HK58686A - Method of and device for feeding electric and/or electronic elements to given positions - Google Patents

Method of and device for feeding electric and/or electronic elements to given positions

Info

Publication number
HK58686A
HK58686A HK586/86A HK58686A HK58686A HK 58686 A HK58686 A HK 58686A HK 586/86 A HK586/86 A HK 586/86A HK 58686 A HK58686 A HK 58686A HK 58686 A HK58686 A HK 58686A
Authority
HK
Hong Kong
Prior art keywords
electronic elements
feeding electric
given positions
positions
given
Prior art date
Application number
HK586/86A
Other languages
English (en)
Inventor
Bernardus Johannes Kuppens
Hendrik Cornelis Wardenaar
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of HK58686A publication Critical patent/HK58686A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier
    • Y10T156/1707—Discrete spaced laminae on adhered carrier
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Specific Conveyance Elements (AREA)
HK586/86A 1981-07-29 1986-08-07 Method of and device for feeding electric and/or electronic elements to given positions HK58686A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8103573A NL8103573A (nl) 1981-07-29 1981-07-29 Inrichting voor het tegelijkertijd toevoeren van meerdere in banden verpakte electrische en/of electronische onderdelen aan een bepaalde positie.

Publications (1)

Publication Number Publication Date
HK58686A true HK58686A (en) 1986-08-15

Family

ID=19837865

Family Applications (1)

Application Number Title Priority Date Filing Date
HK586/86A HK58686A (en) 1981-07-29 1986-08-07 Method of and device for feeding electric and/or electronic elements to given positions

Country Status (8)

Country Link
US (1) US4494902A (xx)
EP (1) EP0071302B1 (xx)
JP (1) JPS5827399A (xx)
KR (1) KR880002050B1 (xx)
CA (1) CA1194051A (xx)
DE (1) DE3267682D1 (xx)
HK (1) HK58686A (xx)
NL (1) NL8103573A (xx)

Families Citing this family (76)

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CZ296644B6 (cs) * 1998-04-24 2006-05-17 Roche Diagnostics Gmbh Úlozná schránka pro vyuzití v kompaktním mericím prístroji a zarízení pro ulození analytických prípravku
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JP3772954B2 (ja) * 1999-10-15 2006-05-10 株式会社村田製作所 チップ状部品の取扱方法
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US6772509B2 (en) * 2002-01-28 2004-08-10 Motorola, Inc. Method of separating and handling a thin semiconductor die on a wafer
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WO2004043125A1 (fr) * 2002-11-04 2004-05-21 Ismeca Semiconductor Holding Sa Dispositif pour l'extraction de composants electroniques
US20040105750A1 (en) * 2002-11-29 2004-06-03 Esec Trading Sa, A Swiss Corporation Method for picking semiconductor chips from a foil
US6981312B2 (en) * 2003-03-31 2006-01-03 Intel Corporation System for handling microelectronic dies having a non-piercing die ejector
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US7028396B2 (en) * 2003-04-14 2006-04-18 Texas Instruments Incorporated Semiconductor chip pick and place process and equipment
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JP5136552B2 (ja) * 2007-06-13 2013-02-06 富士通株式会社 キャリアテープから電子部品を取り出す方法
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JP5989471B2 (ja) 2012-09-14 2016-09-07 日本発條株式会社 圧電素子供給方法
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Also Published As

Publication number Publication date
NL8103573A (nl) 1983-02-16
CA1194051A (en) 1985-09-24
DE3267682D1 (en) 1986-01-09
US4494902A (en) 1985-01-22
JPH0157519B2 (xx) 1989-12-06
KR840001050A (ko) 1984-03-26
JPS5827399A (ja) 1983-02-18
EP0071302B1 (en) 1985-11-27
EP0071302A1 (en) 1983-02-09
KR880002050B1 (ko) 1988-10-13

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)