JPH01160028A - 電極の接続方法 - Google Patents

電極の接続方法

Info

Publication number
JPH01160028A
JPH01160028A JP62319443A JP31944387A JPH01160028A JP H01160028 A JPH01160028 A JP H01160028A JP 62319443 A JP62319443 A JP 62319443A JP 31944387 A JP31944387 A JP 31944387A JP H01160028 A JPH01160028 A JP H01160028A
Authority
JP
Japan
Prior art keywords
semiconductor element
resin
insulating resin
electrode
circuit substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62319443A
Other languages
English (en)
Japanese (ja)
Inventor
Kenzo Hatada
畑田　賢造
Hiroaki Fujimoto
博昭 藤本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62319443A priority Critical patent/JPH01160028A/ja
Priority to EP88311868A priority patent/EP0321238B1/de
Priority to DE3888129T priority patent/DE3888129T2/de
Priority to KR1019880016785A priority patent/KR920010425B1/ko
Publication of JPH01160028A publication Critical patent/JPH01160028A/ja
Priority to US07/525,223 priority patent/US5012969A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
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    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83102—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus using surface energy, e.g. capillary forces
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
JP62319443A 1987-12-17 1987-12-17 電極の接続方法 Pending JPH01160028A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP62319443A JPH01160028A (ja) 1987-12-17 1987-12-17 電極の接続方法
EP88311868A EP0321238B1 (de) 1987-12-17 1988-12-15 Verfahren zum Verbinden einer Elektrode
DE3888129T DE3888129T2 (de) 1987-12-17 1988-12-15 Verfahren zum Verbinden einer Elektrode.
KR1019880016785A KR920010425B1 (ko) 1987-12-17 1988-12-16 전극의 접속방법
US07/525,223 US5012969A (en) 1987-12-17 1990-05-17 Method of connecting electrodes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62319443A JPH01160028A (ja) 1987-12-17 1987-12-17 電極の接続方法

Publications (1)

Publication Number Publication Date
JPH01160028A true JPH01160028A (ja) 1989-06-22

Family

ID=18110256

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62319443A Pending JPH01160028A (ja) 1987-12-17 1987-12-17 電極の接続方法

Country Status (5)

Country Link
US (1) US5012969A (de)
EP (1) EP0321238B1 (de)
JP (1) JPH01160028A (de)
KR (1) KR920010425B1 (de)
DE (1) DE3888129T2 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03120736A (ja) * 1989-10-03 1991-05-22 Matsushita Electric Ind Co Ltd 半導体装置
JPH03116033U (de) * 1990-03-13 1991-12-02
US5115545A (en) * 1989-03-28 1992-05-26 Matsushita Electric Industrial Co., Ltd. Apparatus for connecting semiconductor devices to wiring boards

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774328B2 (ja) * 1989-09-05 1995-08-09 千住金属工業株式会社 電子部品の仮固定用粘着剤
JP2547895B2 (ja) * 1990-03-20 1996-10-23 シャープ株式会社 半導体装置の実装方法
DE69102919T2 (de) * 1990-03-20 1994-12-15 Sharp Kk Verfahren zur Montage von einer Halbleiteranordnung.
ZA915965B (en) * 1990-07-30 1992-04-29 South Africa Ind Dev Corp Attaching integrated circuits to circuit boards
DE69128014T2 (de) * 1990-08-31 1998-05-20 Nec Corp Herstellungsverfahren für integrierte Schaltungschip Packung
US5169056A (en) * 1992-02-21 1992-12-08 Eastman Kodak Company Connecting of semiconductor chips to circuit substrates
US5163605A (en) * 1992-04-30 1992-11-17 Allied-Signal Inc. Method for mounting components to a circuit board
JP2562661Y2 (ja) * 1992-10-13 1998-02-16 株式会社村田製作所 圧電素子の実装構造
US5739053A (en) * 1992-10-27 1998-04-14 Matsushita Electric Industrial Co., Ltd. Process for bonding a semiconductor to a circuit substrate including a solder bump transferring step
JP3030201B2 (ja) * 1994-04-26 2000-04-10 富士通株式会社 半導体装置の製造方法及び半導体装置の製造装置
DE19529490A1 (de) * 1995-08-10 1997-02-13 Fraunhofer Ges Forschung Chipkontaktierungsverfahren, damit hergestellte elektronische Schaltung und Trägersubstrat zur Kontaktierung von Chips
JP3801674B2 (ja) * 1995-12-15 2006-07-26 松下電器産業株式会社 電子部品の実装方法
US20030009876A1 (en) * 2000-01-14 2003-01-16 Akira Yamauchi Method and device for chip mounting
GB0021750D0 (en) * 2000-09-04 2000-10-18 Cambridge Consultants Connection method
US9269878B2 (en) 2011-05-27 2016-02-23 Lg Innotek Co., Ltd. Light emitting device and light emitting apparatus
KR101969334B1 (ko) 2011-11-16 2019-04-17 엘지이노텍 주식회사 발광 소자 및 이를 구비한 발광 장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62281360A (ja) * 1986-05-29 1987-12-07 Matsushita Electric Ind Co Ltd 半導体装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56140637A (en) * 1980-04-04 1981-11-04 Nec Corp Semiconductor device
US4441248A (en) * 1982-12-02 1984-04-10 Stanley Electric Company, Ltd. On-line inspection method and system for bonds made to electronic components
JPS60262430A (ja) * 1984-06-08 1985-12-25 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
US4604644A (en) * 1985-01-28 1986-08-05 International Business Machines Corporation Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making
US4749120A (en) * 1986-12-18 1988-06-07 Matsushita Electric Industrial Co., Ltd. Method of connecting a semiconductor device to a wiring board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62281360A (ja) * 1986-05-29 1987-12-07 Matsushita Electric Ind Co Ltd 半導体装置の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5115545A (en) * 1989-03-28 1992-05-26 Matsushita Electric Industrial Co., Ltd. Apparatus for connecting semiconductor devices to wiring boards
JPH03120736A (ja) * 1989-10-03 1991-05-22 Matsushita Electric Ind Co Ltd 半導体装置
JPH03116033U (de) * 1990-03-13 1991-12-02

Also Published As

Publication number Publication date
DE3888129T2 (de) 1994-07-07
DE3888129D1 (de) 1994-04-07
KR920010425B1 (ko) 1992-11-27
US5012969A (en) 1991-05-07
EP0321238A3 (en) 1990-04-25
EP0321238B1 (de) 1994-03-02
EP0321238A2 (de) 1989-06-21
KR890011039A (ko) 1989-08-12

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