09-19 2011-10-12 钰桥半导体股份有限公司 增层线路板的制作方法
TWI511876B (zh) * 2009-07-14 2015-12-11 Ajinomoto Kk Production method of copper laminated board and copper clad laminate
JP5580135B2 (ja) * 2010-08-03 2014-08-27 三井金属鉱業株式会社 プリント配線板の製造方法及びプリント配線板
CN102448252B (zh) * 2010-10-13 2014-04-30 宏恒胜电子科技（淮安）有限公司 电路板制作方法
CN102305880A (zh) * 2011-09-08 2012-01-04 高德（无锡）电子有限公司 防止印刷电路板电镀软金电性测试扎伤转接板
CN104160792B (zh) * 2012-03-09 2017-05-17 三井金属矿业株式会社 印刷布线板的制造方法及激光加工用铜箔
KR101299258B1 (ko) * 2012-10-26 2013-08-22 주식회사 에스아이 플렉스 인쇄회로기판의 ｂｖｈ 깊이 최소화공법
KR101335271B1 (ko) * 2013-02-21 2013-11-29 주식회사 에스아이 플렉스 Ｖｉａ ｆｉｌｌ 동도금을 이용한 ｂｖｈ도포 ｐｓｒ 인쇄공법
JP6304829B2 (ja) * 2013-03-05 2018-04-04 三井金属鉱業株式会社 レーザー加工用銅箔、キャリア箔付レーザー加工用銅箔、銅張積層体及びプリント配線板の製造方法
TWI563886B (en) 2015-10-28 2016-12-21 Ind Tech Res Inst Insulating colloidal material and multilayer circuit structure
KR102918497B1 (ko) * 2020-08-15 2026-01-26 엠지씨 에레쿠토로테쿠노 가부시키가이샤 프린트 배선판의 제조방법

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US5021120A (en) * 1989-04-28 1991-06-04 Buck Roy V Process for etching patterned substrates
JP3026580B2 (ja) * 1990-04-20 2000-03-27 旭光学工業株式会社 データ信号復調装置
US5403672A (en) * 1992-08-17 1995-04-04 Hitachi Chemical Co., Ltd. Metal foil for printed wiring board and production thereof
US5578696A (en) * 1993-04-07 1996-11-26 Nitto Denko Corporation Heat resistant adhesive film, an adhesion structure, and method of adhesion
DE69601784T2 (de) * 1995-11-24 1999-10-07 Koninklijke Philips Electronics N.V., Eindhoven Verfahren zur selektiven entfernung einer metallischen schicht von einem nichtmetallischen substrat
AU2993997A (en) * 1996-05-01 1997-11-19 Allied-Signal Inc. New method of forming fine circuit lines

Also Published As

Publication number Publication date
EP0935407A1 (de) 1999-08-11
US6107003A (en) 2000-08-22
CN1226802A (zh) 1999-08-25
EP0935407B1 (de) 2006-04-05
KR19990067862A (ko) 1999-08-25
CN1162060C (zh) 2004-08-11
TW469228B (en) 2001-12-21
DE69930686D1 (de) 2006-05-18
KR100535770B1 (ko) 2005-12-12
DE69930686T2 (de) 2006-12-07

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