TWI800355B - 儲存器設備及儲存器設備的控制方法 - Google Patents
儲存器設備及儲存器設備的控制方法 Download PDFInfo
- Publication number
- TWI800355B TWI800355B TW111115173A TW111115173A TWI800355B TW I800355 B TWI800355 B TW I800355B TW 111115173 A TW111115173 A TW 111115173A TW 111115173 A TW111115173 A TW 111115173A TW I800355 B TWI800355 B TW I800355B
- Authority
- TW
- Taiwan
- Prior art keywords
- storage device
- control method
- device control
- storage
- control
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
- B65G1/137—Storage devices mechanical with arrangements or automatic control means for selecting which articles are to be removed
- B65G1/1373—Storage devices mechanical with arrangements or automatic control means for selecting which articles are to be removed for fulfilling orders in warehouses
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0458—Details related to environmental aspects, e.g. temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C2029/0403—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals during or with feedback to manufacture
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/04—Arrangements for writing information into, or reading information out from, a digital store with means for avoiding disturbances due to temperature effects
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Control Of Temperature (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2019/044931 WO2021095251A1 (ja) | 2019-11-15 | 2019-11-15 | ストレージデバイスおよび制御方法 |
WOPCT/JP2019/044931 | 2019-11-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202230579A TW202230579A (zh) | 2022-08-01 |
TWI800355B true TWI800355B (zh) | 2023-04-21 |
Family
ID=75912115
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111115173A TWI800355B (zh) | 2019-11-15 | 2020-08-12 | 儲存器設備及儲存器設備的控制方法 |
TW109127283A TWI765316B (zh) | 2019-11-15 | 2020-08-12 | 儲存器設備及儲存器設備的控制方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109127283A TWI765316B (zh) | 2019-11-15 | 2020-08-12 | 儲存器設備及儲存器設備的控制方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220204270A1 (zh) |
EP (1) | EP4060721A4 (zh) |
JP (1) | JP7293389B2 (zh) |
CN (1) | CN114424331A (zh) |
TW (2) | TWI800355B (zh) |
WO (1) | WO2021095251A1 (zh) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040222809A1 (en) * | 1988-05-16 | 2004-11-11 | Glenn Leedy | System for probing, testing, burn-in, repairing and programming of integrated circuits |
US20130250709A1 (en) * | 2012-03-26 | 2013-09-26 | Silicon Motion, Inc. | Testing system and testing method thereof |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3435410B2 (ja) * | 1996-05-09 | 2003-08-11 | 東京エレクトロン株式会社 | 低温試験装置及び低温試験方法 |
US6063640A (en) | 1997-03-18 | 2000-05-16 | Fujitsu Limited | Semiconductor wafer testing method with probe pin contact |
US6499121B1 (en) | 1999-03-01 | 2002-12-24 | Formfactor, Inc. | Distributed interface for parallel testing of multiple devices using a single tester channel |
US6499777B1 (en) * | 1999-05-11 | 2002-12-31 | Matrix Integrated Systems, Inc. | End-effector with integrated cooling mechanism |
JP2005181222A (ja) * | 2003-12-22 | 2005-07-07 | Renesas Technology Corp | 半導体装置の製造方法 |
US8084400B2 (en) * | 2005-10-11 | 2011-12-27 | Intermolecular, Inc. | Methods for discretized processing and process sequence integration of regions of a substrate |
JP2006250579A (ja) * | 2005-03-08 | 2006-09-21 | Denso Corp | 湿度センサの検査装置及び特性調整方法 |
DE112009005202T5 (de) * | 2009-09-02 | 2012-07-19 | Advantest Corporation | Prüfvorrichtung, Prüfverfahren und Prog ramm |
JP2013221911A (ja) * | 2012-04-19 | 2013-10-28 | Seiko Epson Corp | ハンドラー、及び部品検査装置 |
TWI628449B (zh) * | 2017-05-05 | 2018-07-01 | 漢民科技股份有限公司 | 晶圓針測裝置主動式預熱及預冷系統及晶圓檢測方法 |
JP6827385B2 (ja) * | 2017-08-03 | 2021-02-10 | 東京エレクトロン株式会社 | 検査システム |
US11062886B2 (en) * | 2017-11-28 | 2021-07-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for controlling wafer uniformity |
-
2019
- 2019-11-15 WO PCT/JP2019/044931 patent/WO2021095251A1/ja unknown
- 2019-11-15 CN CN201980100500.3A patent/CN114424331A/zh active Pending
- 2019-11-15 JP JP2021555761A patent/JP7293389B2/ja active Active
- 2019-11-15 EP EP19952453.9A patent/EP4060721A4/en active Pending
-
2020
- 2020-08-12 TW TW111115173A patent/TWI800355B/zh active
- 2020-08-12 TW TW109127283A patent/TWI765316B/zh active
-
2022
- 2022-03-14 US US17/694,532 patent/US20220204270A1/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040222809A1 (en) * | 1988-05-16 | 2004-11-11 | Glenn Leedy | System for probing, testing, burn-in, repairing and programming of integrated circuits |
US20130250709A1 (en) * | 2012-03-26 | 2013-09-26 | Silicon Motion, Inc. | Testing system and testing method thereof |
Also Published As
Publication number | Publication date |
---|---|
TW202127561A (zh) | 2021-07-16 |
TWI765316B (zh) | 2022-05-21 |
TW202230579A (zh) | 2022-08-01 |
EP4060721A4 (en) | 2023-08-09 |
US20220204270A1 (en) | 2022-06-30 |
CN114424331A (zh) | 2022-04-29 |
JPWO2021095251A1 (zh) | 2021-05-20 |
JP7293389B2 (ja) | 2023-06-19 |
WO2021095251A1 (ja) | 2021-05-20 |
EP4060721A1 (en) | 2022-09-21 |
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