JPH0121620B2 - - Google Patents
Info
- Publication number
- JPH0121620B2 JPH0121620B2 JP58028245A JP2824583A JPH0121620B2 JP H0121620 B2 JPH0121620 B2 JP H0121620B2 JP 58028245 A JP58028245 A JP 58028245A JP 2824583 A JP2824583 A JP 2824583A JP H0121620 B2 JPH0121620 B2 JP H0121620B2
- Authority
- JP
- Japan
- Prior art keywords
- flip
- chip integrated
- integrated circuit
- test
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000012360 testing method Methods 0.000 claims description 55
- 239000011230 binding agent Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 16
- 239000002904 solvent Substances 0.000 claims description 6
- 238000010998 test method Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 239000004416 thermosoftening plastic Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 230000002950 deficient Effects 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000003909 pattern recognition Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58028245A JPS59154035A (ja) | 1983-02-22 | 1983-02-22 | フリツプチツプ集積回路のテスト方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58028245A JPS59154035A (ja) | 1983-02-22 | 1983-02-22 | フリツプチツプ集積回路のテスト方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59154035A JPS59154035A (ja) | 1984-09-03 |
| JPH0121620B2 true JPH0121620B2 (de) | 1989-04-21 |
Family
ID=12243193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58028245A Granted JPS59154035A (ja) | 1983-02-22 | 1983-02-22 | フリツプチツプ集積回路のテスト方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59154035A (de) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3817600C2 (de) * | 1987-05-26 | 1994-06-23 | Matsushita Electric Works Ltd | Verfahren zur Herstellung einer Halbleitervorrichtung mit einem keramischen Substrat und einem integrierten Schaltungskreis |
| JPS6481333A (en) * | 1987-09-24 | 1989-03-27 | Hitachi Ltd | Test board for flip-chip |
| JPH0563029A (ja) * | 1991-09-02 | 1993-03-12 | Fujitsu Ltd | 半導体素子 |
| US5206585A (en) * | 1991-12-02 | 1993-04-27 | At&T Bell Laboratories | Methods for testing integrated circuit devices |
| US5971253A (en) | 1995-07-31 | 1999-10-26 | Tessera, Inc. | Microelectronic component mounting with deformable shell terminals |
| WO1997009740A1 (de) | 1995-09-08 | 1997-03-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und vorrichtung zum testen eines chips |
| US6635514B1 (en) | 1996-12-12 | 2003-10-21 | Tessera, Inc. | Compliant package with conductive elastomeric posts |
| EP1099247B1 (de) | 1998-07-15 | 2004-03-03 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Methode um lötzinn auf eine anordnung zu übertragen und/oder die anordnung zu testen |
| US7159292B2 (en) | 2002-05-27 | 2007-01-09 | Yamaichi Electronics Co., Ltd. | Recovery processing method of an electrode |
| JP2007259833A (ja) * | 2006-03-30 | 2007-10-11 | Tachikawa Heiwa Nouen:Kk | 木製植木鉢 |
-
1983
- 1983-02-22 JP JP58028245A patent/JPS59154035A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59154035A (ja) | 1984-09-03 |
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