GB0021750D0 - Connection method - Google Patents

Connection method

Info

Publication number
GB0021750D0
GB0021750D0 GBGB0021750.5A GB0021750A GB0021750D0 GB 0021750 D0 GB0021750 D0 GB 0021750D0 GB 0021750 A GB0021750 A GB 0021750A GB 0021750 D0 GB0021750 D0 GB 0021750D0
Authority
GB
United Kingdom
Prior art keywords
connection method
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0021750.5A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cambridge Consultants Ltd
Original Assignee
Cambridge Consultants Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cambridge Consultants Ltd filed Critical Cambridge Consultants Ltd
Priority to GBGB0021750.5A priority Critical patent/GB0021750D0/en
Publication of GB0021750D0 publication Critical patent/GB0021750D0/en
Priority to US10/363,457 priority patent/US20040031148A1/en
Priority to JP2002524755A priority patent/JP2004508676A/en
Priority to AU2001282329A priority patent/AU2001282329A1/en
Priority to EP01960942A priority patent/EP1322994A1/en
Priority to PCT/GB2001/003799 priority patent/WO2002021197A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
GBGB0021750.5A 2000-09-04 2000-09-04 Connection method Ceased GB0021750D0 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
GBGB0021750.5A GB0021750D0 (en) 2000-09-04 2000-09-04 Connection method
US10/363,457 US20040031148A1 (en) 2000-09-04 2001-08-22 Connection method
JP2002524755A JP2004508676A (en) 2000-09-04 2001-08-22 Connection method
AU2001282329A AU2001282329A1 (en) 2000-09-04 2001-08-22 Connection method
EP01960942A EP1322994A1 (en) 2000-09-04 2001-08-22 Connection method
PCT/GB2001/003799 WO2002021197A1 (en) 2000-09-04 2001-08-22 Connection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0021750.5A GB0021750D0 (en) 2000-09-04 2000-09-04 Connection method

Publications (1)

Publication Number Publication Date
GB0021750D0 true GB0021750D0 (en) 2000-10-18

Family

ID=9898860

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB0021750.5A Ceased GB0021750D0 (en) 2000-09-04 2000-09-04 Connection method

Country Status (6)

Country Link
US (1) US20040031148A1 (en)
EP (1) EP1322994A1 (en)
JP (1) JP2004508676A (en)
AU (1) AU2001282329A1 (en)
GB (1) GB0021750D0 (en)
WO (1) WO2002021197A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006001885B4 (en) * 2006-01-13 2010-03-04 Siemens Ag Detector module of a detector and use of a hot melt adhesive for the production of a detector module

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4749120A (en) * 1986-12-18 1988-06-07 Matsushita Electric Industrial Co., Ltd. Method of connecting a semiconductor device to a wiring board
JPH01160028A (en) * 1987-12-17 1989-06-22 Matsushita Electric Ind Co Ltd Method of connecting electrode
JPH01206317A (en) * 1988-02-13 1989-08-18 Alps Electric Co Ltd Connecting method for liquid crystal display element and printed board
US5115545A (en) * 1989-03-28 1992-05-26 Matsushita Electric Industrial Co., Ltd. Apparatus for connecting semiconductor devices to wiring boards
JPH04301817A (en) * 1991-03-29 1992-10-26 Rohm Co Ltd Liquid crystal display device and its production
JP3083416B2 (en) * 1992-11-06 2000-09-04 進工業株式会社 Delay line element and method of manufacturing the same
US5518964A (en) * 1994-07-07 1996-05-21 Tessera, Inc. Microelectronic mounting with multiple lead deformation and bonding
JPH09260431A (en) * 1996-03-22 1997-10-03 Nec Corp Connection structure of flip chip mounting

Also Published As

Publication number Publication date
WO2002021197A1 (en) 2002-03-14
EP1322994A1 (en) 2003-07-02
JP2004508676A (en) 2004-03-18
US20040031148A1 (en) 2004-02-19
AU2001282329A1 (en) 2002-03-22

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)