JP7293389B2 - ストレージデバイスおよび制御方法 - Google Patents

ストレージデバイスおよび制御方法 Download PDF

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Publication number
JP7293389B2
JP7293389B2 JP2021555761A JP2021555761A JP7293389B2 JP 7293389 B2 JP7293389 B2 JP 7293389B2 JP 2021555761 A JP2021555761 A JP 2021555761A JP 2021555761 A JP2021555761 A JP 2021555761A JP 7293389 B2 JP7293389 B2 JP 7293389B2
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JP
Japan
Prior art keywords
temperature
storage medium
stage
stocker
storage device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021555761A
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English (en)
Japanese (ja)
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JPWO2021095251A5 (https=
JPWO2021095251A1 (https=
Inventor
康人 吉水
崇 福島
達郎 人見
新 井上
正幸 三浦
伸一 菅野
俊雄 藤澤
圭祐 中塚
朋也 佐貫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kioxia Corp
Original Assignee
Kioxia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JPWO2021095251A1 publication Critical patent/JPWO2021095251A1/ja
Publication of JPWO2021095251A5 publication Critical patent/JPWO2021095251A5/ja
Application granted granted Critical
Publication of JP7293389B2 publication Critical patent/JP7293389B2/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/137—Storage devices mechanical with arrangements or automatic control means for selecting which articles are to be removed
    • B65G1/1373—Storage devices mechanical with arrangements or automatic control means for selecting which articles are to be removed for fulfilling orders in warehouses
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C2029/0403—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals during or with feedback to manufacture
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/04—Arrangements for writing information into, or reading information out from, a digital store with means for avoiding disturbances due to temperature effects

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Test And Diagnosis Of Digital Computers (AREA)
  • Control Of Temperature (AREA)
JP2021555761A 2019-11-15 2019-11-15 ストレージデバイスおよび制御方法 Active JP7293389B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/044931 WO2021095251A1 (ja) 2019-11-15 2019-11-15 ストレージデバイスおよび制御方法

Publications (3)

Publication Number Publication Date
JPWO2021095251A1 JPWO2021095251A1 (https=) 2021-05-20
JPWO2021095251A5 JPWO2021095251A5 (https=) 2022-04-13
JP7293389B2 true JP7293389B2 (ja) 2023-06-19

Family

ID=75912115

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021555761A Active JP7293389B2 (ja) 2019-11-15 2019-11-15 ストレージデバイスおよび制御方法

Country Status (6)

Country Link
US (1) US12384624B2 (https=)
EP (1) EP4060721A4 (https=)
JP (1) JP7293389B2 (https=)
CN (1) CN114424331B (https=)
TW (2) TWI765316B (https=)
WO (1) WO2021095251A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112021007343T5 (de) 2021-03-23 2024-05-02 Kioxia Corporation Speichersystem
CN116393387A (zh) * 2023-04-10 2023-07-07 长鑫存储技术有限公司 探针卡管理装置及管理系统

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005181222A (ja) 2003-12-22 2005-07-07 Renesas Technology Corp 半導体装置の製造方法

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2082354B (en) 1980-08-21 1984-04-11 Burroughs Corp Improvements in or relating to wafer-scale integrated circuits
US6288561B1 (en) * 1988-05-16 2001-09-11 Elm Technology Corporation Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
KR0155158B1 (ko) * 1989-07-25 1998-12-01 카자마 젠쥬 종형 처리 장치 및 처리방법
JP2907971B2 (ja) * 1990-08-14 1999-06-21 株式会社東芝 半導体素子用パターンの形成または試験方法
JP3435410B2 (ja) * 1996-05-09 2003-08-11 東京エレクトロン株式会社 低温試験装置及び低温試験方法
US6063640A (en) 1997-03-18 2000-05-16 Fujitsu Limited Semiconductor wafer testing method with probe pin contact
SG98373A1 (en) * 1998-11-25 2003-09-19 Advantest Corp Device testing apparatus
TW533316B (en) * 1998-12-08 2003-05-21 Advantest Corp Testing device for electronic device
US6499121B1 (en) 1999-03-01 2002-12-24 Formfactor, Inc. Distributed interface for parallel testing of multiple devices using a single tester channel
US6499777B1 (en) * 1999-05-11 2002-12-31 Matrix Integrated Systems, Inc. End-effector with integrated cooling mechanism
DE10343525B4 (de) * 2002-09-27 2011-06-16 Qimonda Ag Verfahren zum Betreiben von Halbleiterbausteinen, Steuervorrichtung für Halbleiterbausteine und Anordnung zum Betreiben von Speicherbausteinen
JP2005228788A (ja) 2004-02-10 2005-08-25 Seiko Epson Corp ウエーハとプローブカードとの位置合わせ方法、プローブ検査方法及びプローブ検査装置
US8084400B2 (en) * 2005-10-11 2011-12-27 Intermolecular, Inc. Methods for discretized processing and process sequence integration of regions of a substrate
JP2006242766A (ja) * 2005-03-03 2006-09-14 Sanyo Electric Co Ltd 品温測定装置
JP2006250579A (ja) * 2005-03-08 2006-09-21 Denso Corp 湿度センサの検査装置及び特性調整方法
KR20060127662A (ko) 2005-06-08 2006-12-13 삼성전자주식회사 반도체 설비의 사이드 스토리지 온도 제어 장치
JP2007096190A (ja) 2005-09-30 2007-04-12 Seiko Epson Corp プローブカードの針先研磨方法、及びプローブ装置
JP2010512584A (ja) 2006-12-06 2010-04-22 フュージョン マルチシステムズ，インク．（ディービイエイ フュージョン−アイオー） 空データトークン指令を有する要求デバイスからのデータを管理する装置、システムおよび方法
JP4917981B2 (ja) 2007-07-10 2012-04-18 東京エレクトロン株式会社 検査方法及び検査方法を記録したプログラム記録媒体
JP5374246B2 (ja) 2009-06-12 2013-12-25 学校法人慶應義塾 密封型半導体記録媒体及び密封型半導体記録装置
JP4480796B1 (ja) * 2009-09-02 2010-06-16 株式会社アドバンテスト 試験装置、試験方法およびプログラム
TWI451106B (zh) * 2012-03-26 2014-09-01 Silicon Motion Inc 晶圓測試系統及其測試方法
JP2013221911A (ja) * 2012-04-19 2013-10-28 Seiko Epson Corp ハンドラー、及び部品検査装置
JP2014052785A (ja) * 2012-09-06 2014-03-20 Toshiba Corp メモリシステム
US20150370245A1 (en) * 2012-12-07 2015-12-24 Hitachi Kokusai Electric Inc. Substrate processing apparatus, substrate processing method, semiconductor device manufacturing method, and control program
JP6205225B2 (ja) * 2013-03-25 2017-09-27 東京エレクトロン株式会社 基板検査装置及び基板温度調整方法
TWI628449B (zh) * 2017-05-05 2018-07-01 漢民科技股份有限公司 晶圓針測裝置主動式預熱及預冷系統及晶圓檢測方法
EP3659055A4 (en) 2017-07-24 2021-04-28 Cerebras Systems Inc. DEVICE AND METHOD FOR MULTI-CHIP CONNECTION
JP6827385B2 (ja) * 2017-08-03 2021-02-10 東京エレクトロン株式会社 検査システム
US10872789B2 (en) 2017-09-28 2020-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer cooling system
US11062886B2 (en) * 2017-11-28 2021-07-13 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for controlling wafer uniformity
JP7181068B2 (ja) * 2018-11-30 2022-11-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7274350B2 (ja) * 2019-05-28 2023-05-16 東京エレクトロン株式会社 搬送システム、検査システム及び検査方法
JP7267111B2 (ja) * 2019-05-31 2023-05-01 東京エレクトロン株式会社 位置決め機構及び位置決め方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005181222A (ja) 2003-12-22 2005-07-07 Renesas Technology Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
TW202230579A (zh) 2022-08-01
CN114424331A (zh) 2022-04-29
TWI800355B (zh) 2023-04-21
EP4060721A1 (en) 2022-09-21
TW202127561A (zh) 2021-07-16
US12384624B2 (en) 2025-08-12
WO2021095251A1 (ja) 2021-05-20
US20220204270A1 (en) 2022-06-30
EP4060721A4 (en) 2023-08-09
CN114424331B (zh) 2025-07-11
TWI765316B (zh) 2022-05-21
JPWO2021095251A1 (https=) 2021-05-20

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