JPWO2021095251A1 - - Google Patents

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Publication number
JPWO2021095251A1
JPWO2021095251A1 JP2021555761A JP2021555761A JPWO2021095251A1 JP WO2021095251 A1 JPWO2021095251 A1 JP WO2021095251A1 JP 2021555761 A JP2021555761 A JP 2021555761A JP 2021555761 A JP2021555761 A JP 2021555761A JP WO2021095251 A1 JPWO2021095251 A1 JP WO2021095251A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021555761A
Other languages
Japanese (ja)
Other versions
JP7293389B2 (ja
JPWO2021095251A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021095251A1 publication Critical patent/JPWO2021095251A1/ja
Publication of JPWO2021095251A5 publication Critical patent/JPWO2021095251A5/ja
Application granted granted Critical
Publication of JP7293389B2 publication Critical patent/JP7293389B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/137—Storage devices mechanical with arrangements or automatic control means for selecting which articles are to be removed
    • B65G1/1373—Storage devices mechanical with arrangements or automatic control means for selecting which articles are to be removed for fulfilling orders in warehouses
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C2029/0403—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals during or with feedback to manufacture
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/04—Arrangements for writing information into, or reading information out from, a digital store with means for avoiding disturbances due to temperature effects

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Test And Diagnosis Of Digital Computers (AREA)
  • Control Of Temperature (AREA)
JP2021555761A 2019-11-15 2019-11-15 ストレージデバイスおよび制御方法 Active JP7293389B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/044931 WO2021095251A1 (ja) 2019-11-15 2019-11-15 ストレージデバイスおよび制御方法

Publications (3)

Publication Number Publication Date
JPWO2021095251A1 true JPWO2021095251A1 (https=) 2021-05-20
JPWO2021095251A5 JPWO2021095251A5 (https=) 2022-04-13
JP7293389B2 JP7293389B2 (ja) 2023-06-19

Family

ID=75912115

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021555761A Active JP7293389B2 (ja) 2019-11-15 2019-11-15 ストレージデバイスおよび制御方法

Country Status (6)

Country Link
US (1) US12384624B2 (https=)
EP (1) EP4060721A4 (https=)
JP (1) JP7293389B2 (https=)
CN (1) CN114424331B (https=)
TW (2) TWI765316B (https=)
WO (1) WO2021095251A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112021007343T5 (de) 2021-03-23 2024-05-02 Kioxia Corporation Speichersystem
CN116393387A (zh) * 2023-04-10 2023-07-07 长鑫存储技术有限公司 探针卡管理装置及管理系统

Citations (3)

* Cited by examiner, † Cited by third party
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US6499777B1 (en) * 1999-05-11 2002-12-31 Matrix Integrated Systems, Inc. End-effector with integrated cooling mechanism
JP2005181222A (ja) * 2003-12-22 2005-07-07 Renesas Technology Corp 半導体装置の製造方法
US9159451B2 (en) * 2012-03-26 2015-10-13 Silicon Motion, Inc. Testing system and testing method thereof

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GB2082354B (en) 1980-08-21 1984-04-11 Burroughs Corp Improvements in or relating to wafer-scale integrated circuits
US6288561B1 (en) * 1988-05-16 2001-09-11 Elm Technology Corporation Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
KR0155158B1 (ko) * 1989-07-25 1998-12-01 카자마 젠쥬 종형 처리 장치 및 처리방법
JP2907971B2 (ja) * 1990-08-14 1999-06-21 株式会社東芝 半導体素子用パターンの形成または試験方法
JP3435410B2 (ja) * 1996-05-09 2003-08-11 東京エレクトロン株式会社 低温試験装置及び低温試験方法
US6063640A (en) 1997-03-18 2000-05-16 Fujitsu Limited Semiconductor wafer testing method with probe pin contact
SG98373A1 (en) * 1998-11-25 2003-09-19 Advantest Corp Device testing apparatus
TW533316B (en) * 1998-12-08 2003-05-21 Advantest Corp Testing device for electronic device
US6499121B1 (en) 1999-03-01 2002-12-24 Formfactor, Inc. Distributed interface for parallel testing of multiple devices using a single tester channel
DE10343525B4 (de) * 2002-09-27 2011-06-16 Qimonda Ag Verfahren zum Betreiben von Halbleiterbausteinen, Steuervorrichtung für Halbleiterbausteine und Anordnung zum Betreiben von Speicherbausteinen
JP2005228788A (ja) 2004-02-10 2005-08-25 Seiko Epson Corp ウエーハとプローブカードとの位置合わせ方法、プローブ検査方法及びプローブ検査装置
US8084400B2 (en) * 2005-10-11 2011-12-27 Intermolecular, Inc. Methods for discretized processing and process sequence integration of regions of a substrate
JP2006242766A (ja) * 2005-03-03 2006-09-14 Sanyo Electric Co Ltd 品温測定装置
JP2006250579A (ja) * 2005-03-08 2006-09-21 Denso Corp 湿度センサの検査装置及び特性調整方法
KR20060127662A (ko) 2005-06-08 2006-12-13 삼성전자주식회사 반도체 설비의 사이드 스토리지 온도 제어 장치
JP2007096190A (ja) 2005-09-30 2007-04-12 Seiko Epson Corp プローブカードの針先研磨方法、及びプローブ装置
JP2010512584A (ja) 2006-12-06 2010-04-22 フュージョン マルチシステムズ，インク．（ディービイエイ フュージョン−アイオー） 空データトークン指令を有する要求デバイスからのデータを管理する装置、システムおよび方法
JP4917981B2 (ja) 2007-07-10 2012-04-18 東京エレクトロン株式会社 検査方法及び検査方法を記録したプログラム記録媒体
JP5374246B2 (ja) 2009-06-12 2013-12-25 学校法人慶應義塾 密封型半導体記録媒体及び密封型半導体記録装置
JP4480796B1 (ja) * 2009-09-02 2010-06-16 株式会社アドバンテスト 試験装置、試験方法およびプログラム
JP2013221911A (ja) * 2012-04-19 2013-10-28 Seiko Epson Corp ハンドラー、及び部品検査装置
JP2014052785A (ja) * 2012-09-06 2014-03-20 Toshiba Corp メモリシステム
US20150370245A1 (en) * 2012-12-07 2015-12-24 Hitachi Kokusai Electric Inc. Substrate processing apparatus, substrate processing method, semiconductor device manufacturing method, and control program
JP6205225B2 (ja) * 2013-03-25 2017-09-27 東京エレクトロン株式会社 基板検査装置及び基板温度調整方法
TWI628449B (zh) * 2017-05-05 2018-07-01 漢民科技股份有限公司 晶圓針測裝置主動式預熱及預冷系統及晶圓檢測方法
EP3659055A4 (en) 2017-07-24 2021-04-28 Cerebras Systems Inc. DEVICE AND METHOD FOR MULTI-CHIP CONNECTION
JP6827385B2 (ja) * 2017-08-03 2021-02-10 東京エレクトロン株式会社 検査システム
US10872789B2 (en) 2017-09-28 2020-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer cooling system
US11062886B2 (en) * 2017-11-28 2021-07-13 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for controlling wafer uniformity
JP7181068B2 (ja) * 2018-11-30 2022-11-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7274350B2 (ja) * 2019-05-28 2023-05-16 東京エレクトロン株式会社 搬送システム、検査システム及び検査方法
JP7267111B2 (ja) * 2019-05-31 2023-05-01 東京エレクトロン株式会社 位置決め機構及び位置決め方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6499777B1 (en) * 1999-05-11 2002-12-31 Matrix Integrated Systems, Inc. End-effector with integrated cooling mechanism
JP2005181222A (ja) * 2003-12-22 2005-07-07 Renesas Technology Corp 半導体装置の製造方法
US9159451B2 (en) * 2012-03-26 2015-10-13 Silicon Motion, Inc. Testing system and testing method thereof

Also Published As

Publication number Publication date
TW202230579A (zh) 2022-08-01
CN114424331A (zh) 2022-04-29
TWI800355B (zh) 2023-04-21
EP4060721A1 (en) 2022-09-21
TW202127561A (zh) 2021-07-16
US12384624B2 (en) 2025-08-12
JP7293389B2 (ja) 2023-06-19
WO2021095251A1 (ja) 2021-05-20
US20220204270A1 (en) 2022-06-30
EP4060721A4 (en) 2023-08-09
CN114424331B (zh) 2025-07-11
TWI765316B (zh) 2022-05-21

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