DE3267682D1 - Method of and device for feeding electric and/or electronic elements to given positions - Google Patents

Method of and device for feeding electric and/or electronic elements to given positions

Info

Publication number
DE3267682D1
DE3267682D1 DE8282200920T DE3267682T DE3267682D1 DE 3267682 D1 DE3267682 D1 DE 3267682D1 DE 8282200920 T DE8282200920 T DE 8282200920T DE 3267682 T DE3267682 T DE 3267682T DE 3267682 D1 DE3267682 D1 DE 3267682D1
Authority
DE
Germany
Prior art keywords
electronic elements
feeding electric
given positions
positions
given
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282200920T
Other languages
English (en)
Inventor
Bernardus Johannes Kuppens
Hendrik Cornelis Wardenaar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of DE3267682D1 publication Critical patent/DE3267682D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier
    • Y10T156/1707—Discrete spaced laminae on adhered carrier
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Specific Conveyance Elements (AREA)
DE8282200920T 1981-07-29 1982-07-20 Method of and device for feeding electric and/or electronic elements to given positions Expired DE3267682D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8103573A NL8103573A (nl) 1981-07-29 1981-07-29 Inrichting voor het tegelijkertijd toevoeren van meerdere in banden verpakte electrische en/of electronische onderdelen aan een bepaalde positie.

Publications (1)

Publication Number Publication Date
DE3267682D1 true DE3267682D1 (en) 1986-01-09

Family

ID=19837865

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282200920T Expired DE3267682D1 (en) 1981-07-29 1982-07-20 Method of and device for feeding electric and/or electronic elements to given positions

Country Status (8)

Country Link
US (1) US4494902A (de)
EP (1) EP0071302B1 (de)
JP (1) JPS5827399A (de)
KR (1) KR880002050B1 (de)
CA (1) CA1194051A (de)
DE (1) DE3267682D1 (de)
HK (1) HK58686A (de)
NL (1) NL8103573A (de)

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NL8303816A (nl) * 1983-11-05 1985-06-03 Philips Nv Inrichting voor het toevoeren van in band verpakte electronische onderdelen naar een opneempositie.
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DE3532500C2 (de) * 1984-09-17 1996-03-14 Tdk Corp Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette
DE3573911D1 (en) * 1984-11-05 1989-11-30 Schlaepfer & Co Ag Improvements in and relating to the production of transfers
JPS61135197A (ja) * 1984-12-05 1986-06-23 松下電器産業株式会社 電子部品供給装置
JPS62111825A (ja) * 1985-11-06 1987-05-22 Fuji Kikai Seizo Kk キヤリヤテ−プから電子部品を取り出す方法
GB8530561D0 (en) * 1985-12-12 1986-01-22 Schlaepfer & Co Ag Transferring & placing decorative articles
US4735341A (en) * 1986-05-12 1988-04-05 Universal Instruments Corporation Feeder for electrical component supply tapes
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JPH0770858B2 (ja) * 1987-01-19 1995-07-31 三洋電機株式会社 部品供給装置
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US5605430A (en) * 1994-02-15 1997-02-25 Zierick Manufacturing Corporation Feeder and method of supplying a continuous strip of surface mount contacts to surface mounting equipment
US5449265A (en) * 1994-02-15 1995-09-12 Zierick Manufacturing Corporation Feeder and method of supplying a continuous strip of surface mount contacts to pick-and-place machine
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JPH09186487A (ja) * 1995-12-28 1997-07-15 Matsushita Electric Ind Co Ltd 部品供給装置
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US5800777A (en) * 1996-11-13 1998-09-01 Eastman Kodak Company Method and apparatus for automatic sample preparation and handling
US5782515A (en) * 1996-11-13 1998-07-21 Eastman Kodak Company Rotatable arm mechanism for assembling and disassembling samples
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US6230393B1 (en) * 1997-07-07 2001-05-15 Matsushita Electric Industrial Co., Ltd. Method and device for mounting electronic component
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US6135291A (en) * 1998-01-16 2000-10-24 Micron Electronics, Inc. Vertical magazine method for integrated circuit device dispensing, receiving, storing, testing or binning
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KR20010042186A (ko) * 1998-03-26 2001-05-25 칼 하인쯔 호르닝어 자동 부품 장착 기계에 전기 부품들을 공급하는 공급 모듈
CZ296644B6 (cs) * 1998-04-24 2006-05-17 Roche Diagnostics Gmbh Úlozná schránka pro vyuzití v kompaktním mericím prístroji a zarízení pro ulození analytických prípravku
US6205745B1 (en) * 1998-05-27 2001-03-27 Lucent Technologies Inc. High speed flip-chip dispensing
US5966903A (en) * 1998-05-27 1999-10-19 Lucent Technologies Inc. High speed flip-chip dispensing
JP3504543B2 (ja) * 1999-03-03 2004-03-08 株式会社日立製作所 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法
US6151864A (en) * 1999-04-28 2000-11-28 Semiconductor Technologies & Instruments System and method for transferring components between packing media
TW451372B (en) * 1999-06-17 2001-08-21 Shinkawa Kk Die-holding mechanism, die-packing device and die-bonding device
JP3772954B2 (ja) * 1999-10-15 2006-05-10 株式会社村田製作所 チップ状部品の取扱方法
US7112305B2 (en) * 2001-01-31 2006-09-26 Agilent Technologies, Inc. Automation-optimized microarray package
DE10148038A1 (de) * 2001-09-28 2003-04-17 Grenzebach Maschb Gmbh Einrichtung zur Plattenübergabe von einem Plattenförderer auf ein Stapelgestell oder dergleichen
US6772509B2 (en) * 2002-01-28 2004-08-10 Motorola, Inc. Method of separating and handling a thin semiconductor die on a wafer
JP2003341782A (ja) * 2002-05-27 2003-12-03 Oki Electric Ind Co Ltd 電子デバイス収容体、電子デバイスの搬送方法、電子デバイスの実装方法、電子デバイスの収容方法
WO2004043125A1 (fr) * 2002-11-04 2004-05-21 Ismeca Semiconductor Holding Sa Dispositif pour l'extraction de composants electroniques
US20040105750A1 (en) * 2002-11-29 2004-06-03 Esec Trading Sa, A Swiss Corporation Method for picking semiconductor chips from a foil
US6981312B2 (en) * 2003-03-31 2006-01-03 Intel Corporation System for handling microelectronic dies having a non-piercing die ejector
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US7028396B2 (en) * 2003-04-14 2006-04-18 Texas Instruments Incorporated Semiconductor chip pick and place process and equipment
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ITFI20050232A1 (it) * 2005-11-14 2007-05-15 Lcm S R L Caricatore multiplo lineare per macchine di posizionamento automatico di componenti elettronici smd
JP5136552B2 (ja) * 2007-06-13 2013-02-06 富士通株式会社 キャリアテープから電子部品を取り出す方法
US7895734B2 (en) * 2008-11-07 2011-03-01 Research In Motion Limited Camera module insertion machine with gripper
US8205766B2 (en) * 2009-05-20 2012-06-26 The Bergquist Company Method for packaging thermal interface materials
US8430264B2 (en) * 2009-05-20 2013-04-30 The Bergquist Company Method for packaging thermal interface materials
JP5989471B2 (ja) 2012-09-14 2016-09-07 日本発條株式会社 圧電素子供給方法
US10772247B2 (en) * 2015-06-18 2020-09-08 Fuji Corporation Tape cutting processing apparatus and processing method
US10322444B2 (en) * 2017-01-17 2019-06-18 Honda Motor Co., Ltd. Apparatus, system, and method for manipulation of nested stamped parts
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Also Published As

Publication number Publication date
NL8103573A (nl) 1983-02-16
CA1194051A (en) 1985-09-24
US4494902A (en) 1985-01-22
HK58686A (en) 1986-08-15
JPH0157519B2 (de) 1989-12-06
KR840001050A (ko) 1984-03-26
JPS5827399A (ja) 1983-02-18
EP0071302B1 (de) 1985-11-27
EP0071302A1 (de) 1983-02-09
KR880002050B1 (ko) 1988-10-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PHILIPS ELECTRONICS N.V., EINDHOVEN, NL

8339 Ceased/non-payment of the annual fee