TWI765316B - 儲存器設備及儲存器設備的控制方法 - Google Patents

儲存器設備及儲存器設備的控制方法 Download PDF

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Publication number
TWI765316B
TWI765316B TW109127283A TW109127283A TWI765316B TW I765316 B TWI765316 B TW I765316B TW 109127283 A TW109127283 A TW 109127283A TW 109127283 A TW109127283 A TW 109127283A TW I765316 B TWI765316 B TW I765316B
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TW
Taiwan
Prior art keywords
temperature
semiconductor wafer
prober
storage device
temperature control
Prior art date
Application number
TW109127283A
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English (en)
Chinese (zh)
Other versions
TW202127561A (zh
Inventor
吉水康人
福島崇
人見達郎
井上新
三浦正幸
菅野伸一
藤澤俊雄
中圭祐
佐貫朋也
Original Assignee
日商鎧俠股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商鎧俠股份有限公司 filed Critical 日商鎧俠股份有限公司
Publication of TW202127561A publication Critical patent/TW202127561A/zh
Application granted granted Critical
Publication of TWI765316B publication Critical patent/TWI765316B/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/137—Storage devices mechanical with arrangements or automatic control means for selecting which articles are to be removed
    • B65G1/1373—Storage devices mechanical with arrangements or automatic control means for selecting which articles are to be removed for fulfilling orders in warehouses
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C2029/0403—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals during or with feedback to manufacture
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/04—Arrangements for writing information into, or reading information out from, a digital store with means for avoiding disturbances due to temperature effects

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Test And Diagnosis Of Digital Computers (AREA)
  • Control Of Temperature (AREA)
TW109127283A 2019-11-15 2020-08-12 儲存器設備及儲存器設備的控制方法 TWI765316B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2019/044931 2019-11-15
PCT/JP2019/044931 WO2021095251A1 (ja) 2019-11-15 2019-11-15 ストレージデバイスおよび制御方法

Publications (2)

Publication Number Publication Date
TW202127561A TW202127561A (zh) 2021-07-16
TWI765316B true TWI765316B (zh) 2022-05-21

Family

ID=75912115

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109127283A TWI765316B (zh) 2019-11-15 2020-08-12 儲存器設備及儲存器設備的控制方法
TW111115173A TWI800355B (zh) 2019-11-15 2020-08-12 儲存器設備及儲存器設備的控制方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW111115173A TWI800355B (zh) 2019-11-15 2020-08-12 儲存器設備及儲存器設備的控制方法

Country Status (6)

Country Link
US (1) US12384624B2 (https=)
EP (1) EP4060721A4 (https=)
JP (1) JP7293389B2 (https=)
CN (1) CN114424331B (https=)
TW (2) TWI765316B (https=)
WO (1) WO2021095251A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112021007343T5 (de) 2021-03-23 2024-05-02 Kioxia Corporation Speichersystem
CN116393387A (zh) * 2023-04-10 2023-07-07 长鑫存储技术有限公司 探针卡管理装置及管理系统

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TW201926504A (zh) * 2017-11-28 2019-07-01 台灣積體電路製造股份有限公司 用於控制晶圓均勻性的設備

Also Published As

Publication number Publication date
TW202230579A (zh) 2022-08-01
CN114424331A (zh) 2022-04-29
TWI800355B (zh) 2023-04-21
EP4060721A1 (en) 2022-09-21
TW202127561A (zh) 2021-07-16
US12384624B2 (en) 2025-08-12
JP7293389B2 (ja) 2023-06-19
WO2021095251A1 (ja) 2021-05-20
US20220204270A1 (en) 2022-06-30
EP4060721A4 (en) 2023-08-09
CN114424331B (zh) 2025-07-11
JPWO2021095251A1 (https=) 2021-05-20

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